MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP
Référence : MPC8572ECLVTAULE ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252.5 | $2 525,00 |
| 100 | $198.75 | $19 875,00 |
| 500 | $165 | $82 500,00 |
| 1 000 | $142.5 | $142 500,00 |
MPC8572ECLVTAULE Présentation
An MPU (Microprocessor Unit) is a system-on-chip CPU that integrates one or more processor cores, memory controllers, and a wide range of peripheral interfaces on a single die, enabling compact embedded and networking designs. The MPC8572E family sits within NXP's PowerQUICC III tier of communications processors, which historically target routers, switches, base stations, and other packet-processing equipment where deterministic performance and rich I/O are required. The hierarchy is: PowerPC e500 core -> PowerQUICC III SoC -> communications processor -> embedded microprocessor.
Key features of the MPC8572ECLVTAULE include dual e500 cores with symmetric multiprocessing support, integrated DDR2/DDR3 SDRAM controller with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs with SGMII support, Serial RapidIO fabric, hardware-accelerated security engine, and 32-bit peripheral support. The silicon revision is R2.2.1 (the 'E' suffix). The 1023-ball FCBGA package is optimized for high-speed signal integrity and supports extensive I/O for networking applications.
The architecture pairs two e500 cores with NXP's QUICC Engine technology for fast-path packet processing, offloading networking tasks from the cores and enabling line-rate throughput on GbE and RapidIO links. The SEC block accelerates IPSec, SSL/TLS, and other cryptographic workloads used in secure communications gear. A high-bandwidth system bus and dedicated DMA channels keep the cores fed with data.
Typical applications include enterprise routers and switches, LTE/4G and 3G base station baseband processing, network-attached storage (NAS) controllers, industrial control planes, secure VPN concentrators, and military/aerospace communications. The extended temperature rating (-40C to +105C) suits outdoor and industrial deployments.
When designing with this device, allocate adequate PCB layers (typically 8-10 minimum for the FCBGA breakout), provide a high-current low-ripple supply for the DDR controller, and follow NXP application notes for thermal management of the 33x33 mm FCBGA. Designers should also verify software/firmware support for the R2.2.1 silicon revision in their toolchain.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet. Verified against NXP product page and DigiKey/Mouser listings as of 2026-10-17.
Alternatives de remplacement direct pour MPC8572ECLVTAULE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8572ECLVTAULE (même facteur de forme et même empreinte) — différant par Core Architecture, Memory Controller, Silicon Revision.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8572EVTAULE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8572ECLVTAJND
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8572EVTATLE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P2020NSN2MHC
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MPC8572ECLVTAULE Valeurs maximales et caractéristiques électriques
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500, dual-core |
| Core Count | 2 |
| Largeur du bus de données | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| PCI Express Interfaces | 3 x PCIe |
| Ethernet | Dual Gigabit Ethernet (SGMII) |
| High-Speed Serial | Serial RapidIO (SRIO) |
| Security Engine | Yes (SEC) - IPSec/SSL/TLS acceleration |
| Boîtier | 1023-ball FCBGA (33x33 mm) |
| Température de fonctionnement | -40C to +105C |
| Silicon Revision | R2.2.1 |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du MPC8572ECLVTAULE 1023-ball fcbga (33x33 mm)
Configuration des broches du MPC8572ECLVTAULE (boîtier 1023-ball fcbga (33x33 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8572ECLVTAULE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8572ECLVTAULE convient pour 6 applications: Enterprise Routers and Switches, Wireless Base Station Baseband, Network-Attached Storage (NAS) Controllers, Secure VPN Concentrators, Industrial Control and Automation, Military and Aerospace Communications.
Enterprise Routers and Switches
The MPC8572ECLVTAULE's dual 1.333 GHz PowerPC e500 cores, hardware-accelerated security engine, and integrated dual GbE with SGMII make it a strong fit for mid-range enterprise routers and L2/L3 switches. The QUICC Engine offloads packet classification and forwarding from the cores, sustaining line-rate throughput on multiple GbE ports. The DDR2/DDR3 controller with ECC provides deterministic memory bandwidth for routing tables and ACL lookups.
Recommandé
Wireless Base Station Baseband
For 3G/4G base station baseband and control-plane processing, the MPC8572ECLVTAULE delivers dual 1.333 GHz compute for Layer 1/2 protocol stacks, the Serial RapidIO fabric for inter-board backplane connectivity, and the hardware security engine for encrypted backhaul. Its extended -40C to +105C temperature rating supports outdoor cabinet deployment in cell sites. For 5G migration, NXP's Layerscape family is the modern successor.
Recommandé
Network-Attached Storage (NAS) Controllers
The MPC8572ECLVTAULE can serve as the central SoC in mid-range NAS controllers, leveraging its dual cores for filesystem and RAID operations, three PCI Express interfaces for SAS/SATA controller attachment, and dual GbE for network-facing aggregation. The integrated security engine accelerates encrypted filesystem operations and IPSec-protected replication traffic. DDR3 with ECC support ensures data integrity for storage workloads.
Recommandé
Secure VPN Concentrators
For enterprise VPN concentrators, the MPC8572ECLVTAULE's hardware security engine (SEC) accelerates IPSec, SSL/TLS, and bulk cryptographic operations, offloading these from the cores to sustain higher concurrent tunnel counts. The dual GbE interfaces segregate trusted internal and untrusted external networks, while the extended temperature rating supports deployment in non-climate-controlled wiring closets.
Recommandé
Industrial Control and Automation
The MPC8572ECLVTAULE is suitable for industrial control plane processors thanks to its extended -40C to +105C temperature range, deterministic e500 architecture, and rich peripheral set including PCIe, GbE, and serial interfaces. Engineers can build deterministic control loops on top of Linux or an RTOS, with the hardware security engine providing authentication for industrial IoT deployments.
Recommandé
Military and Aerospace Communications
The MPC8572ECLVTAULE's extended temperature range and rugged packaging support military/aerospace communications systems including tactical routers, secure radios, and avionics networking. The hardware security engine provides FIPS-grade cryptographic acceleration required for Type-1 and other high-assurance links. Designers should verify radiation-hardness or shielding requirements separately as the part is not specifically rad-hard by design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572ECLVTAULE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572EVTAULE | MPC8572ECLVTAJND | MPC8572EVTATLE |
|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Core Clock | 1.333 GHz | 1.333 GHz | Lower speed grade | 1.333 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCI Express Interfaces | 3 x PCIe | 3 x PCIe | 3 x PCIe | 3 x PCIe |
| Ethernet | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) |
| Silicon Revision | R2.2.1 | R2.2.1 | R2.2.1 | R2.2.1 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- QUICC Engine fast-path offload (vs Generic ARM Cortex-A9 SoCs)
- Extended -40C to +105C industrial temperature (vs Commercial-grade CPUs (0 to 70C))
- Integrated hardware security engine (vs MPC8572CLVTAULE (pre-R2.2.1))
Notes de conception
Estimated: at 1.333 GHz dual-core active load, the MPC8572ECLVTAULE typically dissipates 8-12W in the 1023-FCBGA package. The 33x33 mm FCBGA has limited internal thermal dissipation; designers must use the full PCB top-layer thermal pad with thermal vias to an internal copper plane, plus a heatsink for sustained workloads. Junction-to-ambient thermal resistance without heatsink is roughly 15-20 C/W, so a junction-temperature derating analysis at 105C ambient is required for reliability.
The 1023-ball FCBGA at 33x33 mm requires an 8-10 layer PCB with 0.4 mm pitch fanout. Use laser-drilled blind/buried vias or microvia-in-pad for inner-row balls. Maintain 100 ohm differential impedance for PCIe, Serial RapidIO, and SGMII lanes. Provide a dedicated ground plane beneath the BGA and keep DDR2/DDR3 traces length-matched within 25 mil tolerance for the byte lanes. Reference NXP AN3660 for the recommended footprint and stack-up.
Provide a sequenced multi-rail power supply: 1.0V core, 1.5V/1.8V DDR, 2.5V/3.3V I/O. Use low-impedance decoupling with 0402/0201 ceramic capacitors within 2 mm of each power pin, plus bulk capacitors on each rail. The core rail must support >10A peak with <1% ripple; consider a multiphase VR controller such as NXP's VR5000 or Intersil ISL6364 for compliance. Sequence core before I/O to avoid latch-up.
Informations de conformité
RoHS/REACH/lead-free status not present in Verified Web Data; set to unknown per Data Authenticity Rules. AEC-Q100 is not applicable for communications MPUs. Per Partstack terminal-form data, the part is marked 'NoPb' on some listings, suggesting lead-free assembly, but official confirmation should be verified through NXP compliance certificates.