MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors
Référence : MSC8151TAG1000B ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $195 | $195,00 |
| 10 | $178 | $1 780,00 |
| 100 | $156.5 | $15 650,00 |
| 500 | $138 | $69 000,00 |
| 1 000 | $124 | $124 000,00 |
MSC8151TAG1000B Présentation
What is a Digital Signal Processor (DSP)? A DSP is a specialized microprocessor whose architecture is optimized for the numeric-intensive, real-time workloads that occur in wired/wireless baseband processing, video transcoding, radar, and machine-vision pipelines. While an MCU trades cycles for control determinism, a DSP trades branches for sustained multiply-accumulate (MAC) throughput, single-cycle MAC units, wide accumulator paths, and tightly-coupled DMA. The DSP itself belongs to a broader hierarchy: DSP -> microprocessor -> programmable logic device -> semiconductor. As the most successful mid-2000s DSP family, the Freescale/NXP StarCore SC3850 extended this lineage with VLIW-style multi-issue dispatch and SIMD ALU extensions for wireline basestation line cards.
Key features of the MSC8151TAG1000B include 1 GHz core clock yielding 1000 MIPS / 4000 MMACS (16-bit MAC) per SC3850 core, dedicated MAPLE-B baseband accelerator for LTE/3G channel decoding, integrated memory management unit, extended programmable interrupt controller (EPIC), DDR2/DDR3 memory controller with ECC, two 32-bit general-purpose timers, and a low-power Wait/Stop/Debug power management framework. The 1.0 V core and 2.5 V I/O domains are typical of process-node-targeted BGA DSPs of that era, with 1.0 V scaling to manage hot-spot power on the SC3850 execution units.
This single-core SC3850 device is the entry point of the NXP MSC815x DSP family, sharing an instruction-set-compatible roadmap with the dual-core MSC8152/53, quad-core MSC8154, and hex-core MSC8156 variants. The shared 783-FCBGA (29x29) footprint family eases design portability when higher channel density forces a port up to a hex-core part. NoC-style on-die interconnect, MAPLE-B turbo/Viterbi engines, and a common BSP (SmartDSP OS) make the migration path code-compatible.
Typical applications include 3G/4G wireless baseband line cards, voice/media gateways, LTE picocell baseband processing, test and measurement instrumentation, secure network processing, and defense/aerospace signal intelligence platforms. The wide 1 GHz SC3850 payload and integrated SRIO fabric make it especially well suited for distributed baseband pooling (RRH/CPRI architectures) and multi-RF-channel aggregation.
When designing with this device, ensure the PCB provides the full 783-ball FCBGA fan-out and a minimum 4-layer stack-up with a continuous ground plane under the package. The DDR2/DDR3 controller requires matched-length byte-lane routing and 50 ohm controlled impedance; trace mismatches of more than 25 ps degrade bus margin and force derating of the 1 GHz core clock.
Alternatives de remplacement direct pour MSC8151TAG1000B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSC8151TAG1000B (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Hardware Accelerator, Core Architecture, DSP Cores.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSC8152TAG1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8154TAG1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8156ESAG1000B
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →MSC8156HAG1000B
✅ Remplacement direct✓ En stock
$198.75 / unité
Voir la fiche technique →MSC8156ESVT1000B
✅ Remplacement direct✓ En stock
$138 / unité
Voir la fiche technique →MSC8151TAG1000B Spécifications
| Part Number | MSC8151TAG1000B |
| Manufacturer | NXP Semiconductors |
| Series | StarCore |
| Product Type | SC3850 Single-Core Digital Signal Processor (DSP) |
| Core Architecture | StarCore SC3850 (1 core) |
| Clock Rate | 1 GHz |
| L1 Instruction Cache | 32 kB |
| L1 Data Cache | 32 kB |
| L2 Unified Cache | 512 kB (M2 in 64 kB increments) |
| On-Chip RAM (total) | 576 kB |
| ROM | 96 kB |
| Memory Management | MMU + EPIC (Extended Programmable Interrupt Controller) |
| Hardware Accelerator | MAPLE-B (Turbo/Viterbi FEC) |
| Core Voltage | 1.00 V |
| I/O Voltage | 2.50 V |
| Boîtier | 783-FCBGA (FC-PBGA, 29x29 mm) |
| Operating Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART |
| Timers | Two general-purpose 32-bit |
| Power States | Wait, Stop, Debug modes |
| Type de montage | Surface Mount (BGA) |
| Part Status | Obsolete |
Guide de configuration des broches du MSC8151TAG1000B 783-fcbga (fc-pbga, 29x29 mm)
Configuration des broches du MSC8151TAG1000B (boîtier 783-fcbga (fc-pbga, 29x29 mm)). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MSC8151TAG1000B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MSC8151TAG1000B convient pour 7 applications: 3G/4G Wireless Baseband Line Cards, LTE Picocell / Femtocell Baseband, Voice and Media Gateways, Test and Measurement Instrumentation, Defense and Aerospace Signal Intelligence, Secure Network Processing and Crypto Acceleration, Industrial Machine Vision and Quality Inspection.
3G/4G Wireless Baseband Line Cards
The MSC8151TAG1000B's 1 GHz SC3850 core with 4000 16-bit MMACS and integrated MAPLE-B turbo/Viterbi accelerator makes it well suited to single-sector 3G/4G baseband line cards. The chip meets the numeric throughput required for uplink channel decoding, CRC, ciphering and uplink scrambling on a single line-card slot, while the DDR2/DDR3 controller feeds the 512 kB unified L2 plus the off-chip SDRAM working set. The MAPLE-B engine offloads turbo and Viterbi so the SC3850 can stay focused on the layer-1 control loops and on-chip peripheral services.
Recommandé
LTE Picocell / Femtocell Baseband
Picocell and enterprise femtocell basebands call for a high-MIPS DSP with a flexible serial fabric, and the MSC8151TAG1000B fits that sweet spot. The Serial RapidIO and SGMII ports backhaul digitized RF samples and low-latency control between the radio unit and the baseband card. The single SC3850 core at 1 GHz is enough for a 2x2 LTE picocell physical layer, while the integrated MMU/EPIC keep user-plane and control-plane memory domains separate. Using the part in a small-form-factor SoM reduces board area without sacrificing the SmartDSP OS tool-chain support.
Recommandé
Voice and Media Gateways
Carrier-grade voice and media gateways echo-cancel, transcode, and tone-detect thousands of channels in real time. The MSC8151TAG1000B's wide SIMD ALU lets it run optimized voice codecs (G.711, G.722, G.729, AMR-WB) and small-footprint echo cancellers concurrently, while the SGMII/RGMII ports aggregate Ethernet traffic. MAPLE-B can be repurposed from turbo/Viterbi to convolutional FEC on media streams, giving designers a second engine of DSP throughput at no extra BOM cost.
Recommandé
Test and Measurement Instrumentation
Test and measurement platforms rely on real-time DSP for modulation analysis, vector signal analysis, and protocol conformance. The MSC8151TAG1000B provides deterministic MAC throughput for IEEE 802.16 / LTE downlink demodulation and 5G NR candidates in non-signaling lab tests, while the JTAG and trace ports simplify correlation of internal state to external measurements. Designers can map the DMA-driven I/O directly to a PCI Express capture card, turning the chip into a tightly-coupled DSP co-processor for an FPGA-based test set.
Recommandé
Defense and Aerospace Signal Intelligence
Defense SIGINT and electronic-warfare subsystems benefit from the MSC8151TAG1000B's deterministic compute and MAPLE-B FEC engine, both of which support bulk demodulation and channelized decoding in deployed environments. The Wait/Stop/Debug states and wide operating temperature window make the part usable in ruggedized platforms, while the SRIO fabric streams samples into capture buffers at line rate. The single-core variant is preferred where cost-sensitive form factors limit power budget.
Recommandé
Secure Network Processing and Crypto Acceleration
Secure gateways and crypto IPsec/SSL accelerators offload AES, 3DES, SHA, and RNG pipelines to the MSC8151TAG1000B, exploiting the SC3850's wide ALU and high DMA bandwidth. MAPLE-B's turbo/Viterbi accelerators can be software-repurposed for crypto hash chains in non-telecom workloads. The PCI Express and SGMII ports slot directly into a network appliance's backplane, enabling multi-gigabit throughput without a custom ASIC.
Recommandé
Industrial Machine Vision and Quality Inspection
Inline machine-vision cameras and quality-inspection stations can use the MSC8151TAG1000B as a tightly-coupled preprocessor for high-throughput image pipelines. The 1 GHz SC3850 executes convolution, edge detection and template matching kernels at line rate, and the dual 32-bit timers give precise synchronization to conveyor triggers. PCI Express links the part to a host PC or an FPGA-based image sensor interface.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSC8151TAG1000B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSC8152TAG1000B | MSC8154TAG1000B | MSC8156ESAG1000B | MSC8156HAG1000B | MSC8156ESVT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Core Architecture | SC3850 1 core | SC3850 2 cores | SC3850 4 cores | SC3850 6 cores | SC3850 6 cores | SC3850 6 cores |
| Clock Rate | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| MAPLE-B Accelerator | 1x MAPLE-B | 2x MAPLE-B | 4x MAPLE-B | 6x MAPLE-B | 6x MAPLE-B | 6x MAPLE-B |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Series | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Single-core SC3850 with MAPLE-B FEC (vs Generic ARM Cortex DSP/software-defined part)
- Pin-compatible family roadmap (vs Other Freescale legacy DSPs (MSC8101/MSC8103))
- Integrated DDR2/DDR3 controller (vs Discrete SDRAM-controller FPGAs)
Notes de conception
Estimated: the 783-ball FCBGA at 1 mm ball pitch on a 29x29 mm body requires a high-density PCB stack-up. Use a minimum 4-layer PCB with a continuous ground plane directly under the BGA. Power planes for the 1.0 V core rail must be decoupled with low-ESR ceramic capacitors placed within 100 mil of the supply balls; the datasheet recommends at least 10 x 0.1 uF and 4 x 10 uF bypass caps distributed uniformly across the package perimeter.
The DDR2/DDR3 controller is sensitive to byte-lane skew; route each byte lane with intra-pair length matching under 25 ps and inter-pair skew under 50 ps. Use 50 ohm single-ended controlled impedance for address/command traces and 100 ohm differential for the DDR clock pair. Series 33 ohm damping resistors are typically required on the clock pair near the controller side. SRIO and SGMII SerDes lanes should be routed as 100 ohm differential pairs with reference plane continuity and minimum 4x dielectric spacing to non-aggressor traces.
Estimated: at full 1 GHz load with all peripherals active the SC3850 core dissipates approximately 6-8 W. The FCBGA thermal pad must be soldered to a 1 oz copper thermal pad on the inner PCB plane; a 36 mm x 36 mm copper pour keeps junction-to-ambient within the typical 12-15 C/W envelope, sufficient for most line-card chassis airflows of 200 LFM.
MAPLE-B accelerator initialization requires specific host-side firmware loads from ROM at boot; if the firmware image is corrupted the accelerator stays in reset, so plan a watchdog reset in the board support package. Do not operate the SC3850 above 1 GHz without re-validating voltage and thermal derating curves - the 1.0 V rail must remain within +/- 5% under load transients to avoid uncorrectable DDR ECC errors.
Place the SC3850 JTAG TAP header within 6 inches of the device to keep TCK rise times under 5 ns; longer stubs corrupt debug scans at high TCLK. Reserve a complete ground-ring via fence around the BGA signal escape region to control simultaneous-switching noise (SSN) from the 32-bit DDR interface.
Informations de conformité
Compliance not stated explicitly in the verified web data; the part is listed as Obsolete. AEC-Q100 is not applicable to DSP ICs. Refer to NXP product page for current compliance statements.
