MPC8544CVTANGA - PowerQUICC III 800MHz MPU | NXP | Networking SoC
Référence : MPC8544CVTANGA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $263.4 | $2 634,00 |
| 100 | $238.5 | $23 850,00 |
| 500 | $215.8 | $107 900,00 |
| 1 000 | $192.6 | $192 600,00 |
MPC8544CVTANGA Présentation
What is a PowerQUICC III processor? A PowerQUICC III is NXP's third-generation Power Architecture communications processor family (MPC85xx), succeeding the PowerQUICC II (MPC82xx). It belongs to the broader hierarchy: microprocessor (MPU) -> application processor -> communications SoC -> PowerQUICC family -> MPC85xx series. PowerQUICC III parts integrate a high-performance e500 core with on-chip peripheral controllers, reducing bill-of-materials and enabling single-chip designs for routers, switches, line cards, and industrial gateways where a separate CPU plus chipset would otherwise be required.
Key features include 256 KB of on-chip SRAM, integrated L2 cache, security acceleration, dual I2C, four UARTs, dual DMA controllers, GPIO, and a local bus controller. The integrated DDR memory controller supports up to 1 GB of DDR1 or DDR2 with ECC, while the PCI/PCIe block provides both a 32-bit/66 MHz PCI interface and a x4 PCIe endpoint/root complex. The 1 GbE MAC supports SGMII and 1000BASE-T PHY connectivity.
Architecturally, the MPC8544E family uses a 90 nm process and implements high-speed RapidIO serialization alongside the standard peripherals, enabling fabric-level backplane applications. Performance targeting typically falls in the 1.2 GHz-compatible range when considering the wider MPC85xx family (the MPC8544E itself tops at 800 MHz core clock per NXP product documentation).
Typical applications include industrial routers, secure VPN gateways, factory automation controllers, defense and aerospace networking line cards, and high-end embedded computing platforms requiring sustained protocol offload.
When designing with this part, ensure proper thermal management: at 800 MHz with industrial +105C operation, the FCBGA substrate typically dissipates 5-9 W, requiring a multi-layer PCB thermal via array under the die and adequate airflow. Use NXP's BSD/ BSD-Linux BSP and U-Boot for fast bring-up.
Alternatives de remplacement direct pour MPC8544CVTANGA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8544CVTANGA (même facteur de forme et même empreinte) — différant par Ethernet, Mounting Type, Number of Cores, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8544CVJANGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8544EVTANGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →MPC8544CVTANG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8544CVTALEA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8544EECVTANGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8536ECVTANGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8544CVTANGA Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e500, 32-bit |
| Maximum Core Frequency | 800 MHz |
| Process Technology | 90 nm CMOS |
| Number of Cores | 1 |
| Memory Controller | DDR1/DDR2 with ECC, up to 1 GB |
| PCI Interface | 32-bit, 66 MHz PCI |
| PCI Express Interface | x4 PCIe endpoint/root complex |
| Ethernet | 1 GbE MAC (SGMII/1000BASE-T) |
| USB Interface | USB 2.0 (on-chip EHCI/UTMI) |
| Serial Interfaces | 2x I2C, 4x UART, GPIO, dual DMA |
| Température de fonctionnement | -40C to +105C (industrial) |
| Tension d'alimentation | 1.8 V / 2.5 V / 3.3 V |
| Boîtier | 783-pin FCBGA (NGA), 29 x 29 mm |
| Silicon Revision | Rev 2.1 |
| Type de montage | Surface Mount (BGA, socketed or soldered) |
| Statut RoHS | Compliant per NXP product page |
Guide de configuration des broches du MPC8544CVTANGA 783-pin fcbga (nga), 29 x 29 mm
Configuration des broches du MPC8544CVTANGA (boîtier 783-pin fcbga (nga), 29 x 29 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8544CVTANGA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8544CVTANGA convient pour 7 applications: Industrial Router / Secure VPN Gateway, Factory Automation Controller, Defense / Aerospace Networking Line Card, Edge Compute Gateway / Industrial IoT, Solid-State Drive (SSD) Storage Controller Host, Printer/MFP Image Processing Backend, Medical Imaging Edge Node.
Industrial Router / Secure VPN Gateway
The NXP MPC8544CVTANGA's 800 MHz e500 core and integrated 1 GbE MAC with PCI Express enable mid-range industrial routers and VPN gateways. In typical deployments, an appliance manufacturer pairs the SoC with a PCIe-based crypto accelerator (or uses the MPC8544E variant's on-chip SEC engine) for IPSec/AES throughput, while DDR2 memory (up to 1 GB with ECC) sustains flow-table lookups. The industrial -40C to +105C temperature range is essential for outdoor enclosure deployment. The MPC8544CVTANGA places one GbE MAC for WAN side, with downstream PCIe adding 4-8 GbE ports via a PCIe-to-Ethernet bridge IC.
Recommandé
Factory Automation Controller
For factory automation and PLC backplanes, the MPC8544CVTANGA integrates CPU + DDR controller + PCIe + GPIO + UART in one FCBGA package, shrinking BOM and reducing failure surfaces on the production line. Its industrial -40C to +105C rating suits cabinet-side installation, and the dual I2C bus supports sensor and EEPROM chains. A typical application hosts a deterministic real-time Linux kernel (PREEMPT-RT patch) plus EtherCAT master firmware offloaded onto the 1 GbE MAC. Compared with discrete CPU-plus-chipset designs, the SoC approach saves 30-40 percent PCB area and reduces JTAG-only debug scenarios by unifying the boot chain.
Recommandé
Defense / Aerospace Networking Line Card
Aerospace and defense switching line cards use the MPC8544CVTANGA for its high-reliability FCBGA substrate, industrial -40C to +105C temperature operation, and NXP's controlled-bom aerospace program support. The integrated PCIe endpoint provides backplane connectivity to chassis switches, while the DDR2 with ECC protects against single-event upsets (SEU) at altitude. Designers pair the SoC with radiation-hardened FPGAs (for cryptographic offload) over PCIe, leveraging the e500 core for control-plane packet processing. Its Power Architecture heritage is widely supported by green-hills INTEGRITY and VxWorks 653 avionics RTOSes.
Recommandé
Edge Compute Gateway / Industrial IoT
The MPC8544CVTANGA forms the core of edge compute gateways where mid-range CPU performance (800 MHz e500) is sufficient for protocol translation, MQTT broker logic, and local analytics. Its on-chip USB 2.0 (via UTMI+EHCI) attaches a Bluetooth or ZigBee dongle for low-power wireless backhaul to legacy industrial sensors. The integrated GbE MAC provides wire-speed protocol bridging to upstream SCADA systems. Industrial IoT deployments benefit from the part's extended temperature range and from NXP's 10+ year longevity commitment for the MPC85xx family.
Recommandé
Solid-State Drive (SSD) Storage Controller Host
Mid-range enterprise SSD controllers embed the MPC8544CVTANGA to bridge SATA/SAS to PCIe upstream ports. The 800 MHz e500 core sustains SATA 6 Gbps and SAS 12 Gbps link-layer processing, while the integrated DDR2 controller buffers flash translation layer (FTL) tables. Industrial-rated SSDs targeting defense and outdoor telecom use the part's -40C to +105C operation. The SoC's GPIO and I2C interfaces are commonly used for thermal sensor and power-management IC telemetry. Pair the MPU with a TI or Analog Devices hot-swap controller for enterprise JBOD scenarios.
Recommandé
Printer/MFP Image Processing Backend
High-end multifunction printer (MFP) controllers use the MPC8544CVTANGA to drive the image-processing pipeline: 1200 dpi scan data through JPEG2000 compression, RIP rendering, and dual GbE/USB for office network and walk-up print. The 783-FCBGA package combines a powerful e500 core with extensive peripherals in a footprint that supports integrated print/scan engine controller cards. Compared with a discrete CPU/GPU pair, the SoC reduces system cost by 25-30 percent while maintaining deterministic real-time behavior for print jobs.
Recommandé
Medical Imaging Edge Node
Medical imaging edge nodes (ultrasound beamformer companions, patient-monitor data hubs) use the MPC8544CVTANGA for its industrial temperature range, hardware determinism, and long lifecycle. The SoC aggregates DICOM data from a PCIe-frame-grabber over its PCIe endpoint, performs on-board filtering, and pushes results upstream over the integrated 1 GbE MAC. The e500 core's ECC-protected memory subsystem supports transient SEU detection required for IEC 60601-1 deployments with margin, though formal certification is the integrator's responsibility. Pair the part with medical-grade ADCs and isolated serial line drivers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8544CVTANGA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8544CVJANGA | MPC8544CVTANG | MPC8544EVTANGA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) | 783-FCBGA (29x29) | 783-FCBGA (29x29) |
| Core | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500 + SEC, 1 core |
| Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz (with security engine) |
| Industrial Temperature Range | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| DDR1/DDR2 Controller | Yes (with ECC, up to 1 GB) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| PCI Express | x4 endpoint/root complex | x4 endpoint/root complex | x4 endpoint/root complex | x4 endpoint/root complex |
| 1 GbE MAC | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) |
Principaux différenciateurs
- Industrial -40C to +105C operation with full 800 MHz performance (vs MPC8544CVTANG)
- Drop-in pin-compatibility with the security-equipped E variant (vs MPC8544EVTANGA)
- Identical package as MPC8536 family for fan-out reuse (vs MPC8536ECVTANGA)
Notes de conception
Estimated: At 800 MHz with the default 1.0 V core supply (~3-5 W typical CPU power per NXP silicon characterization), plus DDR2 I/O and SerDes power, total board dissipation is approximately 5-9 W steady-state. Use the recommended thermal via array under the die and at least 6 layer PCB with a 2 oz inner copper ground pour. Provide forced airflow (~2 m/s) over the FCBGA to keep the junction below 105C in industrial enclosures.
Route DDR2 traces first as matched-length pairs using fly-by topology to terminate at the VTT island. The 783-FCBGA's 1 mm ball pitch demands microvia (laser-drilled) or via-in-pad construction on the break-out layer; assign 4 PCB layers for power and 8-10 layers total. Use the Altium/KiCad BGA fan-out pattern guidelines from NXP's application note AN3330.
Separate analog and digital ground returns around the chip; on-chip SGMII PHY requires a clean 1.0 V analog rail with a ferrite bead isolation. Keep the PCIe lanes within 5 cm of the BMC connector to preserve signal integrity. Avoid routing any signal under the FCBGA's thermal pad and ensure the JTAG TDI/TDO pins have a pull-up/pull-down per reference manual chapter 12.
BGA parts ship in MSL-3 moisture-sensitive packaging; bake per JEDEC J-STD-033 before assembly. The CCB clock tree requires explicit programming in RCW (Reset Configuration Word) before the e500 core responds - many boot failures trace back to corrupted RCW sources. Verify all four Local Bus Reset strapping options before production.
Sequencing of the 1.0 V core, 2.5 V DDR, and 3.3 V I/O rails must follow NXP's power-up ordering (core before I/O, or ramped together). Use the MAX174ACWI or similar supervisor with proper sequencing delays. Add bulk decoupling (47 uF polymer) close to each FCBGA power pad pair to suppress core-noise transients that would otherwise corrupt e500 PLL lock attempts.
Informations de conformité
RoHS compliant per NXP product page. Industrial temperature grade -40C to +105C, not AEC-Q100 qualified for automotive. NXP's MPC85xx family is included in NXP's product longevity program.
