MPC8347VVALFB - PowerQUICC II Pro 667MHz MPU | NXP | 672-LBGA
Référence : MPC8347VVALFB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $87.99 | $87,99 |
| 10 | $79.5 | $795,00 |
| 100 | $71.2 | $7 120,00 |
| 250 | $65.8 | $16 450,00 |
| 500 | $60.95 | $30 475,00 |
MPC8347VVALFB Présentation
A PowerQUICC II Pro processor is a system-on-chip (SoC) communications engine that combines a PowerPC host processor with specialized communications peripherals, designed to consolidate router, bridge, and line-card functions into a single device. Within the broader taxonomy, MPC8347VVALFB belongs to the microprocessor (MPU) category -> embedded processor -> communications SoC -> PowerPC/Power Architecture family, a segment historically dominant in telecom, industrial control, and storage area networking hardware.
Key features include 32-bit data bus, 667 MHz core clock, integrated DDR1/DDR2 memory controller with ECC support, dual 10/100/1000 Ethernet controllers with GMII/RGMII/RTBI/TBI interfaces, USB 2.0 (full/low speed), PCI 2.3 interface, integrated security engine (MPC8347E variant), UART, I2C, SPI, and four DMA channels. The device supports operating temperatures from 0C to 105C (commercial/extended grade).
The architecture combines an e300 superset of the PowerPC 603e core with a system interface unit (SIU) and a flexible peripheral set. The integrated security engine accelerates DES, 3DES, AES, MD5, SHA-1, and public-key algorithms, offloading computationally intensive IPsec and SSL tasks from the host CPU. This dual-engine architecture - general-purpose compute plus dedicated crypto - made the MPC8347E family the de-facto choice for VPN gateways, secure routers, and IPsec-accelerated line cards in the mid-2000s and continues to support installed bases today.
Typical applications include industrial routers and gateways, network-attached storage (NAS), DSLAM line cards, wireless base-station controllers, VoIP media gateways, secure VPN appliances, and factory automation controllers. The wide peripheral mix and extended temperature grade also suit Smart Grid substation equipment and railway signaling platforms.
Design consideration: the 672-LBGA package requires careful PCB stack-up planning, with microvia or via-in-pad technology recommended for reliable BGA assembly. The DDR2 controller demands matched-length routing (within 25 mil) and proper termination to operate at 400 MHz DDR rates. Power sequencing between core (1.2 V) and I/O (1.8 V/2.5 V/3.3 V) rails must follow the sequence specified in the hardware specifications document.
This page synthesizes distributor pricing, end-of-life status, drop-in NXP-family alternatives (MPC8349VVALFB, MPC8347VVAJDB), and practical design notes not aggregated in any single distributor listing.
Alternatives de remplacement direct pour MPC8347VVALFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8347VVALFB (même facteur de forme et même empreinte) — différant par Ethernet, RoHS Status, Security Engine, Series, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8349VVALFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8347VVAJDB
✅ Remplacement direct✓ En stock
$58.95 / unité
Voir la fiche technique →MPC8347VVALFG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8347VVALFB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro (MPC83xx) |
| Core Processor | PowerPC e300 (MPC83xx family) |
| Number of Cores | 1 |
| Largeur du bus de données | 32-Bit |
| Clock Speed (Core) | 667 MHz |
| Supply Voltage (Core) | 1.2 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Température de fonctionnement | 0C to +105C |
| Boîtier / Format | 672-LBGA (TBGA), 35x35 mm, 1 mm pitch |
| Type de montage | Surface Mount |
| Memory Interface | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 (GMII/RGMII/RTBI/TBI) |
| PCI | PCI 2.3 (32-bit, 66 MHz) |
| USB | USB 2.0 Full/Low Speed |
| Security Engine | Integrated (DES/3DES/AES, MD5/SHA-1, PKA) |
| Statut RoHS | Lead-free (per NXP product page) |
| Statut du cycle de vie | Not Recommended for New Designs (NRND) per NXP |
Guide de configuration des broches du MPC8347VVALFB 672-lbga (tbga), 35x35 mm, 1 mm pitch
Configuration des broches du MPC8347VVALFB (boîtier 672-lbga (tbga), 35x35 mm, 1 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8347VVALFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8347VVALFB convient pour 6 applications: Industrial VPN / Secure Router Gateway, Network-Attached Storage (NAS) Controller, DSLAM / Multi-Service Access Node Line Card, VoIP Media Gateway, Industrial Automation / Factory Controller, Wireless Base Station Controller / Radio Network Controller.
Industrial VPN / Secure Router Gateway
The MPC8347VVALFB's 667 MHz PowerPC e300 core plus integrated security engine (DES/3DES/AES/SHA/RSA) deliver line-rate IPsec/SSL termination in branch-office VPN gateways. The dual 10/100/1000 Ethernet MACs with GMII/RGMII connectivity allow direct PHY attachment for WAN and LAN ports without an external switch. DDR2 controller with ECC prevents bit-flips from corrupting routing tables or crypto sessions in 24x7 deployments. Compared with software-only TLS stacks on a generic ARM SoC, the MPC8347VVALFB frees the e300 core for routing/control-plane duties while the hardware engine handles wire-speed crypto.
Recommandé
Network-Attached Storage (NAS) Controller
In NAS appliances the MPC8347VVALFB's PCI 2.3 interface hosts SATA or SCSI controllers for disk connectivity, while the USB 2.0 port serves front-panel or external backup drives. The DDR2 controller with ECC protects file-system metadata from corruption, and the 667 MHz e300 core handles NFS/SMB/iSCSI protocols and RAID management. The extended 0C-to-105C range tolerates hard-disk-bay thermal rise, making the part suitable for desktop and small-rack NAS products. Compared with x86 NAS controllers, the MPC8347VVALFB provides lower power and a richer peripheral mix at a fraction of the BOM cost.
Recommandé
DSLAM / Multi-Service Access Node Line Card
Telecom DSLAM line cards historically used the MPC8347VVALFB to terminate ATM and PPPoE sessions while feeding Ethernet uplinks. The integrated dual GbE, PCI expansion for DSL PHY links, UART for management, and 667 MHz processing headroom handle line-card housekeeping and QoS shaping. The hardware security engine offloads IPsec/MACsec encryption for backhaul encryption. The part's mature ecosystem (BSPs, VxWorks/Linux BSPs from NXP and partners) reduces carrier qualification time. Compared with newer SoCs, the MPC8347VVALFB retains a multi-decade software base in installed carrier networks.
Recommandé
VoIP Media Gateway
The MPC8347VVALFB's combination of dual Gigabit Ethernet, PCI bus for DSP farms, USB, and a 667 MHz compute core suits Class-4/5 VoIP media gateways. The e300 core runs RTP/RTCP/TLS signaling stacks, while PCI-attached DSPs handle voice codecs (G.711/G.729/SILK). DDR2 with ECC keeps media buffer memory safe from soft errors during multi-channel TDM-to-IP conversion. The integrated security engine accelerates SRTP media encryption. The extended 105C junction rating tolerates fan-less 1U chassis. Compared with low-power Cortex-A parts, the MPC8347VVALFB provides the PCI expansion critical to legacy DSP-array architectures.
Recommandé
Industrial Automation / Factory Controller
In factory automation the MPC8347VVALFB acts as a deterministic gateway between fieldbus networks (Profibus/Modbus/CC-Link over PCI-attached controllers) and plant Ethernet. The DDR2 controller with ECC ensures safe PLC variable storage, while dual GbE supports redundant ring topologies (DLR, PRP). The 0-105C junction range tolerates cabinet temperatures up to 70C ambient with proper heatsinking. Hardware cryptography secures OPC-UA communication. Compared with newer Cortex-R SoCs, the MPC8347VVALFB retains pin-compatibility across long-lived industrial platforms and benefits from a proven, deterministic BSP ecosystem.
Recommandé
Wireless Base Station Controller / Radio Network Controller
The MPC8347VVALFB served as the control-plane processor in 2G/3G base station controllers and small-cell radio network controllers, where the 667 MHz e300 runs the OAM/RRM/S1AP protocol stacks. PCI hosts DSP/FPGA cards for baseband processing; dual GbE provides backhaul and operator-network connectivity; the hardware security engine accelerates IPSec tunnels between the base station and the core network. Extended temperature and long-life silicon (per NXP's embedded roadmap) matched carrier deployment cycles. Compared with newer SoCs, the MPC8347VVALFB's mature OAM software ecosystem shortens carrier qualification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8347VVALFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8349VVALFB | MPC8347VVAJDB | MPC8347VVALFG | MPC8347CZUAJFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 672-LBGA (35x35 mm) | 672-LBGA (35x35 mm) - same | 672-LBGA (35x35 mm) - same | 672-LBGA (35x35 mm) - same | TBGA-620 (29x29 mm) - DIFFERENT |
| Core | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 |
| Memory Interface | DDR1/DDR2 with ECC | DDR1/DDR2 enhanced throughput | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Security Engine | Integrated (DES/3DES/AES/SHA/PKA) | Integrated | Integrated | Integrated | Integrated |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Mature software ecosystem with multi-decade BSP support (vs Modern NXP Layerscape LS1012A)
- Integrated hardware security engine for line-rate IPsec/SSL (vs MPC8349VVALFB)
- Industrial-temperature 105C junction for harsh enclosures (vs MPC8347CZUAJFB (TBGA-620))
Notes de conception
The 672-LBGA package with 1 mm pitch demands a PCB stack-up that supports microvias or via-in-pad construction. A 4-layer FR-4 stack-up with 0.5 oz copper outer layers and 1 oz inner planes is the minimum. Place the device on the top layer and route signal escapes on inner layers using microvias (laser-drilled, 0.1 mm pad). NXP publishes a reference layout in AN3524 (MPC8347 design checklist) - follow the escape pattern and decoupling-cap placement verbatim to avoid signal-integrity and assembly-yield issues.
DDR2 routing to/from the MPC8347VVALFB must observe +/-25 mil length matching on byte lanes and 50 ohm single-ended impedance to the DIMM. The DDR2 controller uses source-synchronous clocking (MCK/MCK#) - route the clock pair with 100 ohm differential impedance and length-match to within 100 mil of the byte-lane strobes. VTT termination (1.0 V or 1.2 V depending on DIMM type) must be sourced through a regulator capable of sourcing/sinking the peak DDR2 read/write current, with decoupling within 200 mil of each VTT pin.
Power sequencing on the MPC8347VVALFB requires that I/O rails (1.8/2.5/3.3 V) reach valid levels before or simultaneously with the 1.2 V core rail. Reversing this order risks latch-up. Use a supervisor IC (e.g., NXP MC33912 or equivalent) to enforce sequencing. Also ensure that PORESET is held low until all rails are stable and the system PLL has settled - typically 100 us minimum. Failing to observe the sequence is the most common bring-up failure on first prototypes.
Estimated: at 667 MHz core, full GbE traffic, and security engine active, the MPC8347VVALFB dissipates approximately 2.5-3.0 W. With theta_JA around 15-20 C/W for a 672-LBGA on a 4-layer JEDEC test board, junction rise above ambient is 45-60C. At 70C ambient this places junction near 115-130C, exceeding the 105C max for the standard part. For chassis above 60C ambient, use the industrial-screen variant or mount a small heatsink on the top of the BGA via thermal pad.
Informations de conformité
Lead-free 672-LBGA package per NXP product page. RoHS/REACH compliance asserted by NXP. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified part. Conflict-minerals compliance per NXP corporate policy.
