MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP
Référence : MSC8251SVT1000B ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $91.07 | $91,07 |
| 10 | $85.5 | $855,00 |
| 100 | $78.2 | $7 820,00 |
| 500 | $72 | $36 000,00 |
| 1 000 | $65 | $65 000,00 |
MSC8251SVT1000B Présentation
A digital signal processor (DSP) is a specialized microprocessor whose architecture is optimized for the numeric-intensive, real-time computations common in audio, video, voice, and baseband processing. Within the semiconductor hierarchy, a DSP sits between a general-purpose microcontroller and a hard-wired ASIC: it offers deterministic latency, large multiply-accumulate (MAC) throughput, and tightly coupled memory, while remaining programmable in C and assembly. The MSC8251 family is NXP's mid-range StarCore platform, positioned between the lower-frequency MSC8101 and the higher-performance six-core MSC8256 family.
Key features of the MSC8251SVT1000B include four independent TDM modules with hardware-based A-law/mu-law conversion and rates up to 62.5 Mbps each, glueless interface to E1/T1 framers and H.110/H-MVIP devices, multi-channel DMA, Ethernet MAC, PCI Express, and SERDES-based RapidIO interconnect. The 32 KB/32 KB split L1 cache and 512 KB L2 enable sustained 1 GHz operation on multi-MAC DSP loops with low external memory pressure.
Typical applications include multi-channel voice gateways, TDM-based media gateways, industrial multi-protocol telecom equipment, motor control and high-end audio processing. The combination of TDM, Ethernet, RapidIO, and PCI Express interfaces makes the MSC8251 particularly suited for systems that bridge the legacy TDM world with packet-based VoIP/RTP networks.
When designing with this part, ensure the 783-ball FCBGA PCB footprint uses microvia or via-in-pad technology with controlled-impedance routing for SERDES lanes and that the thermal solution is sized for the worst-case junction temperature at the 1 GHz operating point. Always reset the device properly before code download, and follow NXP's hardware initialization sequence for SERDES reference clock stability.
This page combines verified distributor stock data, manufacturer-published electrical and mechanical specifications, and an explicit drop-in alternatives analysis not found in the manufacturer datasheet, providing engineers a single source for first-pass component selection on legacy StarCore designs.
Alternatives de remplacement direct pour MSC8251SVT1000B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSC8251SVT1000B (même facteur de forme et même empreinte) — différant par Core Architecture, Mounting Type, Operating Temperature, Security Engine, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSC8251SVT1000B
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →MSC8256ESVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8256SVT1000B
✅ Remplacement direct✓ En stock
$189 / unité
Voir la fiche technique →MSC8251TVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8252SVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8251SVT1000B Spécifications
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Architecture | SC3850 StarCore, single core |
| Core Revision | StarCore R2.1 |
| Maximum Core Clock | 1 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | 576 KB |
| Internal ROM | 96 KB |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | Yes (integrated) |
| PCI Express | Yes (integrated controller) |
| Serial RapidIO | Yes (SERDES-based) |
| DMA Controller | Multi-channel DMA |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | 783 balls |
| Package Dimensions | 29 mm x 29 mm |
| Type de montage | Surface Mount |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MSC8251SVT1000B 29 mm x 29 mm
Configuration des broches du MSC8251SVT1000B (boîtier 29 mm x 29 mm). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MSC8251SVT1000B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MSC8251SVT1000B convient pour 6 applications: Multi-Channel VoIP / Media Gateway, T1/E1 Channel Bank / Cross-Connect, Industrial Multi-Protocol Telecom Card, High-End Audio Processing / Audio DSP, Voice / Speech Recognition Engine, Motor Control / Industrial Drive.
Multi-Channel VoIP / Media Gateway
The MSC8251SVT1000B is purpose-built for voice-over-IP media gateways that need to terminate TDM spans on one side and RTP/SIP packets on the other. Its four TDM modules each handle a full E1/T1 stream at 62.5 Mbps with hardware A-law/mu-law conversion, so a single chip can run 120+ voice channels in parallel; the integrated Ethernet MAC provides the packet-side connectivity without an external bridge. Placed on a gateway line card, the MSC8251SVT1000B transcodes between G.711, G.729, and G.723.1 directly on the SC3850 core, eliminating the need for an external DSP array. Compared to general-purpose processors running OpenSIPS or Asterisk, this DSP delivers deterministic latency and far lower power per channel at full load.
Recommandé
T1/E1 Channel Bank / Cross-Connect
Designed for legacy TDM channel banks that aggregate multiple E1/T1 circuits onto packet backbones, the MSC8251SVT1000B exploits its four TDM links (62.5 Mbps each) and H.110/H-MVIP glueless interface to TSI switches. With 32 KB/32 KB L1 split caches and 512 KB L2 cache, the SC3850 core sustains per-channel processing for up to 480 simultaneous DS0 timeslots without external memory access overhead. In a typical channel-bank design, the MSC8251SVT1000B sits between the line interface units (LIUs) and an Ethernet or RapidIO uplink, performing A-law conversion, jitter buffering, and HDLC/PPP framing on-chip. Designers pair it with Freescale PowerQUICC or NXP QorIQ SoCs to handle the SS7 signaling plane.
Recommandé
Industrial Multi-Protocol Telecom Card
For industrial-grade telecom blades that must support multiple protocols (TDM, Ethernet, RapidIO, PCIe) on a single DSP, the MSC8251SVT1000B offers the rare combination of all four interfaces in a single 29x29 mm package. Its PCI Express controller slots directly into a host CPU's PCIe lane, while the SERDES RapidIO ports provide backplane interconnect to neighbouring DSPs. With 576 KB on-chip RAM and 512 KB L2 cache, multiple protocol stacks can be held resident for fast context switching. In a multi-blade chassis the chip's SERDES links support peer-to-peer RapidIO messaging without host intervention, enabling low-latency DSP clusters for carrier-grade media processing.
Recommandé
High-End Audio Processing / Audio DSP
Audio engineers use the MSC8251SVT1000B as a computational backbone for multi-channel pro-audio processors, including digital mixers, audio routers, and broadcast effects units. The SC3850's dual MAC units deliver excellent sample-rate conversion throughput, and the 32 KB/32 KB L1 split-cache arrangement keeps audio-frame processing deterministic. In a 64-channel digital mixer, the SC3850 runs a custom FIR/IIR processing graph while the TDM modules carry multiple AES10 (MADI) audio streams, and the Ethernet MAC streams auxiliary control traffic. The 576 KB on-chip RAM holds tap-delay-line buffers, allowing large convolution reverbs without external SDRAM.
Recommandé
Voice / Speech Recognition Engine
For embedded voice-recognition appliances, the MSC8251SVT1000B combines enough cache and on-chip RAM (512 KB L2 plus 576 KB scratch) to hold acoustic-model lattices entirely on-chip, while the SC3850 core does Gaussian/Kernel evaluation at 1 GHz clock. In a hands-free voice controller, four PDM microphones feed into an external ADC then into the TDM modules, and the DSP runs front-end beamforming plus keyword-spotting with deterministic latency. Compared to Cortex-M based systems, the MSC8251 cuts recognition latency by 3x and supports far larger dictionaries. Designers typically pair it with a small Cortex-A application processor to manage the recognition vocabulary and user interface.
Recommandé
Motor Control / Industrial Drive
For high-end industrial motor drives that combine field-oriented control (FOC), space-vector PWM, and real-time telemetry, the MSC8251SVT1000B supplies the deterministic fixed-point MAC throughput needed at the 1 GHz operating point. In a multi-axis servo drive, multiple MSC8251 chips communicate over Serial RapidIO to share encoder data, while the Ethernet MAC streams predictive-maintenance telemetry to a plant-monitoring network. The 512 KB L2 cache provides ample headroom for sensorless-control state estimators, and the integrated PCIe controller interfaces cleanly to a host PC for parameter tuning. Using a DSP rather than a micro-controller keeps the control loop jitter under 1 microsecond, critical for sub-100 kW servos.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSC8251SVT1000B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSC8251SVT1000B | MSC8256ESVT1000B | MSC8256SVT1000B | MSC8251TVT1000B | MSC8252SVT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) |
| Core Type | SC3850 single core | SC3850 single core | SC3850 hex core | SC3850 hex core | SC3850 single core | SC3850 dual core |
| Core Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| L1 I-cache / D-cache | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB per core | 32 KB / 32 KB per core | 32 KB / 32 KB | 32 KB / 32 KB per core |
| TDM Modules | 4 x TDM (62.5 Mbps) | 4 x TDM (62.5 Mbps) | 4 x TDM (62.5 Mbps) | 4 x TDM (62.5 Mbps) | 4 x TDM (62.5 Mbps) | 4 x TDM (62.5 Mbps) |
| PCIe / RapidIO / Ethernet | PCIe + RapidIO + Ethernet | PCIe + RapidIO + Ethernet | PCIe + RapidIO + Ethernet | PCIe + RapidIO + Ethernet | PCIe + RapidIO + Ethernet | PCIe + RapidIO + Ethernet |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industry-leading single-core StarCore compute density (vs MSC8256ESVT1000B)
- Drop-in scalability across the entire MSC825x family (vs MSC8101M1250F (SC140))
- Integrated multi-protocol TDM/Ethernet/RapidIO/PCIe (vs TI TMS320DM8168SCYG2)
Notes de conception
The 783-ball FCBGA at 29x29 mm requires microvia, via-in-pad, or 0.4 mm-pitch escape routing for fanout to inner layers. Estimated: assume 5-6 routing layers with stripline-controlled impedance for SERDES lanes. Use the manufacturer IBIS and BSDL models for signal-integrity simulation - do NOT attempt to hand-route a 783-ball BGA. Decouple the core supply with 0402 X7R 100 nF caps in a 1:1 ratio per VDD pin plus 4.7 uF bulk capacitors every 20 balls, per the layout checklist in the MSC8251 hardware documentation.
At the 1 GHz operating point, the MSC8251SVT1000B dissipates on the order of a few watts. Estimated: with theta_JA around 15 C/W for a 29x29 mm FCBGA on a standard 4-layer JEDEC test board, junction-to-ambient rise is roughly 50 C. Always provide a thermal via array under the exposed die pad and ensure the chassis airflow keeps the case under 85 C. Derate clock frequency if the thermal envelope cannot be met.
Do NOT assume the MSC8251SVT1000B and MSC8101M1250F are interchangeable - they belong to the same StarCore family but use different packages, cores (SC3850 vs SC140), and footprints. Always check the original design's BOM, schematics, and PCB layout before substituting legacy parts. NXP provides a dedicated hardware-migration guide with deltas when migrating within the MSC825x family; follow it step-by-step to avoid SERDES reference-clock mismatches that cause intermittent link training failures.
Informations de conformité
Lead-free and halogen-free per the manufacturer datasheet. REACH and conflict-mineral status not explicitly stated in web data; AEC-Q100 not applicable for telecom-grade DSP.
