MPC8547EVTATGD vs MPC8543VTANGD Comparaison

Comparaison détaillée côte à côte de MPC8547EVTATGD par NXP Semiconductors et MPC8543VTANGD par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Actif

Comparaison des spécifications

Paramètre MPC8547EVTATGD MPC8543VTANGD
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Obsolete Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $98,50 $152,00
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Width 32-Bit —
Core Frequency 1.2 GHz —
Series MPC85xx (PowerQUICC III) PowerQUICC III
Co-Processors / DSP Signal Processing Engine (SPE); Security Engine (SEC 3.x) —
L1 Cache (I/D) 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table] —
L2 Cache 256 KB [DATA_NEEDED: confirm from datasheet] 256 KB
RAM Controllers DDR, DDR2, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers None integrated —
Ethernet 4 x 10/100/1000 Mbps (GigE) —
PCI / PCIe / SRIO PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO —
Other I/O Local bus, I2C, DUART, GPIO, USB 2.0, SPI —
Température de fonctionnement 0C to +105C (industrial grade per -TGD suffix) 0 °C to +105 °C
Core Voltage 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table] 1.0 V (typical)
I/O Voltages 1.8V / 2.5V / 3.3V 1.8 V / 2.5 V / 3.3 V
Operating Temperature Range per DigiKey -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm] —
Boîtier / Format 783-BBGA, FCBGA (29 x 29 mm) —
Type de montage Surface Mount Surface Mount (BGA)
Part Status Obsolete —
Process Technology 0.09 um CMOS 90 nm CMOS
Statut RoHS Compliant [DATA_NEEDED: confirm via NXP product page] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Package Type — FCBGA-783 (29x29 mm)

Fiches techniques et ressources

Parcourir tous les produits Créer un BOM Demander un devis