AVIS DE DERNIER ACHAT : MPC8347ECVRADDB approche de sa fin de vie. Date de dernière commande : Contactez-nous. Voir les références alternatives disponibles →
NXP Semiconductors

MPC8347ECVRADDB - PowerQUICC II Pro 266MHz SoC, 620-HBGA | NXP

Référence : MPC8347ECVRADDB ⚠ Dernier achat
620-HBGA Hi-CTE (29x29 mm) Package 266 MHz Speed DDR1/DDR2, up to 333 MHz Memory
MOQ : 1 |

MPC8347ECVRADDB Présentation

The NXP (formerly Freescale) MPC8347ECVRADDB is a PowerQUICC II Pro integrated communications processor built on the e300 SoC platform, featuring a 32-bit PowerPC core running at 266 MHz in a 620-ball Hi-CTE BGA (29x29 mm) package. The device integrates a double-precision floating point unit, DDR1/DDR2 memory controller, PCI interface, gigabit Ethernet MAC, USB 2.0, security engine, and dual UARTs on a single die targeted at industrial temperature grade (-40C to +105C). It is part of the MPC8347E family, where the 'E' suffix denotes the integrated Security Engine and the industrial temperature range.

A PowerQUICC processor is a specialized communications system-on-chip (SoC) that combines a PowerPC host CPU with dedicated communications peripherals. The PowerQUICC II Pro architecture belongs to the broader hierarchy of PowerPC embedded processors (PowerPC -> Power Architecture -> RISC CPU -> embedded processor). It evolved from the earlier PowerQUICC II line by integrating more on-chip memory and I/O while maintaining software compatibility. This SoC class is widely used in networking and telecom equipment where deterministic protocol processing is required alongside general-purpose control code.

Key features include the e300 core with 32 KB L1 instruction cache and 32 KB L1 data cache, dual DDR1/DDR2 memory controllers supporting up to 333 MHz, dual 10/100/1000 Ethernet controllers with TCP/IP acceleration, two USB 2.0 hosts (with on-chip PHYs), a 32-bit PCI interface operating at 33/66 MHz, integrated security engine (SEC 2.0) for DES/3DES/AES/SHA/RSA, and four DMA channels. The integrated peripherals eliminate the need for companion bridge chips in typical routing, switching, and NAS designs.

The MPC8347E architecture implements the classic PowerQUICC dual-core concept in a unified manner: the e300 handles the host operating system (typically Linux or VxWorks), while the QUICC Engine communication module offloads protocol processing. This separation enables wire-speed routing performance without CPU intervention. The 620-HBGA package exposes the full peripheral set plus 16 general-purpose timers, two I2C controllers, an SPI controller, and GPIO lines for system management.

Typical applications include industrial routers and gateways, network attached storage (NAS) controllers, telecom line cards, secure VPN appliances, factory automation controllers, and printing/imaging equipment. The industrial temperature grade (-40C to +105C) makes the part well suited for outdoor enclosures and factory floor deployment where commercial-grade parts would be unreliable.

When designing with the MPC8347ECVRADDB, ensure the JTAG chain is correctly configured and that the 1.0V core / 1.8V DDR / 3.3V I/O rails are decoupled per NXP application note AN3544. The 620-HBGA (29x29 mm) requires at least a 6-layer PCB with controlled-impedance routing for DDR2 and Gigabit Ethernet signals. NXP supplies the U-Boot firmware and Linux BSP to shorten time-to-market.

This page consolidates distributor stock indicators, drop-in same-package alternatives, parametric comparison, and practical PCB design notes that complement the manufacturer hardware specifications document. It is intended for hardware engineers evaluating the MPC8347E family for new designs or supporting legacy production.

Alternatives de remplacement direct pour MPC8347ECVRADDB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MPC8347ECVRADDB (même facteur de forme et même empreinte) — différant par Memory Controller, Operating Temperature, Ethernet, Package, Security Engine.

NXP Semiconductors
Memory Controller: DDR1 / DDR2 with ECC
Operating Temperature: -40C to +105C
Ethernet: Dual 10/100/1000 Mbps (GMII/RGMII/TBI)
Comparer avec MPC8347ECVRADDB →
NXP Semiconductors
Memory Controller: DDR1/DDR2 with ECC
Ethernet: 10/100/1000 (1 Gbit) via QUICC Engine
Package: 620-ball HBGA (29x29 mm) - PBGA, exposed pad
Comparer avec MPC8347ECVRADDB →
NXP Semiconductors
Memory Controller: DDR1 / DDR2 with ECC
Operating Temperature: 0 C to 105 C
Ethernet: Dual 10/100/1000 (RGMII/MII/RTBI)
Comparer avec MPC8347ECVRADDB →
NXP Semiconductors
Memory Controller: DDR1 / DDR2
Operating Temperature: 0C to +105C
Package: 672-TBGA (35x35 mm)
Comparer avec MPC8347ECVRADDB →

MPC8347CVRADDB

✅ Remplacement direct
📦 620-HBGA (29x29)
same 620-HBGA package and e300 266 MHz core; lacks SEC 2.0 security engine, commercial temperature grade

📋 Alternative de référence (hors catalogue)

MPC8347ECVRAGDB

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 620-HBGA (29x29)
same die and 620-HBGA package; reduced core frequency or feature subset, pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

MPC8347CVBADDB

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 620-HBGA (29x29)
same 620-HBGA package; commercial temperature grade (0C to +85C) instead of industrial

📋 Alternative de référence (hors catalogue)

MPC8347EZUAJDB

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 620-HBGA (29x29)
PowerPC e300 · 1 · 32-bit · 533 MHz · 0.13 um CMOS · DDR1 / DDR2 · 10/100/1000 Mbps (1GbE) · PCI 2.3 up to 66 MHz

Contactez-nous pour le prix

Voir la fiche technique →

MPC8343VRADDB

✅ Remplacement direct
NXP Semiconductors
📦 620-HBGA (29x29)
PowerPC e300 (Power Architecture) · 266 MHz · 32-bit · 1.2 V · 1.8 V / 2.5 V / 3.3 V · 620-HBGA (29 x 29 mm, 1.0 mm pitch) · 620 · Dual 10/100/1000 (RGMII/MII/RTBI)

Contactez-nous pour le prix

Voir la fiche technique →

MPC8347ECVRADDB Valeurs maximales et caractéristiques électriques

Core Architecture PowerPC e300 (32-bit)
Core Frequency 266 MHz
Instruction Set Power Architecture 32-bit
L1 Cache (Instruction) 32 KB
L1 Cache (Data) 32 KB
Memory Controller DDR1/DDR2, up to 333 MHz
Ethernet Dual 10/100/1000 Mbps MAC
PCI Interface 32-bit, 33/66 MHz
USB 2x USB 2.0 Host with on-chip PHY
Security Engine SEC 2.0 (DES/3DES/AES/SHA/RSA)
DMA Channels 4
Température de fonctionnement -40C to +105C (Industrial)
Boîtier 620-HBGA Hi-CTE (29x29 mm)
Type de montage Surface Mount
Statut RoHS Compliant
Statut du cycle de vie Last Time Buy (EOL announced)

Guide de configuration des broches du MPC8347ECVRADDB 620-hbga hi-cte (29x29 mm)

Configuration des broches du MPC8347ECVRADDB (boîtier 620-hbga hi-cte (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier 620-hbga hi-cte (29x29 mm) pour le MPC8347ECVRADDB

Aucune donnée de brochage détaillée disponible pour MPC8347ECVRADDB.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

MPC8347ECVRADDB convient pour 6 applications: Industrial Router and Gateway, Network Attached Storage (NAS) Controller, Telecom Line Card and Access Equipment, Secure VPN and IPsec Appliance, Factory Automation Controller, Printing and Imaging Equipment.

🌐

Industrial Router and Gateway

The MPC8347ECVRADDB is a strong fit for industrial routers and protocol-conversion gateways. Its 266 MHz e300 core provides the headroom for routing tables up to ~50k entries while the dual Gigabit Ethernet MACs enable WAN/LAN separation without external switch chips. The integrated PCI interface allows connection to a wireless or DSL modem card, and the SEC 2.0 engine handles IPsec/SSL acceleration for VPN tunnels at line rate. The industrial -40C to +105C temperature range eliminates the need for active heating in outdoor enclosures, and NXP's long-term Linux BSP support keeps the firmware maintainable for 10+ year product lifecycles.

🖥️

Network Attached Storage (NAS) Controller

In NAS appliances, the MPC8347ECVRADDB serves as the main controller driving SATA disks via an external PCI SATA controller and presenting files over SMB/NFS via the dual Gigabit Ethernet ports. The 266 MHz core delivers ~80 MB/s sustained throughput on Samba benchmarks, sufficient for small-office NAS products. The DDR2 memory controller supports up to 1 GB of RAM for file system caching, and the integrated USB 2.0 ports provide additional storage expansion. The SEC 2.0 engine accelerates SMB3 signing, an increasingly common requirement in enterprise NAS deployments.

📡

Telecom Line Card and Access Equipment

The MPC8347ECVRADDB targets telecom line cards where deterministic protocol processing is required. The QUICC Engine offloads TDM, HDLC, and ATM processing, while the e300 core handles OAM/P and control plane code. The dual Ethernet MACs provide network-side and switch-side connectivity, and the PCI interface connects to DSP or framer ASICs. The industrial temperature grade allows deployment in unconditioned outdoor cabinets, and the long NXP product lifecycle (with Last Time Buy now in effect) means existing designs can continue production via franchised inventory.

🔐

Secure VPN and IPsec Appliance

The integrated SEC 2.0 security engine is the key differentiator for VPN appliance designs. It offloads DES, 3DES, AES, SHA-1/2, and RSA operations, allowing the MPC8347ECVRADDB to sustain ~200 Mbps of IPsec throughput while leaving the e300 core free for routing and management. The industrial temperature grade suits hardened appliances, and the dual Gigabit Ethernet ports allow WAN/LAN segmentation without an external switch. Combined with NXP's IPsec/Linux stack, this enables a compact fanless VPN appliance with 100+ concurrent tunnels.

🏭

Factory Automation Controller

In factory automation, the MPC8347ECVRADDB serves as a deterministic controller with EtherCAT or PROFINET real-time Ethernet connectivity (via external PHY and protocol stack). The e300 core runs the PLC logic at fixed cycle times, while the integrated peripherals (UART, I2C, SPI) connect to sensors and motor drives. The -40C to +105C temperature rating allows placement inside cabinets on the factory floor, and the long NXP lifecycle (now in LTB) provides migration runway via franchised inventory or QorIQ successor parts.

🖨️

Printing and Imaging Equipment

Multi-function printers and high-end imaging equipment benefit from the MPC8347ECVRADDB's combination of Gigabit Ethernet (for network connectivity), USB 2.0 hosts (for direct-print and scan-to-USB), and PCI (for the scanner/print engine ASICs). The SEC engine supports encrypted print job storage, an increasingly common compliance requirement in enterprise environments. The industrial temperature range covers the warm environment inside printer enclosures, and the Linux BSP provides a familiar development environment for OEMs already familiar with embedded Linux.

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What is the core architecture and clock speed of the MPC8347ECVRADDB?
The MPC8347ECVRADDB integrates a 32-bit PowerPC e300 core clocked at 266 MHz, paired with 32 KB L1 instruction and 32 KB L1 data caches on the same die. According to the NXP MPC8347EA Hardware Specifications document, the e300 implements the Power Architecture instruction set with hardware multiply/divide and double-precision floating-point support, providing deterministic performance for embedded networking and control code.
What integrated peripherals does the MPC8347ECVRADDB include?
The MPC8347ECVRADDB integrates dual DDR1/DDR2 memory controllers (up to 333 MHz), dual gigabit Ethernet MACs, two USB 2.0 hosts with on-chip PHYs, a 32-bit PCI 33/66 MHz interface, four DMA channels, an SEC 2.0 security engine, two UARTs, two I2C controllers, an SPI controller, and 16 general-purpose timers. This high level of integration lets designers replace multiple discrete bridge chips, reducing BOM cost and PCB area.
Is the MPC8347ECVRADDB still in production or is it end-of-life?
According to the NXP product page, the MPC8347ECVRADDB is in Last Time Buy status, meaning NXP has issued a Discontinuance and Replacement Product Change Notice. Customers should plan for last-time purchases now, or migrate to the recommended NXP replacement part (such as the P1010/P1020 QorIQ family or the MPC8308, depending on performance requirements) for new designs.
What is the difference between the MPC8347ECVRADDB and the MPC8347CVRADDB?
The MPC8347ECVRADDB includes the integrated SEC 2.0 Security Engine and is rated for the industrial temperature range (-40C to +105C), whereas the MPC8347CVRADDB lacks the security engine and operates over a different temperature grade. Both share the same 620-HBGA (29x29 mm) package, the e300 core at 266 MHz, and the same DDR/PCI/Ethernet peripheral set, making them pin-to-pin compatible for non-security designs.
Can the MPC8343VRADDB be used as a drop-in replacement for the MPC8347ECVRADDB?
The MPC8343VRADDB is closely related but not a true drop-in replacement: it integrates fewer Ethernet controllers (typically one instead of two), lacks some peripheral blocks, and offers a different DDR memory controller configuration. For new designs targeting the MPC8347E peripheral set, a like-for-like swap requires verifying each unused pin against the MPC8343 datasheet. For migration, the recommended path is the recommended NXP replacement rather than a lateral swap.
Where can I buy the MPC8347ECVRADDB today?
As of 2026-10-17, the MPC8347ECVRADDB is listed by Rochester Electronics (authorized NXP inventory), Heisener, and NXP directly with Last Time Buy notice. DigiKey and Mouser no longer stock new units but may still show limited inventory; check the stock indicator on the XAIPART product page for real-time availability. For new production, plan immediate last-time-buy orders or migrate to the recommended replacement.
What is the lead time and price of the MPC8347ECVRADDB?
As of 2026-10-17, the MPC8347ECVRADDB is priced at approximately $118.96 USD for qty-1 (Heisener), with breaks at $109.50 (qty 10), $95.20 (qty 100), $82.75 (qty 500), and $71.40 (qty 1000). Lead time from authorized distributors is typically 8-12 weeks due to Last Time Buy allocation; Rochester Electronics offers franchised long-term supply at higher unit pricing. Confirm with the distributor before issuing a PO.
What operating temperature range does the MPC8347ECVRADDB support?
The MPC8347ECVRADDB is rated for industrial temperature operation from -40C to +105C ambient. This makes the part suitable for outdoor enclosures, factory floor equipment, and industrial networking gear where commercial-temperature PowerQUICC II Pro parts would fail. According to NXP, junction temperature must remain below 125C under worst-case load.
How much power does the MPC8347ECVRADDB dissipate at full load?
Estimated: at 266 MHz core clock, 1.0V core supply, and full peripheral utilization, the MPC8347ECVRADDB dissipates approximately 2.5 W to 3.5 W. With the 620-HBGA Hi-CTE package (theta-JA around 15 C/W on a 6-layer JEDEC test board), this yields a junction-to-ambient rise of roughly 40C to 50C above ambient, leaving ample margin in the -40C to +105C operating range. Use NXP's PowerQUICC II Pro Power Estimator for design-specific numbers.
What PCB design considerations apply to the 620-HBGA package?
The 620-HBGA (29x29 mm) requires a 6-layer (or more) PCB with controlled-impedance routing for DDR2 (50 ohm single-ended, 100 ohm differential), Gigabit Ethernet (50 ohm), and PCI (66 ohm). Use laser-drilled micro-vias with 0.4 mm pitch BGA fanout, and place 0.1 uF + 10 uF decoupling caps within 5 mm of each power pin group. NXP application note AN3544 details reference layout and stackup; follow it closely to meet DDR2 SI margins.
Is the MPC8347ECVRADDB RoHS compliant?
Yes, the MPC8347ECVRADDB is RoHS compliant per the NXP product page. The part uses lead-free (Pb-free) solder balls on the 620-HBGA package and is qualified for Pb-free reflow profiles up to 245C peak (per IPC/JEDEC J-STD-020). For REACH and conflict-minerals compliance, request the latest NXP CMDR report directly from your NXP FAE or distributor.
What is the best replacement for the MPC8347ECVRADDB?
For new designs requiring like-for-like compatibility with the PowerQUICC II Pro software ecosystem, the closest recommended NXP replacement is the MPC8308 or the P1010/P1020 QorIQ family, depending on whether you need higher CPU performance (QorIQ) or pin-software compatibility (MPC8308). For one-to-one last-time-buy continuity, Rochester Electronics holds franchised inventory. A pin-compatible drop-in alternative within the MPC8347E family is the MPC8347CVBADDB (commercial temp) or MPC8347ECVRAGDB, depending on temperature grade requirements.
Where can I download the MPC8347ECVRADDB datasheet PDF?
The official NXP MPC8347EA Hardware Specifications document is available at https://www.nxp.com/docs/en/data-sheet/MPC8347EA.pdf. For the full PowerQUICC II Pro reference manual covering the e300 core, QUICC Engine, and DDR controller, request document MPC8347ERM from your NXP distributor. Third-party mirror sites such as alldatasheet.com also host the same datasheet but the NXP URL is always the authoritative version.
Does the MPC8347ECVRADDB support Linux?
Yes, NXP supports Linux on the MPC8347E family through the Freescale/NXP Linux BSP, which includes U-Boot bootloader, kernel patches, and board support for the MPC8347E MDS reference design. Mainline Linux kernels (4.x and later) also include e300 core support, enabling standard distributions to boot on the part with minimal customization. For VxWorks or QNX, contact NXP or Wind River/QNX directly for board support packages.
What is the pinout and ball map of the MPC8347ECVRADDB?
The 620-HBGA ball map is documented in the NXP MPC8347EA Hardware Specifications chapter on Signal Assignments. BGA balls are numbered A1 through AT29, with the die-attach pad at the center of the package for thermal dissipation. Refer to the datasheet's pinout section for the exact mapping of DDR_DQS, Ethernet GMII/RGMII, PCI_AD, USB_DP/DM, and JTAG signals; this page's pinout diagram uses a representative package layout.

Données de référence d'ingénierie pour MPC8347ECVRADDB — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MPC8347ECVRADDB when you need a PowerQUICC II Pro with the integrated SEC 2.0 security engine and industrial temperature range for hardened networking, telecom, or factory automation designs. Choose the MPC8347CVRADDB if you do not need the security engine and can operate over the commercial temperature range - same package, lower cost. For new designs, however, evaluate the recommended NXP QorIQ replacements (P1010/P1020) or the MPC8308 family, as the entire MPC8347E line is now in Last Time Buy. For one-to-one last-time-buy continuity, Rochester Electronics holds franchised inventory at premium pricing.

Comparaison avec les alternatives

Paramètre Ce produit MPC8347CVRADDB MPC8347ECVRAGDB MPC8347CVBADDB MPC8347EZUAJDB MPC8343VRADDB
Package 620-HBGA Hi-CTE (29x29 mm) 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture PowerPC e300, 266 MHz PowerPC e300, 266 MHz PowerPC e300, 266 MHz PowerPC e300, 266 MHz PowerPC e300, lower speed grade PowerPC e300, 266 MHz
Security Engine SEC 2.0 (DES/3DES/AES/SHA/RSA) None SEC 2.0 None SEC 2.0 SEC 2.0
Operating Temperature -40C to +105C (Industrial) Commercial Industrial 0C to +85C (Commercial) Industrial Industrial
Memory Controller DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, slightly lower rate
Ethernet Dual 10/100/1000 MAC Dual 10/100/1000 MAC Dual 10/100/1000 MAC Dual 10/100/1000 MAC Dual 10/100/1000 MAC Reduced Ethernet configuration
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Principaux différenciateurs

  • Integrated SEC 2.0 security engine for cryptographic acceleration (vs MPC8347CVRADDB)
  • Industrial temperature range for outdoor and factory deployments (vs MPC8347CVBADDB)
  • Full peripheral set in same package as reduced-feature siblings (vs MPC8343VRADDB)

Notes de conception

The 620-HBGA Hi-CTE package requires a minimum 6-layer PCB stackup with continuous GND and PWR planes adjacent to the outer signal layers. Use laser-drilled 0.1 mm micro-vias for BGA fanout with a 0.4 mm via-pitch escape pattern (dog-bone or via-in-pad). Place 0.1 uF X7R decoupling caps within 3 mm of every power pin group, and add bulk 10 uF tantalum or ceramic caps at each supply rail entry point. Follow NXP application note AN3544 for the reference stackup and routing rules.

Estimated: at 266 MHz core clock and full peripheral utilization, the MPC8347ECVRADDB dissipates approximately 2.5 W to 3.5 W. The 620-HBGA Hi-CTE package has a theta-JA around 15 C/W on a 6-layer JEDEC test board, yielding a junction-to-ambient rise of roughly 40C to 50C above ambient. In a sealed industrial enclosure without forced airflow, derate the operating temperature ceiling by 10C or attach a small clip-on heatsink to the package lid.

Three common pitfalls: (1) Forgetting the 32.768 kHz reference oscillator required for the QUICC Engine timers - without it, TDM and Ethernet time-stamping will be inaccurate. (2) Mixing DDR2 signal lengths - the MPC8347E DDR controller requires matched clock, DQS, and DQ routing within 25 ps. (3) Failing to configure the JTAG chain - the e300 core's BDI2000 or CodeWarrior TAP must be properly cascaded with any secondary JTAG devices for production boundary-scan to pass.

The MPC8347ECVRADDB requires three independent rails: 1.0V (core, up to 3 A peak), 1.8V (DDR2 termination and PLL, up to 1 A), and 3.3V (I/O and USB PHY, up to 1.5 A). Use a 4-phase or 3-phase buck regulator for the 1.0V core rail with ceramic output capacitors placed directly at the BGA power balls. Sequence the rails per NXP's power sequencing requirements - 3.3V must ramp before 1.8V, which must ramp before 1.0V, to avoid latch-up.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS and REACH compliant per NXP product page. AEC-Q100 not applicable - this is an industrial networking MPU, not an automotive-qualified part. Lead-free (Pb-free) BGA solder balls support 245C peak reflow per IPC/JEDEC J-STD-020. Halogen-free status not explicitly stated in the verified web data - request CMDR report from NXP for confirmation.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MPC8347ECVRADDB MPC8347ECVRADDB datasheet NXP MPC8347E PowerQUICC II Pro MPC8347E 266 MHz e300 620-HBGA PowerQUICC II Pro industrial router SoC MPC8347ECVRADDB vs MPC8347CVRADDB MPC8347E drop-in replacement MPC8347ECVRADDB buy last time buy what is the operating temperature of MPC8347E MPC8347ECVRADDB Linux BSP U-Boot PowerQUICC II Pro DDR2 SDRAM controller layout NXP MPC8347E EOL replacement QorIQ

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MPC8347ECVRADDB MPC8347E MPC8347CVRADDB MPC8347ECVRAGDB MPC8347CVBADDB MPC8347EZUAJDB MPC8343VRADDB PowerPC e300 PowerQUICC II Pro QUICC Engine Power Architecture 620-HBGA Hi-CTE BGA DDR2 PCI 2.3 Gigabit Ethernet USB 2.0 SEC 2.0 (Security Engine) Linux BSP U-Boot VxWorks Industrial temperature grade Last Time Buy RoHS REACH AEC-Q100 (not applicable)
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