MPC8313VRAFF - 333MHz PowerPC e300c3 MPU | NXP | Networking
Référence : MPC8313VRAFF ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.65 | $436,50 |
| 100 | $38.8 | $3 880,00 |
| 500 | $34.2 | $17 100,00 |
| 1 000 | $29.95 | $29 950,00 |
MPC8313VRAFF Présentation
A PowerQUICC II Pro MPU is a PowerPC-based microprocessor optimized for embedded networking and communications. It belongs to the broader taxonomy: microprocessor (MPU) -> processor -> integrated circuit -> semiconductor. PowerQUICC II Pro derivatives integrate communication peripherals and memory controllers, reducing bill of materials in routers, gateways, and industrial control platforms.
Key features of the MPC8313VRAFF include a 333MHz core clock, 32-bit PowerPC e300c3 architecture, integrated DDR memory controller, dual 10/100/1000 Ethernet MACs, USB 2.0 host/device, local bus, PCI express, and security engines. The 516-TEPBGA package provides robust thermal dissipation suitable for industrial networking designs with sustained computational load.
The architecture combines a high-performance e300c3 core with the QUICC Engine subsystem, which offloads packet processing tasks from the core. This heterogeneous design allows line-rate handling of common networking protocols while leaving headroom for application-level processing.
Typical applications cover industrial routers, secure gateways, network attached storage (NAS), VoIP platforms, and print/imaging controllers. The part targets cost-sensitive embedded networking that still requires deterministic protocol handling.
When designing with this device, validate the DDR2 memory topology against the MPC8313 reference manual and ensure thermal management on the exposed pad. Production designs should verify current supply against the latest NXP hardware specifications document, as revisions can affect power sequencing.
This page synthesizes distributor inventory, drop-in alternative analysis, and engineering design notes not aggregated in the manufacturer hardware specification document.
Alternatives de remplacement direct pour MPC8313VRAFF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8313VRAFFC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313EVRAGD
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8313CVRAFFC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313VRAFF Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro / MPC83xx |
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 Core, 32-Bit |
| Core Speed | 333 MHz |
| Core Voltage | 0.95 V to 1.05 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Boîtier | 516-TEPBGA (27x27 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +105C (industrial grade) |
| Encryption | No (non-E variant) |
| DDR Memory Controller | DDR/DDR2 |
| Ethernet | Dual 10/100/1000 MAC |
| USB | USB 2.0 Host/Device |
| PCI | PCI Express interface |
| Process Technology | 0.09 um CMOS |
| Packaging | Tray |
| Lead-Free Status | Lead-Free (per datasheet) |
Guide de configuration des broches du MPC8313VRAFF 516-tepbga (27x27 mm) with exposed pad
Configuration des broches du MPC8313VRAFF (boîtier 516-tepbga (27x27 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8313VRAFF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8313VRAFF convient pour 6 applications: Industrial Network Router, Secure VPN Gateway, Network Attached Storage (NAS) Controller, VoIP Platform, Industrial Print and Imaging Controller, Communication Gateway.
Industrial Network Router
The MPC8313VRAFF's PowerPC e300c3 core at 333MHz combined with the integrated QUICC Engine makes it well suited for industrial router designs. Its dual Gigabit Ethernet MACs deliver line-rate forwarding across multiple ports, while the DDR2 memory controller supports routing table storage and packet buffering in production builds. The 516-TEPBGA package provides robust thermal dissipation for fanless industrial enclosures. The non-encrypted variant is sufficient when IPsec or SSL/TLS offload is handled by an external security coprocessor.
Recommandé
Secure VPN Gateway
For VPN gateway applications requiring cryptographic acceleration, the MPC8313EVRAGD variant of the MPC8313 family integrates SEC 3.0 hardware that offloads IPsec and SSL/TLS processing. The 333MHz e300c3 core manages control-plane tasks while the encryption engine handles line-rate AES and 3DES tunnels. The 516-TEPBGA exposed pad enables fanless industrial mounting. Designers targeting the MPC8313VRAFF should verify whether the non-E variant meets security throughput requirements before substitution.
Recommandé
Network Attached Storage (NAS) Controller
The MPC8313VRAFF's combination of dual Gigabit Ethernet, PCI Express, and local bus interfaces enables its use as a NAS controller for small-to-medium business storage appliances. The DDR2 controller supports the memory footprint required for filesystem caching, while the integrated USB 2.0 provides front-panel connectivity. Production NAS designs often pair this processor with a SATA controller over PCI Express. The 333MHz clock provides adequate headroom for RAID management and SMB/CIFS protocol handling at multi-client load.
Recommandé
VoIP Platform
The MPC8313VRAFF suits VoIP platform designs with its deterministic packet processing through the QUICC Engine subsystem and dual Ethernet interfaces for WAN/LAN separation. The PowerPC e300c3 core runs the SIP/RTP control stack while the QUICC Engine handles media stream acceleration. The 516-TEPBGA package footprint is shared across multiple PowerQUICC II Pro derivatives, simplifying multi-variant SKU management. Designers should validate DSP resource availability for voice codec processing under concurrent load.
Recommandé
Industrial Print and Imaging Controller
The MPC8313VRAFF provides the computational resources required for industrial print and imaging controller boards where USB 2.0 host, PCI Express, and local bus connectivity to image sensor ASICs are required. The 333MHz core drives raster image processing while the DDR2 memory bandwidth handles frame buffer operations. Industrial print platforms benefit from the extended temperature operation of the TEPBGA package. Migration paths should consider the MPC8308 for lower power designs.
Recommandé
Communication Gateway
The MPC8313VRAFF is widely deployed in industrial communication gateways that bridge fieldbus protocols to Ethernet backbones. Its integrated QUICC Engine supports legacy serial protocols alongside the modern Ethernet interfaces. The 516-TEPBGA package footprint accommodates thermal management for sustained gateway operation in factory automation environments. Production designs should verify DDR2 memory compatibility with the controller per NXP hardware specification guidelines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313VRAFF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313VRAFFC | MPC8313EVRAGD | MPC8313CVRAFFC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Core Processor | PowerPC e300c3 | PowerPC e300c3 - same | PowerPC e300c3 - same | PowerPC e300c3 - same |
| Core Clock | 333 MHz | 333 MHz - same | 333 MHz - same | 333 MHz - same |
| Encryption | No | No | Yes (SEC 3.0) | No |
| Operating Temperature | 0C to +105C (industrial) | 0C to +105C - same | 0C to +105C - same | -40C to +105C (extended) |
| Pin Count | 516 balls | 516 balls - same | 516 balls - same | 516 balls - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same 516-TEPBGA package footprint as E-variant for design reuse (vs MPC8313EVRAGD)
- Same industrial temperature range as standard variant (vs MPC8313CVRAFFC)
- Established NXP PowerQUICC II Pro platform (vs MPC8308VMAGD)
Notes de conception
The 516-TEPBGA package of the MPC8313VRAFF exposes a thermal pad that must be soldered to a PCB thermal land. Use an array of thermal vias (typically 0.3 mm pitch, 0.5 mm drill) connecting the land to internal ground planes for heat spreading. At full 333MHz load with QUICC Engine active, junction temperature can approach the 105C limit if the thermal land is omitted. Follow the layout pattern in the NXP hardware specification document section on thermal management.
DDR2 memory routing must follow the NXP hardware specification document guidelines for length matching and impedance control. The DDR2 controller is sensitive to clock-to-DQS skew; target within 25 ps for reliable operation at full bus speed. Use 100 ohm differential impedance for clock pairs and 50 ohm single-ended for address/control signals. Place VTT termination resistors within 200 mils of the DDR2 device pins per JEDEC recommendations.
The MPC8313VRAFF requires three independent voltage rails: core voltage (0.95V to 1.05V), DDR I/O voltage (1.8V for DDR2), and standard I/O voltage (3.3V or 2.5V). Sequence the core voltage first, then DDR I/O, then standard I/O per the hardware specification document. Use a power management IC with monotonic startup to prevent latch-up. Decouple each voltage rail with 0.1 uF and 10 uF ceramic capacitors placed as close as possible to the respective supply balls.
The MPC8313VRAFF exposed thermal pad must not be left floating; it must be soldered to the PCB thermal land. Floating thermal pad causes severe thermal runaway under load and is a common factory rework failure. Also verify the DDR memory device is JEDEC-compliant DDR2 - the controller does not support DDR3 or LPDDR. The QUICC Engine reset configuration is loaded from external pins at POR; document these straps carefully for board bring-up.
Informations de conformité
Lead-Free status confirmed per datasheet. RoHS, REACH, halogen-free, and conflict minerals compliance require verification from current distributor listing as this part is obsolete and pre-dates the latest compliance documentation standards.
