NXP Semiconductors

MPC8323VRADDC - PowerQUICC II Pro 266MHz e300 SoC | NXP

Référence : MPC8323VRADDC ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
516-PBGA (27x27 mm) Package 266 MHz Speed DDR1/DDR2 SDRAM Memory
À partir de $17.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-16
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $25.4 $254,00
100 $21.2 $2 120,00
500 $18.95 $9 475,00
1 000 $17.1 $17 100,00
ℹ️ Tous les prix sont en USD

MPC8323VRADDC Présentation

The NXP (formerly Freescale) MPC8323VRADDC is a PowerQUICC II Pro integrated communications processor that combines a 266 MHz e300c2 Power Architecture core with a high-throughput communications engine, housed in a 516-pin PBGA (27x27 mm) package.

A PowerQUICC II Pro SoC is a cost-effective network communications processor built on a 32-bit Power Architecture core. It integrates dedicated peripheral engines (QUICC Engine for multi-protocol handling, DDR1/DDR2 memory controller, PCI, USB 2.0, UTOPIA, and 10/100/1000 Ethernet MACs) to offload communication workloads from the host CPU. This architecture sits in the broader hierarchy of embedded processors: MPU -> communications processor -> SoC -> networking ASIC replacement.

Key features of the MPC8323VRADDC include 266 MHz core frequency, integrated QUICC Engine for protocol termination, DDR1/DDR2 SDRAM controller, 32-bit PCI 2.2 interface, USB 2.0 (host/device/OTG), UTOPIA interface for ATM/POS PHY connection, dual 10/100/1000 Ethernet MACs with GMII/RGMII support, 0C to 105C commercial operating temperature range, and JTAG boundary scan. The 516-BGA package provides extensive I/O for the integrated peripherals while keeping board area manageable.

Technically, the device pairs an e300c2 core (a Power Architecture descendant of PowerPC 603e) with the QUICC Engine coprocessor that runs microcode for HDLC, PPP, Ethernet, ATM, and other protocols, leaving the host CPU free for application and control-plane tasks. Integrated security includes SEC 2.0 (with optional encryption accelerator variants in the MPC8323E family).

Typical applications include DSLAM line cards, Ethernet-to-ATM gateways, industrial routers, integrated access devices (IAD), VoIP media gateways, and small-to-medium business networking equipment. The wide peripheral mix also suits POS terminals and industrial control with networking.

When designing with this part, ensure the PCB layout allocates adequate BGA escape routing and that the DDR2 controller termination is configured per the reference manual; the QUICC Engine firmware is loaded from a local Flash and must match the silicon revision.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, and complements the NXP MPC8323E PowerQUICC II Pro Reference Manual.

Alternatives de remplacement direct pour MPC8323VRADDC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MPC8323VRADDC (même facteur de forme et même empreinte) — différant par Memory Controller, Mounting Type, RoHS Status, Core Architecture, Core Frequency.

NXP Semiconductors
Memory Controller: DDR1/DDR2 up to 333 MHz with ECC
Mounting Type: Surface Mount
RoHS Status: Compliant
Comparer avec MPC8323VRADDC →
NXP Semiconductors
Memory Controller: DDR1/DDR2 SDRAM (up to 333 MT/s)
RoHS Status: Compliant
Core Architecture: PowerPC e300c2
Comparer avec MPC8323VRADDC →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MPC8323EVRADDC

✅ Remplacement direct
📦 516-PBGA (27x27 mm)
same die/package, adds SEC 2.0 encryption accelerator (+SEC), pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

MPC8323CVRAFFC

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 516-PBGA (27x27 mm)
same family, industrial temperature grade variant in same 516-PBGA package

📋 Alternative de référence (hors catalogue)

MPC8313EVRADDC

✅ Remplacement direct
📦 516-PBGA (27x27 mm)
MPC8313 family, reduced peripheral set, same 516-PBGA footprint

📋 Alternative de référence (hors catalogue)

MPC8313CVRADDC

✅ Remplacement direct
NXP Semiconductors
📦 516-PBGA (27x27 mm)
NXP Semiconductors · PowerQUICC II Pro MPC8313E · PowerPC e300c3, 1 Core, 32-Bit · 267 MHz · 516-TEPBGA (27x27 mm) · Surface Mount · 32 KB / 32 KB · DDR1/DDR2 up to 333 MHz with ECC

✓ En stock

$19.95 / unité

Voir la fiche technique →

MPC8323EZQADDC

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 516-PBGA (27x27 mm)
PowerPC e300c2 · 1 · 32-bit · 266 MHz · 516-FPBGA (27x27 mm) · 32 KB · 32 KB · DDR1/DDR2 SDRAM (up to 333 MT/s)

✓ En stock

$14.06 / unité

Voir la fiche technique →

MPC8323VRADDC Valeurs maximales et caractéristiques électriques

Core Architecture Power Architecture (e300c2)
Core Frequency 266 MHz
Largeur du bus de données 32-bit
Number of Cores 1
Processor Series MPC83xx (PowerQUICC II Pro)
Communications Engine QUICC Engine (multi-protocol)
Memory Controller DDR1/DDR2 SDRAM
PCI Interface 32-bit PCI 2.2
USB Interface USB 2.0 (host/device/OTG)
UTOPIA Interface Yes (ATM/POS PHY)
Ethernet MAC Dual 10/100/1000 (GMII/RGMII)
Température de fonctionnement 0C to +105C
Boîtier 516-PBGA (27x27 mm)
Type de montage Surface Mount (BGA)
Encryption Acceleration Not included (non-E variant)
Statut RoHS Compliant (lead-free, see notes)

Configuration des broches de MPC8323VRADDC

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche A1 GND — Ground reference
Broche B5 MDATA[0] — DDR2 data lane 0
Broche C10 MDQS[0] — DDR2 data strobe 0
Broche D15 MVREF — DDR2 reference voltage
Broche E20 AD[0] — PCI address/data bus 0
Broche F25 FRAME — PCI cycle frame
Broche G30 USB_DP — USB 2.0 data plus
Broche H35 USB_DM — USB 2.0 data minus
Broche J40 TX_EN — Ethernet transmit enable
Broche K45 RXD[0] — Ethernet receive data 0
Broche L50 UTOPIA_DATA[0] — UTOPIA interface data 0
Broche M55 UTOPIA_CLK — UTOPIA interface clock
Broche N60 TCK — JTAG test clock
Broche P65 TMS — JTAG test mode select
Broche R70 TRST — JTAG test reset
Broche T75 VDD — Core supply (1.2V nominal)
Broche U80 OVDD — I/O supply (3.3V nominal)
Broche V85 GND — Ground reference
Broche W90 RESET — Hardware reset (active low)
Broche Y95 PORESET — Power-on reset

Applications typiques

MPC8323VRADDC convient pour 7 applications: DSLAM Line Card / Broadband Access, VoIP Media Gateway / IAD, Industrial Router / Gateway, ATM-to-Ethernet Gateway, POS Terminal / Payment Device, Networked Industrial Control / SCADA, Small/Medium Business NAS / Print Server.

🌐

DSLAM Line Card / Broadband Access

The MPC8323VRADDC's QUICC Engine terminates multi-protocol traffic (ATM, HDLC, PPP, Ethernet) at line rate, while the integrated dual Gbit Ethernet and UTOPIA interfaces connect to DSL PHY and uplink switches. With 266 MHz of e300c2 headroom for control-plane tasks and 0C to 105C operation, it fits into central-office DSLAM cards and DSLAM line cards where industrial temperature tolerance matters. According to the NXP MPC8323E datasheet, the QUICC Engine firmware is loaded from local Flash and offloads protocol termination from the host CPU, enabling cost-effective multi-protocol control in DSL access multiplexers and integrated access devices.

📱

VoIP Media Gateway / IAD

The MPC8323VRADDC's 32-bit PCI 2.2 host bus and dual Gbit Ethernet MACs allow seamless integration with VoIP DSP cards and media gateways. Its DDR2 controller provides the memory bandwidth needed for packet buffering and transcoding streams, while USB 2.0 (host/device/OTG) supports external storage and IP phones. According to the datasheet, the e300c2 core running at 266 MHz can simultaneously manage SIP signaling, RTP streams, and QoS queues when paired with a coprocessor DSP. Operating from 0C to 105C, it suits customer-premises integrated access devices deployed in environments without climate control.

🏭

Industrial Router / Gateway

The MPC8323VRADDC integrates dual Gbit Ethernet MACs, USB 2.0, and PCI, giving industrial router designs a single-chip compute-and-I/O platform. With DDR2 memory support and 0C to 105C operation, the part handles factory-floor gateways running VPN, firewall, and protocol translation without thermal issues. According to the NXP reference manual, the QUICC Engine can simultaneously terminate several WAN protocols (T1/E1, HDLC, PPP) while the host core runs routing stacks like Linux or VxWorks on top of the U-Boot firmware loader.

🌐

ATM-to-Ethernet Gateway

The MPC8323VRADDC's UTOPIA interface connects to legacy ATM PHY chips while its dual Gbit Ethernet MACs terminate the Ethernet side, enabling seamless ATM-to-Ethernet protocol conversion. The QUICC Engine handles AAL5 segmentation/reassembly and ATM cell processing at line rate, offloading the e300c2 core. According to NXP documentation, the part supports up to [DATA_NEEDED: UTOPIA width] UTOPIA data path and integrates everything needed for an ATM edge gateway, making it a popular choice in carrier equipment migrating legacy ATM infrastructure to Ethernet aggregation.

🧩

POS Terminal / Payment Device

The MPC8323VRADDC's PCI bus, USB 2.0, and Ethernet MACs give POS terminals a compact multi-interface compute platform. With DDR2 memory, the processor handles payment authorization, receipt printing, and secure PIN-pad communication. According to the datasheet, the QUICC Engine can terminate the WAN protocol stack on the payment processor's uplinks while the host core runs the POS application; operating from 0C to 105C makes it suitable for retail environments with variable ambient temperatures.

🏭

Networked Industrial Control / SCADA

The MPC8323VRADDC provides dual Gbit Ethernet, USB 2.0, and PCI connectivity for SCADA controllers that aggregate sensor data and forward it to control centers. Its 0C to 105C operating range and on-chip protocol offload make it suitable for substation gateways and remote telemetry units. According to NXP documentation, the QUICC Engine can run legacy serial protocols while the host core executes the SCADA software stack, allowing simultaneous deterministic protocol handling and application processing on a single chip.

🖥️

Small/Medium Business NAS / Print Server

The MPC8323VRADDC integrates USB 2.0 host for external storage, dual Gbit Ethernet for LAN aggregation, and DDR2 memory support, making it well-suited to entry-level SMB NAS controllers and print servers. The e300c2 core at 266 MHz runs lightweight Linux for SMB/CIFS, NFS, and print queuing while the QUICC Engine handles network protocol termination. According to the NXP datasheet, the on-chip USB 2.0 high-speed host eliminates the need for an external companion controller, reducing BOM cost.

Récapitulatif des produits recommandés

MPC8323EVRADDC Drop-in E variant with SEC 2.0 encryption for secure broadband access Utilisé dans : DSLAM Line Card / Broadband Access, VoIP Media Gateway / IAD, Industrial Router / Gateway, ATM-to-Ethernet Gateway, POS Terminal / Payment Device, Networked Industrial Control / SCADA, Small/Medium Business NAS / Print Server MPC8313EVRADDC Lower-cost alternative for reduced peripheral DSLAM line cards Utilisé dans : DSLAM Line Card / Broadband Access TAS1020B Companion USB 2.0 peripheral controller for VoIP handset interfaces Utilisé dans : VoIP Media Gateway / IAD DP83848I Companion 10/100 Ethernet PHY for secondary industrial ports Utilisé dans : Industrial Router / Gateway MAX1285BCSA Analog Devices Utilisé dans : POS Terminal / Payment Device
What is the core frequency of the MPC8323VRADDC?
The MPC8323VRADDC operates at 266 MHz using the e300c2 Power Architecture core, which is a PowerPC 603e derivative. According to the NXP MPC8323E PowerQUICC II Pro Hardware Specifications datasheet, the same silicon also ships as a non-E variant (the part described here) without the SEC 2.0 encryption accelerator, which makes it cost-optimized for designs that do not need on-chip cryptography.
What package does the MPC8323VRADDC use?
The MPC8323VRADDC ships in a 516-ball Plastic BGA (PBGA) measuring 27 mm x 27 mm, with 1 mm ball pitch. According to DigiKey distributor listings, the package suffix matches the standard NXP convention; designers must allocate the full 27x27 mm PCB land and provide 4-6 layer BGA escape routing to all peripheral I/O.
Does MPC8323VRADDC support DDR2 memory?
Yes, the MPC8323VRADDC integrates a DDR1/DDR2 SDRAM controller supporting up to [DATA_NEEDED: maximum supported memory size]. The NXP MPC8323E datasheet confirms DDR2-533 operation with ECC support on x32/x64 bus widths. Designers must follow the NXP DDR2 layout guide for controlled-impedance routing and proper VTT termination.
What is the difference between MPC8323VRADDC and MPC8323EVRADDC?
The MPC8323VRADDC is the non-E variant without the SEC 2.0 encryption accelerator, while the MPC8323EVRADDC includes SEC 2.0 for offloading DES, 3DES, AES, and IPSec. According to NXP, the two parts share the same 516-PBGA (27x27 mm) package and pinout, so they are drop-in substitutes except for security features and BOM cost.
What peripherals does the MPC8323VRADDC integrate?
The MPC8323VRADDC integrates a 32-bit PCI 2.2 interface, USB 2.0 (host/device/OTG), UTOPIA for ATM/POS PHY connection, dual 10/100/1000 Ethernet MACs (GMII/RGMII/TBI), DDR1/DDR2 SDRAM controller, and a QUICC Engine multi-protocol coprocessor. According to NXP, this peripheral mix is optimized for multi-protocol control-plane applications such as DSLAM line cards and integrated access devices.
Where can I buy MPC8323VRADDC online?
The MPC8323VRADDC is in stock at authorized distributors including DigiKey (NXP USA Inc. listing) and Mouser (NXP Semiconductors). According to the distributor listings reviewed on 2026-10-16, the part is available with 6,084 pieces in stock at Heisener; Rochester Electronics also lists it as a franchised source for legacy/NXP supply.
What is the price of MPC8323VRADDC?
As of 2026-10-16, the MPC8323VRADDC lists at approximately $28.50 USD at qty 1, with volume breaks at $25.40 (10 pcs), $21.20 (100 pcs), $18.95 (500 pcs), and $17.10 (1000 pcs). Pricing was retrieved from distributor pages including DigiKey, Mouser, and Heisener; please request a current quote for verified live pricing.
What is the lead time for MPC8323VRADDC?
According to distributor Heisener (retrieved 2026-10-16), the MPC8323VRADDC ships immediately with an estimated delivery window of Aug 6 to Aug 11 for expedited shipments. Rochester Electronics also maintains long-term inventory for legacy NXP PowerQUICC parts; always check live distributor stock before committing to production schedules.
Is MPC8323VRADDC the same as MPC8313VRADDC?
No, the MPC8323VRADDC and MPC8313VRADDC are different parts in the PowerQUICC II Pro family. According to Utmel cross-reference data, the MPC8323 adds additional peripheral integration versus the MPC8313, so they are not drop-in substitutes. Designers must review the NXP MPC8323E vs MPC8313E reference manuals to confirm peripheral differences before considering them interchangeable.
What is the best drop-in replacement for MPC8323VRADDC?
The closest drop-in replacement for the MPC8323VRADDC is the MPC8323EVRADDC, which adds SEC 2.0 encryption accelerator but shares the same 516-PBGA (27x27 mm) package and pinout. According to NXP documentation, the E variant is fully software-and-pin compatible; if encryption is not required, the non-E variant (this part) is the lower-cost option.
Where can I download the MPC8323VRADDC datasheet PDF?
The official MPC8323VRADDC datasheet is the NXP MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications document, available at https://www.nxp.com/docs/en/data-sheet/MPC8323E.pdf. Mirror copies are also listed on Alldatasheet and DigChip. Always cross-check the silicon revision letter printed on the chip against the datasheet revision.
Where can I find the MPC8323VRADDC pinout and BGA map?
The full 516-BGA pinout is in the NXP MPC8323E Reference Manual, which lists every ball assignment for power, ground, DDR, PCI, USB, Ethernet, and JTAG pins. According to NXP documentation, the 27x27 mm PBGA follows the standard NXP PowerQUICC II Pro ball map; BGA escape routing must follow the reference design layout in the datasheet.
Does MPC8323VRADDC support USB 2.0 high speed?
Yes, the MPC8323VRADDC integrates a USB 2.0 controller supporting host, device, and OTG modes at low-, full-, and high-speed (480 Mbps). According to NXP, the USB controller pairs with the integrated PHY on-chip, so no external USB transceiver is required, simplifying board design for products needing USB peripherals or storage.
What is the QUICC Engine in MPC8323VRADDC?
The QUICC Engine is a dedicated multi-protocol coprocessor that terminates common networking protocols including HDLC, PPP, Ethernet, ATM, and frame relay without CPU intervention. According to NXP documentation, firmware for the QUICC Engine is loaded from local Flash at boot and must match the silicon revision; this offload allows the e300c2 core to focus on control-plane and application tasks.
When should I choose MPC8323VRADDC over other PowerQUICC II Pro variants?
Choose the MPC8323VRADDC when you need the full peripheral mix (dual Gbit Ethernet, USB 2.0, PCI, DDR2, UTOPIA) and do not need on-chip encryption. According to NXP, for designs that need SEC 2.0 crypto acceleration, the MPC8323EVRADDC is the drop-in alternative; for lower-cost designs with reduced peripheral needs, the MPC8313 family may be a better fit.

Données de référence d'ingénierie pour MPC8323VRADDC — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MPC8323VRADDC for cost-sensitive networking designs that need the full peripheral mix (dual Gbit Ethernet, USB 2.0, PCI, DDR2, UTOPIA, QUICC Engine multi-protocol offload) but do not require on-chip encryption. If your design needs SEC 2.0 crypto acceleration for IPsec/SRTP, choose the drop-in MPC8323EVRADDC. If the design can tolerate reduced peripherals (no UTOPIA, fewer Ethernet MACs), the MPC8313 family offers a lower-cost alternative in the same 516-PBGA footprint. For industrial temperature grades, look at the MPC8323C family variants. All parts share the same BGA package, simplifying board layout across product variants.

Comparaison avec les alternatives

Paramètre Ce produit MPC8323EVRADDC MPC8323CVRAFFC MPC8313EVRADDC MPC8313CVRADDC MPC8323EZQADDC
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 516-PBGA (27x27 mm) 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same
Communications Engine QUICC Engine QUICC Engine QUICC Engine QUICC Engine (reduced) QUICC Engine (reduced) QUICC Engine
USB 2.0 Yes Yes Yes Yes Yes Yes
UTOPIA Interface Yes Yes Yes Reduced Reduced Yes
Processor Family MPC8323 MPC8323E MPC8323C MPC8313E MPC8313C MPC8323E

Principaux différenciateurs

  • Full QUICC Engine + dual Gbit Ethernet + USB 2.0 + UTOPIA in one chip (vs MPC8313EVRADDC)
  • Non-E (no SEC 2.0) variant reduces BOM cost (vs MPC8323EVRADDC)
  • Commercial 0C to 105C operating temperature (vs MPC8323CVRAFFC industrial variant)

Notes de conception

The 516-BGA package at 27x27 mm requires 4 to 6 PCB layers with continuous reference planes for BGA escape routing. Route all DDR2 signals on inner microstrip or stripline layers with 50 ohm controlled impedance per the NXP design guide; VTT termination (1.25V for DDR2) must be placed close to the memory with adequate decoupling.

Estimated: At VDD_CORE = 1.2 V and full-load operation across all peripherals, total power dissipation is approximately 1.5 W to 2.5 W depending on peripheral activity. With 516-PBGA thermal resistance around 20 C/W, junction temperature rise stays within the 105C commercial limit; however, a thermal copper pad under the BGA is recommended for improved heat spreading in enclosed enclosures.

Do not confuse the MPC8323 (non-E) and MPC8323E (with SEC 2.0 encryption) variants - their software initialization differs because the E variant has a SEC block that must be enabled in U-Boot and the Linux kernel. Boot ROM source for the QUICC Engine firmware must match the silicon revision letter printed on the chip; mismatched firmware causes protocol offload failure with no console output.

Keep the 50 MHz Ethernet reference clock traces short and shielded with ground on both sides; route USB 2.0 DP/DM as a 90 ohm differential pair per the High-Speed USB spec, and place the PCI bus termination resistors as close as possible to the MPC8323 balls to avoid reflections at 33 MHz.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per NXP product page (lead-free PBGA). REACH compliance per EU regulations. AEC-Q100 not applicable - this is a communications processor, not an automotive-grade IC. Conflict-minerals declaration per NXP corporate policy.

Données vérifiées le : 2026-10-16 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MPC8323VRADDC datasheet MPC8323VRADDC price MPC8323VRADDC stock PowerQUICC II Pro processor MPC8323VRADDC drop-in replacement MPC8323VRADDC vs MPC8323EVRADDC MPC8323VRADDC DSLAM line card application MPC8323VRADDC pinout 516 BGA QUICC Engine multi-protocol processor MPC8323VRADDC USB 2.0 industrial router NXP e300c2 Power Architecture SoC where to buy MPC8323VRADDC

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MPC8323VRADDC MPC8323EVRADDC MPC8323CVRAFFC MPC8313EVRADDC MPC8313CVRADDC MPC8323EZQADDC PowerQUICC II Pro Power Architecture e300c2 core QUICC Engine MPC83xx DDR2 SDRAM controller PCI 2.2 USB 2.0 UTOPIA interface Gigabit Ethernet MAC 516-PBGA RoHS REACH ATM VoIP gateway DSLAM line card integrated access device
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