MPC8572EPXAULE - PowerQUICC III Dual-Core SoC, 1.33 GHz, FCPBGA-1023 | NXP
Référence : MPC8572EPXAULE ✓ ActifMPC8572EPXAULE Présentation
A communications SoC (System-on-Chip) is a highly integrated processor that combines general-purpose CPU cores, memory controllers, and specialized I/O peripherals on a single die, eliminating the need for a companion northbridge or I/O hub. The PowerQUICC III family sits within NXP's broader communications processor taxonomy: SoC -> multicore MPU -> PowerQUICC family -> PowerPC architecture -> RISC processor, and it is widely deployed in routers, switches, and line-card aggregation designs where deterministic I/O and deep protocol offload are required.
Key features include dual e500 cores with 36-bit physical addressing, integrated DDR2/DDR3 SDRAM controller with ECC, four Gigabit Ethernet MACs, two PCI Express interfaces, two Serial RapidIO endpoints, and a hardware-accelerated security engine (SEC) for IPSec, SSL/TLS, and bulk encryption. The device targets a 0 to +105 °C operating range, addressing thermally constrained telco and industrial environments.
Architecturally, the MPC8572EPXAULE uses a coherent shared-bus topology with a global queue manager, allowing deterministic task distribution between the two cores. CoreNet coherency fabric integrates the memory controller and switch fabric, simplifying board design while sustaining multi-Gbps aggregate throughput across Ethernet and RapidIO lanes.
Typical applications include multi-service routers, edge and aggregation switches, wireless baseband controllers, network-attached storage controllers, and industrial control platforms requiring secure, deterministic multi-core performance. The integrated SEC engine also suits VPN gateways and encrypted SAN front-ends.
When designing with this part, allocate adequate power and thermal headroom: at 1.333 GHz the part can dissipate tens of watts, requiring multiple PCB layers, a heatsink, and airflow. Ensure the boot ROM and CPLD/FPGA glue logic correctly drive the Local Bus, JTAG, and reset configuration pins according to the reference manual.
This page synthesizes distributor pricing, package-level drop-in analysis, and practical design notes drawn from NXP reference designs - context not duplicated on the manufacturer datasheet or typical distributor listings.
Alternatives de remplacement direct pour MPC8572EPXAULE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
MPC8572ECPXAULE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572ECVXAULE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EPXAVNE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8572EPXAULE Valeurs maximales et caractéristiques électriques
| Product Family | PowerQUICC III |
| Core Architecture | PowerPC e500 (dual-core) |
| Number of Cores | 2 |
| Maximum Core Frequency | 1.333 GHz |
| L2 Cache | 1 MB shared |
| Memory Controller | DDR2/DDR3 with ECC |
| Gigabit Ethernet MACs | 4 |
| PCI Express Interfaces | 2 |
| Serial RapidIO | 2 lanes (endpoint) |
| Security Engine | SEC (IPSec/SSL/TLS/bulk crypto) |
| Boîtier | 1023-ball FCBGA (FCPBGA-1023), 33x33 mm |
| Température de fonctionnement | 0 °C to +105 °C |
| Silicon Revision | R2.2.1 |
| Type de montage | Surface Mount |
| Lead-Free / Solder Finish | SnPb (per part suffix) |
| Niveau MSL | 3 (per JEDEC J-STD-020, recommended) |
Guide de configuration des broches du MPC8572EPXAULE 1023-ball fcbga (fcpbga-1023), 33x33 mm
Configuration des broches du MPC8572EPXAULE (boîtier 1023-ball fcbga (fcpbga-1023), 33x33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8572EPXAULE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8572EPXAULE convient pour 6 applications: Multi-Service Routers, Edge and Aggregation Switches, Wireless Baseband Controllers, Network-Attached Storage (NAS) Controllers, Industrial Control and Secure Gateways, Secure VPN / SSL Appliances.
Multi-Service Routers
The MPC8572EPXAULE's dual e500 cores at 1.333 GHz and four integrated Gigabit Ethernet MACs make it a strong fit for multi-service router line cards that need deep packet inspection and forwarding on the data plane. The 1 MB shared L2 cache and CoreNet coherency fabric sustain wire-rate routing table lookups and ACL evaluation under load, while the integrated SEC engine terminates IPSec/SSL tunnels without burdening the cores. Designers typically pair the device with NXP PHY transceivers and an external DDR3 with ECC, then run Linux with DPDK or u-boot + VxWorks for fast boot.
Recommandé
Edge and Aggregation Switches
For edge/aggregation switches, the MPC8572EPXAULE's combination of PCI Express endpoints and dual Serial RapidIO ports allows it to fan out to switching ASICs and line cards without an external bridge. The dual-core topology maps cleanly to control-plane and data-plane partitioning, with the queue manager distributing traffic deterministically. The DDR2/DDR3 controller with ECC handles deep routing-table storage, and the hardware SEC engine accelerates MACsec/IPsec for encrypted trunks. Telco chassis (0 to +105 °C) are within the device's thermal envelope.
Recommandé
Wireless Baseband Controllers
In wireless baseband controllers, the MPC8572EPXAULE's 1.333 GHz e500 cores execute PHY-layer signal processing and MAC scheduling, while its PCI Express and Serial RapidIO ports connect to RF front-end cards and baseband FPGA co-processors. The integrated SEC engine provides hardware-accelerated encryption for air-interface security (LTE/5G NR integrity protection). The shared L2 cache and coherent CoreNet fabric help maintain deterministic latency under bursty MAC scheduling loads typical of small-cell and picocell deployments.
Recommandé
Network-Attached Storage (NAS) Controllers
The MPC8572EPXAULE fits NAS controller designs that require RAID-on-chip compute, network protocol offload, and high-throughput storage I/O. Dual e500 cores handle file-system journaling and SMB/NFS/iSCSI request processing, while PCI Express and Serial RapidIO link to storage controllers and SAS expanders. The hardware SEC engine offloads SMB3 encryption (AES-CCM) and iSCSI IPsec, leaving the cores free for storage I/O. DDR3 with ECC ensures data integrity for transactional workloads.
Recommandé
Industrial Control and Secure Gateways
Industrial gateways benefit from the MPC8572EPXAULE's hardware SEC engine for VPN/IPsec termination between plant-floor controllers and enterprise networks. Dual cores handle deterministic real-time protocol stacks (e.g., EtherCAT, PROFINET) and HTTP/SQL/SCADA traffic in parallel. The 0 to +105 °C thermal envelope tolerates enclosed industrial cabinets with limited airflow. PCI Express interfaces connect to industrial Ethernet PHYs and field-bus cards, while Serial RapidIO links to motion-control FPGA co-processors.
Recommandé
Secure VPN / SSL Appliances
The integrated SEC engine makes the MPC8572EPXAULE an excellent fit for dedicated VPN/SSL appliances that need line-rate AES/3DES/SHA offload. Dual cores handle session establishment and policy management while the SEC engine sustains multi-Gbps encrypted tunnels. The four Gigabit Ethernet MACs support WAN/LAN/DMZ segmentation, and PCI Express connects to high-speed crypto accelerators or NV storage for audit logs. Telco-grade temperature range (0 to +105 °C) suits appliance chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8572EPXAULE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8572ECPXAULE | MPC8572ECVXAULE | MPC8572EPXAVNE |
|---|---|---|---|---|
| Package | 1023-FCPBGA (33x33 mm) | 1023-FCPBGA (33x33 mm) - same | 1023-FCPBGA (33x33 mm) - same | 1023-FCPBGA (33x33 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Cores | 2x PowerPC e500 | 2x PowerPC e500 - same | 2x PowerPC e500 - same | 2x PowerPC e500 - same |
| Max Core Frequency | 1.333 GHz | 1.333 GHz - same | 1.333 GHz - same | 1.333 GHz - same |
| L2 Cache | 1 MB shared | 1 MB shared - same | 1 MB shared - same | 1 MB shared - same |
| Memory Controller | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC - same | DDR2/DDR3 + ECC - same | DDR2/DDR3 + ECC - same |
| Gigabit Ethernet MACs | 4 | 4 - same | 4 - same | 4 - same |
| PCI Express Lanes | 2 interfaces | 2 - same | 2 - same | 2 - same |
| Security Engine | Integrated SEC | Integrated SEC - same | Integrated SEC - same | Integrated SEC - same |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C - same | 0 °C to +105 °C - same | Extended - verify exact spec |
Principaux différenciateurs
- Only 1023-FCPBGA member with default factory silicon revision (vs MPC8572ECPXAULE / MPC8572ECVXAULE)
- Integrated Security Engine (SEC) for crypto offload (vs MPC8572PXAULE (non-E))
- Dual e500 cores with shared 1 MB L2 cache (vs Single-core PowerQUICC III (MPC8536))
Notes de conception
The MPC8572EPXAULE can dissipate tens of watts at 1.333 GHz under full dual-core load with active SerDes. Place a heatsink rated for the chassis airflow profile, and provide at least 4 PCB layers with continuous ground plane beneath the BGA. Verify junction temperature with on-die thermal diode and NXP-supplied calibration data; aim for < 95 °C Tj in worst-case corner.
Use a 33x33 mm land pattern matching the 1023-ball FCBGA (1 mm pitch per NXP package drawing). Escape traces on outer layers through via-in-pad is recommended for signal integrity; co-routing SerDes lanes requires matched-length, 90 Ω differential impedance, and continuous reference planes. Follow NXP's MPC8572 hardware design guide for DDR3 and SerDes routing rules.
Decouple the MPC8572EPXAULE with a stack of bulk + ceramic capacitors near each power rail (core VDD, DDR PHY VDD, SerDes AVDD, PLL AVDD). Use an NXP-recommended power sequencing controller to enforce core-before-I/O ramp-up. Add a soft-start circuit on the upstream DC-DC to limit inrush current during boot.
Do not assume the MPC8572EPXAULE is drop-in compatible with earlier PowerQUICC III parts (MPC8548 uses 783-FCPBGA, MPC8536 uses 676-FCPBGA). Verify boot ROM configuration against the silicon revision (R2.2.1) and check JTAG/CCSR defaults after each reset. The 'E' suffix is required for the SEC engine - non-E variants do not include crypto acceleration.
Informations de conformité
Solder finish per part suffix 'LE' indicates SnPb (leaded) - the part is NOT lead-free per the verified supplier listing. RoHS/REACH status not explicitly stated in the verified web data and marked unknown.
