MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
Référence : MPC8547EVTATGD ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $143.65 | $143,65 |
| 10 | $132 | $1 320,00 |
| 100 | $119.5 | $11 950,00 |
| 250 | $110 | $27 500,00 |
| 1 000 | $98.5 | $98 500,00 |
MPC8547EVTATGD Présentation
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instruction streams fetched from external or on-chip memory. The MPC85xx family belongs to the broader Power Architecture embedded processor category, which sits within the system-on-chip (SoC) tier that integrates CPU cores, memory controllers, and I/O bridges into a single device. This integration reduces board complexity, BOM cost, and PCB area compared with multi-chip discrete designs.
Key specifications include a 32-bit PowerPC e500 core with 32 KB L1 instruction and data caches, 256 KB L2 cache, and an integrated double-precision FPU and signal-processing engine (SPE). Memory support covers DDR and DDR2 with ECC; on-chip connectivity includes 4 x Gigabit Ethernet, 2 x PCIe, 2 x Serial RapidIO, PCI/PCI-X, local bus, I2C, DUART, GPIO, USB 2.0, and SPI. Per the datasheet, the -105C temperature grade (-TGD suffix) supports industrial environments up to 105C ambient.
Architecturally, the device integrates security (SEC 3.x) for encryption and IPsec/SSL offload, an SPE for DSP-style computation, and patented QUICC Engine technology for flexible protocol handling. The MPC8547E variant adds encryption acceleration, distinguishing it from the non-E MPC8547. Operating voltages are 1.0V core, 1.5V/1.8V DDR2, and 2.5V/3.3V I/O per the datasheet.
Typical applications include industrial routers, network switches, media gateways, military/aerospace secure communications, factory automation controllers, and intelligent storage platforms. The combination of high CPU throughput, hardware encryption, and multi-protocol I/O makes it well suited for line-card processing in routers and storage controllers that require low-latency data movement.
When designing with this device, allocate at least four PCB layers with continuous power and ground planes under the BGA, and follow NXP application notes for DDR2 trace length matching. The 783-FCBGA requires advanced assembly (ENIG or ENEPIG finish, X-ray inspection); production boards should target IPC-6012 Class 3 acceptance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet itself, including a comparison table against the closest MPC85xx and competing Power Architecture parts.
Alternatives de remplacement direct pour MPC8547EVTATGD — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8547EVTATGD (même facteur de forme et même empreinte) — différant par Mounting Type, Core Architecture, Series, Core Voltage, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8548EVTAQGD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8547EVTAUJB
✅ Remplacement direct✓ En stock
$124.5 / unité
Voir la fiche technique →MPC8548EVTAUJB
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →MPC8536CVJAULA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8543VTANGD
✅ Remplacement direct✓ En stock
$152 / unité
Voir la fiche technique →MPC8547EVTATGD Valeurs maximales et caractéristiques électriques
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Width | 32-Bit |
| Core Frequency | 1.2 GHz |
| Series | MPC85xx (PowerQUICC III) |
| Co-Processors / DSP | Signal Processing Engine (SPE); Security Engine (SEC 3.x) |
| RAM Controllers | DDR, DDR2, SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None integrated |
| Ethernet | 4 x 10/100/1000 Mbps (GigE) |
| PCI / PCIe / SRIO | PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO |
| Other I/O | Local bus, I2C, DUART, GPIO, USB 2.0, SPI |
| Température de fonctionnement | 0C to +105C (industrial grade per -TGD suffix) |
| I/O Voltages | 1.8V / 2.5V / 3.3V |
| Boîtier / Format | 783-BBGA, FCBGA (29 x 29 mm) |
| Type de montage | Surface Mount |
| Part Status | Obsolete |
| Process Technology | 0.09 um CMOS |
Guide de configuration des broches du MPC8547EVTATGD 783-bbga, fcbga (29 x 29 mm)
Configuration des broches du MPC8547EVTATGD (boîtier 783-bbga, fcbga (29 x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8547EVTATGD.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8547EVTATGD convient pour 6 applications: Industrial Routers and Gateways, Network Switches and Line Cards, Secure Communications and Defense Systems, Storage Controllers and RAID Adapters, Factory Automation and Industrial Control, Media Gateways and Unified Communications.
Industrial Routers and Gateways
The MPC8547EVTATGD's 1.2 GHz PowerPC e500 core with integrated hardware encryption (SEC 3.x) and 4 Gigabit Ethernet MACs makes it well suited to industrial router line cards. The device handles IPsec/SSL/TLS acceleration at multi-gigabit rates without consuming CPU cycles, while the integrated SPE assists with packet classification and deep packet inspection. With DDR2-667 ECC support, it can drive substantial route-table lookups and queuing without off-chip memory bandwidth bottlenecks. Operating up to 105C, it tolerates fanless industrial enclosures and outdoor deployments. Use the 2 PCIe and 2 Serial RapidIO lanes for coprocessor cards or backplane interconnect to fabric switches.
Recommandé
Network Switches and Line Cards
Designed for PowerQUICC III line-card processing, the MPC8547EVTATGD provides multiplexed PCI/PCI-X, PCIe, and Serial RapidIO interfaces that can directly attach to switch fabric ASICs. Its DDR2 controller with ECC keeps packet buffers in coherent memory, and the local bus interfaces with glue-less FIFOs for traffic shaping. The integrated security engine accelerates MACsec and IPsec at line rate for encrypted backplane trunks, while the SPE handles QoS and metering math. The 783-FCBGA integrates a large die area for sustained routing throughput, making it a solid choice for managed Layer 2/3 switches in enterprise and industrial networks.
Recommandé
Secure Communications and Defense Systems
The MPC8547EVTATGD's hardware SEC 3.x engine provides IPsec, SSL/TLS, and bulk encryption offload, while the ruggedized 105C temperature grade allows deployment in defense electronics and secure gateways. The SoC platform has a long pedigree in military-grade routers and Tactical Secure Communications (TSC) systems, with extensive BSP and RTOS support from vendors such as Green Hills INTEGRITY and Wind River VxWorks. The combination of deterministic PowerPC behavior, hardware cryptography, and multi-protocol I/O makes it a proven choice for tactical radios, mobile command platforms, and crypto devices.
Recommandé
Storage Controllers and RAID Adapters
The MPC8547EVTATGD's PCI-X and PCIe lanes provide direct attach to SAS/SATA controllers or NAND gate arrays in RAID and SSD storage subsystems. The integrated DDR2 controller with ECC delivers correction needed for flash translation layer (FTL) workloads, while the SPE offloads XOR and Reed-Solomon parity computations from the e500 core. GigE and 10 GigE-capable SerDes (depending on board design) allow iSCSI or NAS appliance front-end networking. For smart-array controllers, the device's deterministic real-time response simplifies command queuing and rebuild prioritization.
Recommandé
Factory Automation and Industrial Control
Industrial PLCs and motion controllers benefit from the MPC8547EVTATGD's combination of 1.2 GHz deterministic compute, hardware encryption for secure fieldbus protocols, and a 105C temperature grade for cabinet installation. The integrated I2C, SPI, DUART, and GPIO simplify direct attach of sensors, motor drivers, and HMIs without an external bridge chip. The local bus can directly drive parallel industrial displays or expansion modules. With fieldbus protocols such as EtherCAT, PROFINET, and EtherNet/IP available via partner stacks, the device supports modern Industry 4.0 controller designs.
Recommandé
Media Gateways and Unified Communications
Telecommunications media gateways leverage the MPC8547EVTATGD's signal-processing engine (SPE) for VoIP transcoding and packetization, while the 4 GigE interfaces aggregate SIP trunks and PSTN media streams. The integrated security engine secures SIP/TLS and SRTP sessions without taxing the main CPU, and DDR2 with ECC ensures reliable signaling traffic. Operating up to 105C, the device tolerates carrier-grade chassis thermal envelopes while supporting legacy TDM interfaces via the local bus or external framer.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8547EVTATGD — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8548EVTAQGD | MPC8547EVTAUJB | MPC8548EVTAUJB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (same) | 783-FCBGA (same) | 783-FCBGA (same) |
| Core Frequency | 1.2 GHz | Higher speed bin (>1.2 GHz) | Lower speed bin (<1.2 GHz) | Higher speed bin (>1.2 GHz) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Core Processor | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Security Engine | SEC 3.x | SEC 3.x | SEC 3.x | SEC 3.x |
| Gigabit Ethernet | 4 x 10/100/1000 Mbps | 4 x 10/100/1000 Mbps | 4 x 10/100/1000 Mbps | 4 x 10/100/1000 Mbps |
| RAM Controller | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| Lifecycle Status | Obsolete | NRND / transitioning | Obsolete | NRND / transitioning |
Principaux différenciateurs
- Highest speed bin within the MPC8547E industrial-temperature family (vs MPC8547EVTAUJB)
- Industrial 105C temperature grade versus commercial grade of the -UJB variants (vs MPC8547EVTAUJB)
- Drop-in compatibility with MPC8548 family for higher throughput upgrade paths (vs MPC8548EVTAQGD)
Notes de conception
The MPC8547EVTATGD in a 783-FCBGA package can dissipate several watts at full core load; pair the BGA with at least 4 thermal vias under the central die area and a copper coin or heatsink to keep the junction below 105C. Estimated: at 1.0V core and 1.2 GHz with all peripherals active, junction-to-ambient thermal resistance typically falls in the 12-18 C/W range for a well-designed 6-layer board, but should be confirmed by thermal simulation against your specific PCB stack-up. Without adequate cooling, sustained workloads risk thermal throttling or premature failure in enclosed industrial enclosures.
Design the PCB as a minimum 6-layer stack-up with continuous ground and power planes under the BGA to provide low-impedance return paths and signal-integrity margins for DDR2 at 667 MT/s. Use the ENIG or ENEPIG surface finish to ensure solderability of the large BGA pads, and follow NXP application notes for via-in-pad design and microvia fabrication. Estimated trace lengths should be matched within +/-25 mils for DDR2 byte lanes; bypass capacitors must be placed as close as possible to every power pin. Confirm all recommendations against the latest NXP hardware specifications document before tape-out.
The MPC8547EVTATGD requires careful boot configuration via reset configuration word (RCW) resistors sampled at PORESET deassertion; incorrect resistor networks lock the device out of operation and require board rework. Use NXP CodeWarrior or similar tool to generate the RCW and double-check that default SerDes protocol mapping matches your board topology. Always validate power-up sequencing: 1.0V core must ramp before 1.5V/1.8V DDR I/O and well before 2.5V/3.3V I/O, otherwise internal ESD structures can latch up.
Informations de conformité
RoHS compliance inferred from NXP product listing; halogen-free status and full REACH dossier should be requested from NXP via the product compliance portal. AEC-Q100 is not applicable as this is an industrial-grade MPU rather than an automotive-grade IC.
