MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP
Référence : MPC8572ECVTAVNE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $413.64 | $413,64 |
| 10 | $388.42 | $3 884,20 |
| 100 | $362.18 | $36 218,00 |
| 500 | $334.27 | $167 135,00 |
| 1 000 | $308.55 | $308 550,00 |
MPC8572ECVTAVNE Présentation
What is a PowerQUICC III communications processor? A PowerQUICC III is a high-integration system-on-chip (SoC) that combines one or more PowerPC processor cores with specialized communications peripherals (Ethernet MACs, PCI Express, security engines). It sits in the broader taxonomy of embedded microprocessors -> MPU -> application processor -> SoC -> networking SoC, and is widely deployed in routers, switches, base stations, and storage platforms where deterministic packet processing is required.
Key features of the MPC8572E include dual e500 cores with MMU and double-precision FPU support, integrated DDR2/DDR3 memory controller with ECC, four 10/100/1000 Mbit Ethernet MACs, two PCI Express interfaces, dual Serial RapidIO endpoints, and an integrated security engine (SEC 4.0) for IPSec, SSL/TLS, and Kasumi/Snow 3G cipher acceleration. The device also exposes a Local Bus Controller, four I2C, four UART, and GPIO for legacy peripheral integration.
Architecturally the device pairs a hierarchical bus structure with the CoreNet platform coherency fabric, allowing the two cores and I/O engines to share memory and peripherals coherently while maintaining deterministic traffic shaping. The 1023-ball FCBGA delivers the high pin density required for the parallel memory and multiplexed I/O buses, and demands a multilayer PCB with controlled-impedance routing and a thermal solution rated for the device's typical power envelope.
Typical applications include enterprise routers, multi-service switches, LTE base-station baseband cards, IP-PBX platforms, network-attached storage controllers, and industrial gateways. The integrated security engine makes it well suited for VPN concentrators and SSL offload appliances, while the dual-core architecture supports control-plane plus data-plane partitioning.
A primary design consideration is thermal management: at 1.5 GHz with both cores active the device dissipates significant power, requiring thermal vias under the package and a heatsink in most production designs. Power sequencing of the 1.1 V core rail and the 1.8/2.5/3.3 V I/O rails must follow the datasheet order to avoid latch-up.
This page synthesizes distributor pricing, drop-in MPC8572 family alternatives, and practical board-design considerations not assembled in the NXP datasheet alone.
Alternatives de remplacement direct pour MPC8572ECVTAVNE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572ECVTAVNE (même facteur de forme et même empreinte) — différant par Memory Controller, Core Architecture, L2 Cache, Mounting Type, PCI Express.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572ECVTAVNB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572ECPXAULD
✅ Remplacement direct✓ En stock
$219.8 / unité
Voir la fiche technique →MPC8572E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8548EVJAUJD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572ECVTAVNE Valeurs maximales et caractéristiques électriques
| Processor Type | MPC85xx PowerQUICC III |
| Core Architecture | PowerPC e500, dual-core, 32-bit RISC |
| Maximum CPU Clock | 1.5 GHz |
| Process Technology | 0.09 um CMOS |
| Core Voltage | 1.1 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Number of Cores | 2 |
| Memory Controller | DDR2/DDR3 with ECC (per datasheet family) |
| Ethernet MACs | 4x 10/100/1000 Mbit |
| PCI Express | 2x PCIe interfaces |
| Serial RapidIO | 2x endpoints |
| Security Engine | SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G) |
| Boîtier | 1023-ball FCBGA (33x33 mm) |
| Type de montage | Surface Mount |
Guide de configuration des broches du MPC8572ECVTAVNE 1023-ball fcbga (33x33 mm)
Configuration des broches du MPC8572ECVTAVNE (boîtier 1023-ball fcbga (33x33 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8572ECVTAVNE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8572ECVTAVNE convient pour 6 applications: Enterprise Router / Switch Control Plane, LTE Base Station Baseband Card, IPSec / SSL VPN Concentrator, Network-Attached Storage (NAS) Controller, Industrial Gateway / Edge Router, VoIP / IP-PBX Media Gateway.
Enterprise Router / Switch Control Plane
The MPC8572ECVTAVNE's dual e500 cores at 1.5 GHz handle routing-table lookup, OSPF/BGP convergence, and management-plane tasks while the integrated four Gigabit Ethernet MACs aggregate line-card traffic. Its 1.1 V core plus 1.8/2.5/3.3 V I/O rails are typical of mid-range L3 switches, and the FCBGA-1023 package provides the pin density required for parallel DDR2/DDR3 plus four SerDes lanes.
Recommandé
LTE Base Station Baseband Card
For LTE eNodeB designs, the MPC8572ECVTAVNE's dual e500 cores can be partitioned one-per-sector or one-for-PHY/one-for-stack, while the SEC 4.0 engine accelerates Kasumi (UMTS) and Snow 3G (LTE) ciphering at line rate. The Serial RapidIO endpoints aggregate baseband data from RF cards, and PCI Express links to the digital front-end ASIC. At 1.5 GHz the device meets LTE 20 MHz channel processing budgets.
Recommandé
IPSec / SSL VPN Concentrator
The integrated SEC 4.0 crypto engine delivers multi-Gbps IPSec and SSL/TLS throughput for VPN concentrators, offloading AES-256/SHA-2 from the e500 cores. The four Gigabit Ethernet MACs feed encrypted traffic to uplink ports, and the dual-core architecture dedicates one core to crypto offload scheduling. FCBGA-1023 ensures the multi-lane SerDes and DDR bandwidth needed for line-rate security.
Recommandé
Network-Attached Storage (NAS) Controller
The MPC8572ECVTAVNE integrates a high-bandwidth memory subsystem plus dual PCI Express and Serial RapidIO links, making it a capable NAS/SAN controller SoC. The dual e500 cores handle file-system metadata and RAID parity calculation, while the Ethernet MACs expose iSCSI/NFS ports. DDR2/DDR3 ECC support protects data integrity across large memory footprints.
Recommandé
Industrial Gateway / Edge Router
For industrial Ethernet gateways the MPC8572ECVTAVNE's combination of legacy local-bus, UART, I2C, GPIO plus modern PCI Express and RapidIO enables bridging between factory-floor protocols and uplink Ethernet. The dual cores run a real-time OS plus management-plane networking stack, and the security engine protects operational-technology traffic crossing into IT networks.
Recommandé
VoIP / IP-PBX Media Gateway
Voice media gateways use the MPC8572ECVTAVNE to handle RTP packetization, jitter buffering, and codec processing on its dual e500 cores, while PCI Express links to DSP cards accelerate voice transcoding. The integrated security engine secures SIP/TLS and SRTP media streams. The 1.5 GHz clock provides ample MIPS for hundreds of concurrent VoIP channels per chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572ECVTAVNE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572ECVTAVNB | MPC8572ECPXAULD | MPC8572E | MPC8548EVJAUJD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA - same family but verify ball map |
| Number of Cores | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 1 (single e500) |
| Security Engine (SEC 4.0) | Yes | Yes | Yes | Yes | Yes |
| PCI Express Interfaces | 2 | 2 | 2 | 2 | 1 (predecessor) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Obsolete / Legacy |
Principaux différenciateurs
- Dual-core e500 in a 1023-FCBGA at 1.5 GHz with integrated security engine (vs MPC8548EVJAUJD)
- Two PCI Express interfaces versus the single PCIe on the older MPC8548E (vs MPC8548EVJAUJD)
- Same 1023-FCBGA package across the family (vs MPC8572ECVTAVNB / MPC8572ECPXAULD)
Notes de conception
At 1.5 GHz with both e500 cores active the MPC8572ECVTAVNE typically dissipates 15-25 W, demanding a copper spreader, thermal interface material, and forced airflow in most chassis designs. Place thermal vias directly under the FCBGA land pattern to drop theta-JC to the PCB inner planes. Estimate (not a datasheet figure): with a 25 W dissipation and theta-JA of ~10 C/W (heatsink plus 200 LFM airflow), junction temperature rises ~250 C above ambient - derate per NXP's thermal model for your specific enclosure.
The MPC8572ECVTAVNE requires four voltage rails (1.1 V core, 1.8 V, 2.5 V, 3.3 V I/O) plus DDR termination VTT. Sequence the rails per the datasheet - the 1.1 V core must reach stable regulation before the I/O rails or latch-up may occur. Use a multi-rail PMIC with enable sequencing (NXP MC34VR500 or similar) rather than discrete regulators for cleanest turn-on. Verify in-rush and load-step behavior with an oscilloscope on each rail at first power-up.
The 1023-ball FCBGA demands a multilayer PCB (typically 8-12 layers) with microvia or stacked-via technology to fan out from the 1.0 mm ball pitch. DDR2/DDR3 traces must be length-matched within the byte-lane tolerance stated in the datasheet, and PCI Express / Serial RapidIO lanes require 85 ohm differential impedance with intra-pair skew under 5 ps. Reference NXP's hardware-design guidelines for layer stack and via pattern.
The Ethernet SerDes, PCI Express, and Serial RapidIO links all run at multi-Gbps speeds and are highly sensitive to PCB crosstalk. Maintain at least 3W (3x dielectric thickness) spacing between high-speed differential pairs and adjacent signals, and use ground-guard vias between channels. Series AC-coupling capacitors must be placed symmetrically; for PCIe, the 100 nF caps must be on the TX side per the spec.
Do not assume the 'AVNE' suffix means a specific feature set across all MPC8572E lots - the suffix encodes speed grade, voltage screening, and temperature bin. Always re-validate firmware boot, SerDes link training, and DDR2/DDR3 margining when swapping even between seemingly identical suffix codes. Also verify JTAG boundary-scan before first board bring-up; the FCBGA's hidden solder joints cannot be inspected post-reflow without X-ray.
Informations de conformité
RoHS and REACH compliance assumed from the 'NE' suffix convention and NXP/Freescale product family policy. Halogen-free status not stated in the verified web data and set to 'unknown'. AEC-Q100 not applicable - this is a networking/comms SoC, not an automotive-qualified part.