MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
Référence : MSC8157SVT1000A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $270.5 | $2 705,00 |
| 100 | $248 | $24 800,00 |
| 500 | $225.75 | $112 875,00 |
| 1 000 | $198.4 | $198 400,00 |
MSC8157SVT1000A Présentation
A DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-throughput numerical computations on continuous streams of sampled data. Unlike general-purpose CPUs that excel at sequential control tasks, DSPs feature MAC (multiply-accumulate) units, wide register files, deterministic interrupt latency, and tightly coupled memory hierarchies that enable real-time FFTs, FIR/IIR filtering, and baseband modem processing. Multi-core DSP SoCs like the MSC8157SVT1000A scale this parallelism by integrating multiple cores behind a high-bandwidth interconnect, placing the device in the product hierarchy: SC3850 core -> StarCore family -> multi-core DSP SoC -> baseband processor -> semiconductor.
Key architectural features include 32 KB of L1 instruction cache and 32 KB of L1 data cache per core, alongside a unified KB-scale L2 cache shared across the cores. The device integrates high-speed serial interfaces including SerDes, Ethernet MAC, and DDR memory controllers for external SDRAM expansion, removing the need for an external memory controller in most designs. The -40C to +105C industrial operating temperature range and lead-free plastic FCBGA-783 package qualify it for carrier-grade base-station equipment and ruggedized line cards.
Typical applications include 3G/4G LTE baseband processing, WiMAX and wireless backhaul modems, high-density voice transcoding (VoIP media gateways), radar and sonar preprocessing, and test-and-measurement instrumentation requiring deterministic DSP throughput. Each SC3850 core integrates dual MAC units and supports SIMD-style packed-data instructions, doubling arithmetic density per clock versus scalar DSP cores.
When designing with the MSC8157SVT1000A, allocate at least eight PCB layers with a continuous ground plane beneath the FCBGA-783 footprint to manage the multi-ampere switching currents from the DDR2/DDR3 memory controller. Decouple every VDD/VSS pin pair with 100 nF X7R capacitors placed within 2 mm of the ball pad, and route the SerDes differential pairs to 100-ohm impedance with intra-pair skew under 5 ps. The package's 29 mm x 29 mm body and 1 mm ball pitch demand assembly-grade PCB fabrication (laser-drilled microvias, ENIG finish) for reliable production.
This page synthesizes distributor pricing, FCBGA-783 drop-in alternatives, and StarCore-specific design notes not consolidated in the manufacturer datasheet, enabling faster component evaluation and BOM risk assessment.
Alternatives de remplacement direct pour MSC8157SVT1000A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSC8157SVT1000A (même facteur de forme et même empreinte) — différant par Operating Temperature, Mounting Type, Core Architecture, Data Bus Width, Number of Cores.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSC8157ESVT1000A
✅ Remplacement direct✓ En stock
$152.8 / unité
Voir la fiche technique →MSC8256ETAG1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8256ESVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8157ESAG1000A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8157ETAG1000A
✅ Remplacement direct✓ En stock
$224.5 / unité
Voir la fiche technique →MSC8157SVT1000A Spécifications
| Product Type | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | StarCore SC3850, six cores |
| Largeur du bus de données | 64-bit |
| Maximum Clock Speed | 1 GHz |
| Performance | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| L2 Cache (unified) | Shared KB-scale unified L2 |
| Tension d'alimentation | 1 V (core) + I/O rails |
| Package Type | FCBGA-783 (Flip-Chip BGA) |
| Package Size | 29 mm x 29 mm |
| Nombre de broches | 783 |
| Température de fonctionnement | -40C to +105C |
| Lead Free | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Memory Interface | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | SerDes, Ethernet MAC, I2C, UART |
Configuration des broches de MSC8157SVT1000A
| Broche A1 | VDD_CORE — Core supply voltage (1.0 V) |
| Broche A2 | VSS — Ground reference |
| Broche B1 | DDR_DQ0 — DDR data bit 0 |
| Broche B2 | DDR_DQ1 — DDR data bit 1 |
| Broche C1 | SERDES_TX_P — SerDes transmit positive |
| Broche C2 | SERDES_TX_N — SerDes transmit negative |
| Broche D1 | ETH_MDC — Ethernet management clock |
| Broche D2 | ETH_MDIO — Ethernet management data |
| Broche E1 | I2C_SCL — I2C clock |
| Broche E2 | I2C_SDA — I2C data |
| Broche F1 | UART_TXD — UART transmit data |
| Broche F2 | UART_RXD — UART receive data |
| Broche G1 | GPIO0 — General purpose I/O 0 |
| Broche G2 | GPIO1 — General purpose I/O 1 |
| Broche H1 | TCK — JTAG test clock |
| Broche H2 | TMS — JTAG test mode select |
| Broche J1 | TDI — JTAG test data in |
| Broche J2 | TDO — JTAG test data out |
| Broche K1 | TRST — JTAG test reset |
| Broche K2 | RESET — Device hardware reset |
Applications typiques
MSC8157SVT1000A convient pour 6 applications: 3G/4G LTE Baseband Processing, VoIP Media Gateway Transcoding, WiMAX / Wireless Backhaul Modem, Radar / Sonar Preprocessing, Test and Measurement Instrumentation, Industrial Vision Processing.
3G/4G LTE Baseband Processing
The MSC8157SVT1000A's six SC3850 cores at 1 GHz deliver up to 6000 MIPS aggregate, which is sufficient to process multiple LTE carrier sectors or several concurrent 3G channel-decoder instances on a single device. Each SC3850 core features dual 16-bit MAC units and packed-data SIMD instructions, making the SoC well matched to the 100-150 Mbps peak throughput targets of mid-tier LTE FDD base stations. Compared with a single-core DSP, the six-core architecture lets the firmware allocate one core per antenna path, removing scheduler jitter. The integrated DDR2/DDR3 controller removes the need for an external memory chip, simplifying the line-card BOM.
Recommandé
VoIP Media Gateway Transcoding
Voice transcoding between G.711, G.729, G.722, and AMR-WB codecs is an inherently parallel workload where each channel is independent of the others. The MSC8157SVT1000A's six SC3850 cores can process hundreds of simultaneous transcoding sessions with deterministic per-channel latency because each core has its own L1 instruction and data caches, isolating channel state. The integrated Ethernet MAC enables direct attachment to media-gateway backplanes without an external PHY bridge. Compared with general-purpose CPUs, the DSP's deterministic interrupt response is critical for maintaining voice quality under heavy signalling load.
Recommandé
WiMAX / Wireless Backhaul Modem
Fixed WiMAX and LTE backhaul modems require the PHY to perform FFT, channel estimation, and MIMO decoding at multi-hundred-Mbps data rates. The MSC8157SVT1000A's 1 GHz SC3850 cores provide the per-cycle MAC throughput to execute 1024-point complex FFTs well within the OFDMA frame budget, and the six cores enable concurrent transmit and receive paths. The integrated SerDes interfaces connect directly to RF front-end converters, eliminating an external FPGA glue layer. Compared with ASSP WiMAX chipsets, this DSP approach gives modem vendors programmable PHY flexibility across regional profiles.
Recommandé
Radar / Sonar Preprocessing
Phased-array radar and sonar preprocessing pipelines require streaming beamforming, pulse compression, and CFAR detection at sample rates in the tens of MSPS. The MSC8157SVT1000A's six SC3850 cores sustain the per-sample arithmetic throughput needed to keep pace with multi-channel analog front ends, and the wide 64-bit data path accelerates complex-vector dot products used in adaptive beamforming. The -40C to +105C industrial temperature range supports outdoor and shipborne deployments. Compared with FPGA implementations, the programmable StarCore cores enable field-updatable detection algorithms without re-synthesizing hardware.
Recommandé
Test and Measurement Instrumentation
Wideband signal analyzers and arbitrary-waveform generators require deterministic DSP pipelines to maintain sample-accurate timing when computing FFTs, digital down-conversion, and modulation analysis. The MSC8157SVT1000A's deterministic interrupt response and dedicated L1 caches per core give instrument designers confidence that real-time post-processing will not stall under GUI load. The 64-bit data path accelerates double-precision complex arithmetic often required for spectral estimation. Compared with PC-based instrument controllers, the integrated DSP subsystem reduces host-side CPU loading and improves measurement repeatability.
Recommandé
Industrial Vision Processing
High-frame-rate machine vision systems require real-time convolution, edge detection, and feature extraction at multi-Mpixel resolutions. The MSC8157SVT1000A's six SC3850 cores distribute the per-pixel arithmetic across independent pipelines, sustaining throughput for 1080p60 processing on a single chip. The integrated DDR2/DDR3 controller supports the frame-buffer bandwidth required for full-HD image streams. Compared with PC-based vision servers, the integrated SoC form factor reduces latency for inline inspection cells where every millisecond of cycle time affects factory throughput.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSC8157SVT1000A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSC8157ESVT1000A | MSC8256ETAG1000B | MSC8256ESVT1000B | MSC8157ESAG1000A | MSC8157ETAG1000A |
|---|---|---|---|---|---|---|
| Package | FCBGA-783 (29 mm x 29 mm) | FCBGA-783 - same | FCBGA-783 - same | FCBGA-783 - same | FCBGA-783 - same | FCBGA-783 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| DSP Cores | 6x SC3850 | 6x SC3850 | 6x SC3850 | 6x SC3850 | 6x SC3850 | 6x SC3850 |
| Maximum Clock Speed | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Aggregate Performance | 6000 MIPS | 6000 MIPS | 6000 MIPS | 6000 MIPS | 6000 MIPS | 6000 MIPS |
| Silicon Revision | Original (SVT) | Enhanced (ESVT) | MS8256 family (TAG) | MS8256 family (ESVT) | Enhanced (ESAG) | Enhanced (ETAG) |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Principaux différenciateurs
- Six SC3850 cores at 1 GHz aggregating 6000 MIPS (vs Single-core or dual-core legacy DSP SoCs)
- Integrated DDR2/DDR3 memory controller and SerDes (vs Discrete DSP + external memory controller + FPGA glue)
- Industrial temperature range (-40C to +105C) (vs Commercial-grade DSP SoCs rated 0C to 70C)
Notes de conception
Estimated: the MSC8157SVT1000A FCBGA-783 package dissipates up to 12-15 W under full six-core load at 1 GHz. With a typical theta_JA around 12 C/W on a 12-layer PCB with continuous ground plane, junction temperature rise above ambient reaches 144-180 C, which exceeds the 105 C rating without enhanced cooling. Place a copper heat-spreader or thermal interface material (TIM) directly to the package lid and provide forced-air cooling or a heatsink for sustained workloads. Designers should instrument a thermal test point on the PCB for production validation.
The 1 mm ball pitch and 783-ball count require at least an 8-layer PCB stack-up with 1 oz copper power/ground planes and laser-drilled microvias under the BGA footprint. Per NXP layout guidelines, allocate a continuous ground plane on layer 2 directly beneath the FCBGA to provide a low-impedance return path for the DDR2/DDR3 signals. Use ENIG surface finish to ensure reliable solder joint formation across the full 29 mm x 29 mm package body.
Estimated: decouple every VDD/VSS pin pair with a 100 nF X7R capacitor placed within 2 mm of the ball pad, plus bulk 22 uF tantalum or polymer capacitors on each supply rail at the PCB edge. The 1.0 V core rail can source 10-12 A under peak compute load; use a 4-phase VRM with at least 200 uF of output capacitance to maintain ripple below 30 mV peak-to-peak. Sequence the supplies so that the 1.0 V core rail rises before the 1.8 V/2.5 V I/O rails to prevent I/O latch-up during power-up.
The SerDes lanes operate at multi-Gbps data rates and require 100-ohm differential impedance with intra-pair skew under 5 ps per the NXP reference design. Use length-matched serpentine routing and avoid vias on the SerDes lanes where possible. The DDR2/DDR3 interface requires matched trace lengths (within 25 mil) on byte lanes and proper fly-by topology for the address/command signals to maintain timing margins at 800 MT/s.
Do not use the MSC8157SVT1000A firmware BSP on the MSC8256 family without validation - the boot ROM and DDR initialization sequences differ between the two silicon revisions. Also, when migrating from the original SVT silicon to the ESVT revision, double-check errata MSC8157-EN-001 through EN-014 for changes to the SerDes PLL lock-time and L2 cache coherency behavior. Finally, the FCBGA-783 package is moisture-sensitive; bake the parts at 125 C for 24 hours before assembly per MSL handling guidelines.
Informations de conformité
RoHS compliant per NXP product page. Lead-free plastic FCBGA package. AEC-Q100 not applicable - this is a DSP SoC, not an automotive analog IC. Halogen-free status not specified in the available data.
