MPC8536ECVTATHA - 1.25GHz PowerQUICC III MPU, 783-FCPBGA | NXP
Référence : MPC8536ECVTATHA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $198 | $1 980,00 |
| 100 | $175.5 | $17 550,00 |
| 500 | $152 | $76 000,00 |
| 1 000 | $138 | $138 000,00 |
MPC8536ECVTATHA Présentation
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions while integrating memory and peripheral controllers on-die. The PowerQUICC family (PowerPC -> Power Architecture -> embedded communications processor) targets networking, storage, and industrial control, occupying the broader hierarchy of microprocessors -> microcontrollers -> embedded processors -> SoCs.
Key features include 36-bit physical addressing, hardware-accelerated cryptography via SEC/SEC 3.x engines, multi-PHY serial interfaces, and an integrated interrupt controller. The device supports simultaneous multi-protocol packet processing through dedicated QUICC Engine technology blocks and SERDES-based connectivity for PCI Express and SATA. Industrial temperature grade -40C to +105C and lead-free assembly make the MPC8536E suited for extended-lifecycle embedded designs.
Typical applications include IP network routers, secure storage controllers, line cards for multi-service switches, and industrial automation gateways. The integrated GbE MACs, SERDES lanes, and security accelerators reduce BOM cost and PCB area compared with discrete CPU-plus-coprocessor architectures of the prior generation.
When designing with the MPC8536ECVTATHA, ensure adequate PCB stackup design for 1 mm-pitch BGA fanout, four or more layers with continuous GND reference planes for SERDES impedance control, and provision for DDR3 write leveling/calibration. The SEC engine effectively needs proper clocking and JTAG topology for secure-mode bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster starting point for MPC8536E-based designs.
Alternatives de remplacement direct pour MPC8536ECVTATHA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8536ECVTATHA (même facteur de forme et même empreinte) — différant par Maximum Core Frequency, Memory Controller, Mounting Type, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8536EBVTATHA
✅ Remplacement direct✓ En stock
$99.4 / unité
Voir la fiche technique →MPC8536EBCVTATHA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8536ECVJAQLA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8536ECVTATHA Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e500 |
| Largeur du bus de données | 32-Bit |
| Maximum Core Frequency | 1.5 GHz (e500 scales to 1.5 GHz; this variant operates up to 1.25 GHz) |
| Operating Frequency (this variant) | 1.25 GHz |
| Tension d'alimentation | 1.1 V |
| Instruction Set | Power Architecture, 36-bit physical addressing |
| Number of Cores | 1 |
| Memory Controller | DDR2/DDR3 |
| Ethernet | Gigabit Ethernet (GbE) |
| Storage Interfaces | SATA, SDHC |
| Expansion Interfaces | PCI, PCI Express (PCIe) |
| Security Accelerator | SEC engine |
| Package Type | FCPBGA-783, 29 x 29 mm, 1 mm pitch, 2.80 mm height |
| Nombre de broches | 783 |
| Type de montage | Surface Mount (BGA) |
| Lead-Free | Yes (lead-free FCBGA) |
| Température de fonctionnement | -40C to +105C (industrial) |
Guide de configuration des broches du MPC8536ECVTATHA fcpbga-783, 29 x 29 mm, 1 mm pitch, 2.80 mm height
Configuration des broches du MPC8536ECVTATHA (boîtier fcpbga-783, 29 x 29 mm, 1 mm pitch, 2.80 mm height). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8536ECVTATHA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8536ECVTATHA convient pour 6 applications: IP Network Router Control Plane, Secure Storage Controller (NAS / iSCSI), Industrial Automation Gateway, Line Card Processor for Multi-Service Switches, Secure VPN Appliance, Military and Aerospace Embedded Controller.
IP Network Router Control Plane
The MPC8536ECVTATHA's e500 core at 1.25 GHz plus dual GbE MACs and SEC-accelerated IPsec make it ideal for IP router control-plane processing. Routing-table lookups, BGP/OSPF protocol stacks, and encryption throughput scale with the 1.25 GHz core; DDR3 with ECC handles large route tables without off-chip memory pressure. Compared with discrete CPU-plus-crypto-assist designs, the integrated SEC engine reduces bill-of-materials cost by approximately 30-40% and saves two PCB layers. Place the device adjacent to its DDR3 SO-DIMM or discrete DRAM with matched-impedance traces.
Recommandé
Secure Storage Controller (NAS / iSCSI)
The integrated SATA host and SEC crypto engine position the MPC8536ECVTATHA for secure NAS and iSCSI storage controllers. The 1.25 GHz core handles filesystem metadata and RAID parity; DDR3 bandwidth sustains multi-drive sequential throughput up to several hundred MB/s; AES-256/XTS acceleration through SEC secures at-rest data with negligible CPU overhead. Pin-compatible with the lower-frequency MPC8536ECVJAQLA for cost-reduced SKUs.
Recommandé
Industrial Automation Gateway
The -40C to +105C industrial temperature range plus GbE, PCIe, and USB make the MPC8536ECVTATHA suited for industrial protocol gateways bridging EtherNet/IP, PROFINET, or Modbus TCP. The e500 core runs real-time Linux or VxWorks; SEC enables authenticated firmware updates; the 783-FCPBGA provides robust mechanical and thermal performance for factory-floor vibration and thermal cycling. Note: requires 1 mm-pitch BGA layout with at least 6 PCB layers for SERDES signal integrity.
Recommandé
Line Card Processor for Multi-Service Switches
Carrier-grade line cards combine the MPC8536ECVTATHA's GbE and SERDES connectivity with external PHY transceivers to aggregate multiple 1G links. The QUICC Engine handles packet classification and QoS; SEC secures per-subscriber IPsec tunnels; DDR3 with ECC provides buffering for traffic shaping. Compared with ASIC-based line cards, the MPU approach reduces NRE cost for low-volume deployments by enabling software-based feature updates.
Recommandé
Secure VPN Appliance
IPsec VPN gateways benefit from the MPC8536ECVTATHA's SEC-accelerated AES, 3DES, SHA, and public-key operations. At 1.25 GHz the e500 core handles tunnel setup and IKE negotiation; SEC offloads bulk encryption at near-gigabit line rate. The integrated dual GbE provides WAN/LAN separation without an external switch. Industrial temperature grade supports outdoor cabinet deployments.
Recommandé
Military and Aerospace Embedded Controller
The extended temperature range, lead-free assembly, and Power Architecture reliability make the MPC8536ECVTATHA suitable for military/aerospace embedded controllers in avionics, unmanned vehicles, and secure communications. The Power Architecture instruction set supports legacy software reuse from prior PowerQUICC designs; SEC enables encrypted data-at-rest storage for sensitive payloads. Requires ruggedized PCB stackup and conformal coating for deployment environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8536ECVTATHA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8536EBVTATHA | MPC8536EBCVTATHA | MPC8536ECVJAQLA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCPBGA-783 (29x29) | FCPBGA-783 (29x29) - same | FCPBGA-783 (29x29) - same | FCPBGA-783 (29x29) - same |
| Core Frequency | 1.25 GHz | 1.25 GHz | 1.25 GHz | 1.0 GHz |
| Core Architecture | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 |
| Memory Controller | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 | DDR2/DDR3 |
| Security Engine | SEC (full features) | SEC (full features) | SEC (subset) | SEC (full features) |
| Pin Count | 783 | 783 | 783 | 783 |
Principaux différenciateurs
- Industrial temperature grade within the same PowerQUICC III family (vs MPC8536EBVTATHA)
- Higher operating frequency than the lower-cost sibling (vs MPC8536ECVJAQLA)
- Full SEC security engine feature set (vs MPC8536EBCVTATHA)
Notes de conception
The 783-ball FCPBGA at 1 mm pitch requires a PCB stackup of at least 6 layers with microvia or via-in-pad technology for fanout. Place continuous GND reference planes beneath the BGA and SERDES lanes to maintain 85-ohm differential impedance. Use NXP reference design stackup guidance to avoid signal-integrity failures.
Estimated: at maximum core activity (1.25 GHz, all engines active), the device dissipates approximately 8-12 W. The FCPBGA-783 package requires thermal vias beneath the die and a heat spreader or heatsink for sustained operation. Derate above +85C ambient for industrial deployments; verify junction temperature with on-die thermal diode.
Do not assume 0 ohm resistors between JTAG TDI/TDO for daisy-chain configurations; the MPC8536E requires dedicated JTAG topology per NXP AN4321. SEC engine requires proper clock initialization before security operations are valid. DDR3 write-leveling calibration must complete before any DRAM access to prevent memory corruption.
Informations de conformité
Verified web data confirms lead-free FCBGA assembly per chipdig.com listing. RoHS/REACH explicit compliance statements were not found in retrieved data and are listed as 'unknown'. AEC-Q100 is not applicable as this is an MPU rather than an automotive-qualified IC.
