MPC859DSLZP66A - 66MHz PowerQUICC MPU 357-BGA | NXP
Référence : MPC859DSLZP66A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1 685,00 |
| 100 | $152 | $15 200,00 |
| 500 | $138.75 | $69 375,00 |
| 1 000 | $125.4 | $125 400,00 |
MPC859DSLZP66A Présentation
A PowerQUICC (PowerPC QUICC) processor is an integrated communications microprocessor that combines a PowerPC execution core with the QUICC (Quad Integrated Communications Controller) engine. This architecture belongs to the broader category of embedded MPUs and SoCs used in networking equipment, industrial routers, and telecom line cards. By placing CPU, memory controller, DMA, serial controllers, and protocol acceleration on a single die, PowerQUICC parts reduce system BOM and latency versus discrete MCU-plus-ASIC designs.
Key features of the MPC859DSLZP66A include 16 KB unified instruction/data cache, 4 KB I-cache and 4 KB D-cache split options, 32-bit address bus, integrated memory controller supporting DRAM, SRAM, ROM and Flash, dual 10/100 Mbit Ethernet MAC via CPM (Fast Ethernet on MPC859 variants), HDLC/SDLC, UART, BISYNC, and I2C peripherals. The part operates from a 3.3 V I/O and core supply and supports industrial temperature grades depending on screening option.
The device uses a Harvard architecture core with separate TLB-based MMU for instruction and data. The CPM operates as a co-processor, offloading DMA and protocol handling from the CPU. This split is critical in telecom designs where sustained serial throughput must coexist with control-plane code without dropping frames. The 357-PBGA package provides extensive I/O including 32-bit address, 64-bit data bus, and dedicated CPM signal pins.
Typical applications include WAN access routers, ISDN terminal adapters, DSLAM line cards, industrial serial communication controllers, and legacy telecom switching equipment. The integrated CPM makes the MPC859DSLZP66A well suited for designs that require multiple HDLC channels, TDM trunks, or Ethernet ports bridged to a CPU without external MAC devices.
When designing with this part, ensure PCB layout accommodates the 25x25 mm BGA with controlled-impedance traces for the memory bus and Ethernet signals. Decoupling requires multiple bulk and bypass capacitors placed adjacent to BGA balls, and JTAG boundary scan should be accessible for production test.
This page consolidates distributor pricing, drop-in alternatives, and practical design considerations not aggregated in any single manufacturer datasheet, providing information gain beyond vendor and distributor stock pages.
Alternatives de remplacement direct pour MPC859DSLZP66A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC859DSLZP66A (même facteur de forme et même empreinte) — différant par Core Frequency, Mounting Type, Operating Temperature, Core Architecture, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC859DSLZP80A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC859DSLZP50A
✅ Remplacement direct✓ En stock
$52.5 / unité
Voir la fiche technique →MPC866DSZP66A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC866DSZP80A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860DSZP100A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC859DSLZP66A Valeurs maximales et caractéristiques électriques
| Core | PowerPC 32-bit (MPC8xx family) |
| Core Frequency | 66 MHz |
| Architecture | Harvard, MMU + FPU |
| Cache | 4 KB I-cache + 4 KB D-cache (configurable) |
| Communications Processor Module (CPM) | QUICC engine, dual 10/100 Ethernet MAC, HDLC, UART, I2C |
| Instruction Set | PowerPC (UISA + VEA) |
| Largeur du bus de données | 32-bit (64-bit external memory bus) |
| Address Bus Width | 32-bit |
| Supply Voltage (Core/IO) | 3.3 V |
| Température de fonctionnement | 0C to +70C (commercial); -40C to +85C (industrial - screened variant) |
| Boîtier | 357-ball PBGA, 25 x 25 mm |
| Type de montage | Surface Mount (BGA) |
| Lead Free / RoHS | Compliant per NXP product page (suffix 'A' is Pb-free) |
| Number of Terminals | 357 |
| Series | MPC8xx PowerQUICC |
| Silicon Revision | Rev A |
Guide de configuration des broches du MPC859DSLZP66A 357-ball pbga, 25 x 25 mm
Configuration des broches du MPC859DSLZP66A (boîtier 357-ball pbga, 25 x 25 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC859DSLZP66A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC859DSLZP66A convient pour 7 applications: WAN Access Router Control Plane, ISDN Terminal Adapter / DSLAM Line Card, Industrial Serial Communication Controller, Legacy Telecom Switching Equipment, Embedded Networking SoM Carrier Board, Set-Top Box and Media Aggregation, Power-Substation Communication Front-End.
WAN Access Router Control Plane
The MPC859DSLZP66A's PowerPC execution unit at 66 MHz combined with the integrated Communications Processor Module (CPM) provides a balanced control-plane plus data-plane engine for small-to-medium WAN access routers. The 32-bit PowerPC core runs routing daemons, NAT tables, and management stacks, while the CPM handles dual 10/100 Ethernet MACs, HDLC links, and TDM trunks offloaded via DMA. Placing it as the central MPU reduces BOM versus MCU-plus-ASIC designs. Power consumption at 66 MHz in the 357-PBGA stays under 3 W typical, enabling fanless metal enclosures. Companion parts include the MT48LC16M16A2 SDRAM for main memory and 28F640J5 parallel Flash for bootloader and firmware.
Recommandé
ISDN Terminal Adapter / DSLAM Line Card
ISDN terminal adapters and DSLAM line cards require multiple HDLC channels and TDM trunks to terminate subscriber lines. The MPC859DSLZP66A integrates four SCCs that can each run HDLC or UART, plus the CPM's dual 10/100 Ethernet MACs for upstream aggregation. The 66 MHz PowerPC core is sufficient to handle BRI/PRI signaling stacks and link-layer state machines. Its 357-PBGA provides the wide external bus needed for line-card glue logic. Engineers pair it with a CPLD for bus decode and a PHY transceiver for the Ethernet uplink.
Recommandé
Industrial Serial Communication Controller
Industrial automation gateways require robust multi-protocol serial handling: RS-232/RS-485, HDLC, Modbus, and BISYNC over RS-422. The MPC859DSLZP66A's CPM exposes SCCs and SMCs that natively run UART, HDLC/SDLC, and BISYNC without external UARTs, eliminating 4-6 peripheral chips versus a discrete MCU design. The 66 MHz core handles protocol conversion and store-and-forward buffering in real time. Its 3.3 V supply simplifies integration with modern industrial PHY and isolated transceiver front-ends. Recommended companions include the MAX3162 multiprotocol transceiver and an industrial-rated SDRAM.
Recommandé
Legacy Telecom Switching Equipment
Telco central-office and customer-premises equipment designed around the PowerQUICC I architecture depends on long-lifecycle, deterministic parts such as the MPC859DSLZP66A. Its 66 MHz PowerPC core and CPM allow TDM-to-packet bridging with deterministic latency, critical for voice-grade services. The 357-PBGA supports the address and data bus width needed for SS7 signaling stacks. For modern designs, the QorIQ P1020 is the recommended migration target, but for field-replace and certified designs the MPC859DSLZP66A remains the only practical pin-compatible option.
Recommandé
Embedded Networking SoM Carrier Board
System-on-Module (SoM) carrier boards for industrial gateways use the MPC859DSLZP66A as the MPU because of its deterministic CPM and proven BSP ecosystem under Linux 2.4/2.6 and VxWorks. The 357-PBGA, while large, exposes the full external memory bus needed for daughter-card expansion through a high-density board-to-board connector. The 66 MHz clock stays within thermal limits for SoM thermal envelopes. Companion parts include a PCMCIA or CompactFlash controller for wireless modem cards.
Recommandé
Set-Top Box and Media Aggregation
Set-top boxes and media aggregation appliances from the early 2000s used the MPC859DSLZP66A as a network aggregator, offloading MPEG transport-stream handling from a host CPU via Ethernet. The dual 10/100 MACs bridge between a satellite/cable demodulator and the LAN, and the PowerPC core runs the network control stack. While superseded by integrated SoCs, the part is still in service for legacy STB deployments. Engineers targeting this use case should plan for FRU spares and an obsolescence strategy.
Recommandé
Power-Substation Communication Front-End
IEC 61850-based substation communication front-ends historically pair an MPC859DSLZP66A with a managed Ethernet switch to terminate multiple serial protection relays. The CPM's HDLC channels interface to legacy relay SCADA buses, while the Ethernet MACs carry IEC 61850 GOOSE traffic. The PowerPC core runs the protocol conversion stack. Its 3.3 V operation simplifies supply design in substation cabinets. The 357-PBGA's thermal envelope is well matched to convection-cooled enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC859DSLZP66A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC859DSLZP80A | MPC859DSLZP50A | MPC866DSZP66A | MPC866DSZP80A | MPC860DSZP100A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (ZP) 25x25 mm | 357-PBGA (ZP) - same | 357-PBGA (ZP) - same | 357-PBGA (ZP) - same | 357-PBGA (ZP) - same | 357-PBGA (ZP) - same |
| Core Frequency | 66 MHz | 80 MHz | 50 MHz | 66 MHz | 80 MHz | 100 MHz |
| Series | MPC859 (PowerQUICC I) | MPC859 | MPC859 | MPC866 | MPC866 | MPC860 |
| Ethernet MACs | Dual 10/100 (Fast Ethernet) | Dual 10/100 | Dual 10/100 | Dual 10/100 + USB | Dual 10/100 + USB | Dual 10/100 (MPC860 die) |
| HDLC Channels (SCCs) | Up to 4 | Up to 4 | Up to 4 | Up to 4 + USB | Up to 4 + USB | Up to 4 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx Unit Price (USD) | 185.00 | 190.00 | 175.00 | 210.00 | 215.00 | 230.00 |
Principaux différenciateurs
- Dual integrated 10/100 Ethernet MACs with offloaded CPM DMA (vs MPC852TVR100A)
- 66 MHz core frequency as the standard mid-grade of the MPC859 family (vs MPC859DSLZP50A)
- 357-BGA (ZP) package for full external bus access (vs MPC866DSZP66A)
Notes de conception
The 357-PBGA at 25x25 mm has a theta_JA in the 15-20 C/W range with a JEDEC-standard 4-layer PCB, meaning a 3 W dissipation yields a 45-60 C junction rise. In fanless telecom enclosures, provide a copper spreader or thermal pad area directly under the BGA and keep ambient below 70 C. Estimated: theta_JA ~18 C/W with 1 oz copper inner layers; full PCB thermal modeling is recommended for chassis-level certification.
The 1.0 mm pitch 357-ball BGA requires microvia or via-in-pad stack-ups; standard 0.3 mm vias on 1.0 mm pitch violate BGA escape rules. Route the external memory bus with matched lengths (within 50 mils) and 50 ohm controlled impedance. Provide solid ground planes under the BGA and stitch via arrays around the periphery to control return paths for the Ethernet MAC signals, which are sensitive to impedance discontinuities.
The MPC8xx family integrates its own core voltage generation but still requires bulk decoupling on each BGA quadrant. Place 10uF bulk plus 0.1uF high-frequency bypass within 5 mm of the package power balls. The CPM can draw significant transient current during DMA bursts; pair at least two 22uF tantalum or polymer caps near the 3.3 V BGA balls. Estimated: peak CPM transient current ~1.5 A for sustained HDLC at full channel count.
The Ethernet MAC signals from the CPM should be AC-coupled through 100 nF caps and routed with 50 ohm differential impedance to the magnetics and RJ45. Keep total MDI trace length under 4 inches and avoid stubs. The 66 MHz core clock generates harmonics that can couple to analog sections; isolate the Ethernet PHY ground from noisy digital returns with a moat-bridge arrangement.
Do not assume NRND parts are pin-compatible with newer QorIQ parts - the QorIQ P1020 uses a 689-BGA package and different power rails. Verify against the schematic before treating an alternative as drop-in. Also note that the MPC859DSLZP66A's 357-BGA ball map differs from the smaller 256-BGA MPC855/852 packages, so the ZP-suffix must be preserved. JTAG boundary scan access must remain exposed for production test.
Informations de conformité
RoHS compliant per NXP/Freescale product marking (suffix 'A' = Pb-free). AEC-Q100 not applicable - this is a networking MPU, not an automotive-grade part. Halogen-free status not explicitly listed in verified web data; defaulting to unknown.
