MSP430F5329IPN - 25MHz MCU 128KB Flash 80-LQFP | TI MSP430
Référence : MSP430F5329IPN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.45 | $6,45 |
| 10 | $5.78 | $57,80 |
| 100 | $5.12 | $512,00 |
| 500 | $4.62 | $2 310,00 |
| 1 000 | $4.17 | $4 170,00 |
MSP430F5329IPN Présentation
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die, intended for embedded control where deterministic low-power operation matters. Within the wider taxonomy, the MSP430 family sits under 16-bit microcontrollers, then general-purpose microcontrollers, then embedded processors, then semiconductors. The F5xx sub-family is positioned for mixed-signal, ultra-low-power applications and shares a common toolchain (CCS, IAR) and a unified datasheet family document.
Key features include an integrated 12-bit SAR ADC, an analog comparator, a 32-bit hardware multiplier, a multi-channel DMA controller, and serial interfaces covering UART, SPI, and I2C. The on-chip Flash supports in-system programming through JTAG or Spy-Bi-Wire, while 10 KB SRAM provides working memory for real-time tasks. The PN package exposes 63 GPIO pins per TI's product page summary. Five low-power modes (LPM0 through LPM4 plus LPMx.5) reduce standby current to sub-microamp levels at 3 V, while active-mode current is approximately 180 uA/MHz at 3 V. The 12-bit ADC supports 200 ksps conversion, and the DMA controller offloads data movement without CPU intervention.
Typical applications include smart-grid metering and AMI endpoints, industrial sensor transmitters, portable medical and fitness devices, building automation nodes, ultra-low-power wireless sensor network base stations, and battery-powered HVAC controllers. The 128 KB Flash supports full LWM2M or proprietary wireless stacks in connected nodes, and the 12-bit ADC pin count suits multi-channel sensor acquisition.
When designing with this device, follow the MSP430 hardware user's guide for decoupling: one 100 nF plus one 4.7 uF bulk capacitor on DVCC, separate AVCC filtering for the ADC reference, and a 32.768 kHz crystal on LFXTIN/LFXTOUT for RTC accuracy. JTAG pins must be pulled high during reset for proper operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to evaluate compatibility without consulting multiple sources.
Alternatives de remplacement direct pour MSP430F5329IPN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSP430F5329IPN (même facteur de forme et même empreinte) — différant par Core, DMA Channels, Hardware Multiplier, Package, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSP430F5329IPNR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430F5327IPN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430F5325IPN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSP430F5529IPNR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MSP430F5529IPNR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MSP430F5329IPN Valeurs maximales et caractéristiques électriques
| Core | MSP430 CPUXV2 (16-bit RISC) |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| SRAM | 10 KB |
| Supply Voltage (DVCC) | 2.4 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| ADC | 12-bit SAR, up to 200 ksps |
| Analog Comparator | Yes (on-chip) |
| Hardware Multiplier | 16 x 16 -> 32-bit, single cycle |
| DMA Channels | Yes (multi-channel) |
| Serial Interfaces | UART, SPI, I2C (USCI modules, x2) |
| Timers | 4 x 16-bit |
| RTC | Yes, with alarm capabilities |
| GPIO Pins | 63 (per TI product page) |
| Boîtier | 80-pin LQFP (PN), 12 x 12 mm |
| Type de montage | Surface Mount |
| Active Mode Current | 180 uA/MHz at 3 V (typical) |
| Low-Power Modes | LPM0-LPM4, LPMx.5 (RAM retention off) |
| Programming Interface | JTAG, Spy-Bi-Wire (SBW) |
| Statut RoHS | Compliant |
Configuration des broches de MSP430F5329IPN
| Broche 1 | P6.0 — General-purpose digital I/O |
| Broche 2 | P6.1 — General-purpose digital I/O |
| Broche 3 | P6.2 — General-purpose digital I/O |
| Broche 4 | P6.3 — General-purpose digital I/O |
| Broche 5 | P6.4 — General-purpose digital I/O |
| Broche 6 | P6.5 — General-purpose digital I/O |
| Broche 7 | P6.6 — General-purpose digital I/O |
| Broche 8 | P6.7 — General-purpose digital I/O |
| Broche 9 | P7.0 — General-purpose digital I/O |
| Broche 10 | P7.1 — General-purpose digital I/O |
| Broche 11 | P7.2 — General-purpose digital I/O |
| Broche 12 | P7.3 — General-purpose digital I/O |
| Broche 13 | P7.4 — General-purpose digital I/O |
| Broche 14 | P7.5 — General-purpose digital I/O |
| Broche 15 | P7.6 — General-purpose digital I/O |
| Broche 16 | P7.7 — General-purpose digital I/O |
| Broche 17 | DVCC — Digital supply voltage (2.4-3.6 V) |
| Broche 18 | DVSS — Digital ground |
| Broche 19 | TEST/SBWTCK — JTAG test mode / Spy-Bi-Wire clock |
| Broche 20 | RST/NMI/SBWTDIO — Reset, NMI, or Spy-Bi-Wire data |
| Broche 21 | P5.0 — General-purpose digital I/O |
| Broche 22 | P5.1 — General-purpose digital I/O |
| Broche 23 | P5.2 — General-purpose digital I/O |
| Broche 24 | P5.3 — General-purpose digital I/O |
| Broche 25 | P5.4 — General-purpose digital I/O |
| Broche 26 | P5.5 — General-purpose digital I/O |
| Broche 27 | P5.6 — General-purpose digital I/O |
| Broche 28 | P5.7 — General-purpose digital I/O |
| Broche 29 | P4.0 — General-purpose digital I/O |
| Broche 30 | P4.1 — General-purpose digital I/O |
| Broche 31 | P4.2 — General-purpose digital I/O |
| Broche 32 | P4.3 — General-purpose digital I/O |
| Broche 33 | P4.4 — General-purpose digital I/O |
| Broche 34 | P4.5 — General-purpose digital I/O |
| Broche 35 | P4.6 — General-purpose digital I/O |
| Broche 36 | P4.7 — General-purpose digital I/O |
| Broche 37 | P3.0 — General-purpose digital I/O |
| Broche 38 | P3.1 — General-purpose digital I/O |
| Broche 39 | P3.2 — General-purpose digital I/O |
| Broche 40 | P3.3 — General-purpose digital I/O |
| Broche 41 | P3.4 — General-purpose digital I/O |
| Broche 42 | P3.5 — General-purpose digital I/O |
| Broche 43 | P3.6 — General-purpose digital I/O |
| Broche 44 | P3.7 — General-purpose digital I/O |
| Broche 45 | P2.0 — General-purpose digital I/O |
| Broche 46 | P2.1 — General-purpose digital I/O |
| Broche 47 | P2.2 — General-purpose digital I/O |
| Broche 48 | P2.3 — General-purpose digital I/O |
| Broche 49 | P2.4 — General-purpose digital I/O |
| Broche 50 | P2.5 — General-purpose digital I/O |
| Broche 51 | P2.6 — General-purpose digital I/O |
| Broche 52 | P2.7 — General-purpose digital I/O |
| Broche 53 | P1.0 — General-purpose digital I/O / TA0CLK |
| Broche 54 | P1.1 — General-purpose digital I/O / TA0.0 |
| Broche 55 | P1.2 — General-purpose digital I/O / TA0.1 |
| Broche 56 | P1.3 — General-purpose digital I/O / TA0.2 |
| Broche 57 | P1.4 — General-purpose digital I/O / TA0.3 |
| Broche 58 | P1.5 — General-purpose digital I/O / TA0.4 |
| Broche 59 | P1.6 — General-purpose digital I/O / TA0.5 |
| Broche 60 | P1.7 — General-purpose digital I/O / TA0.6 |
| Broche 61 | AVCC — Analog supply voltage for ADC |
| Broche 62 | AVSS — Analog ground for ADC |
| Broche 63 | VREF+ — ADC positive reference voltage |
| Broche 64 | VREF-/VeREF- — ADC negative reference voltage |
| Broche 65 | A0 — Analog input channel 0 |
| Broche 66 | A1 — Analog input channel 1 |
| Broche 67 | A2 — Analog input channel 2 |
| Broche 68 | A3 — Analog input channel 3 |
| Broche 69 | A4 — Analog input channel 4 |
| Broche 70 | A5 — Analog input channel 5 |
| Broche 71 | A6 — Analog input channel 6 |
| Broche 72 | A7 — Analog input channel 7 |
| Broche 73 | P8.0 — General-purpose digital I/O |
| Broche 74 | P8.1 — General-purpose digital I/O |
| Broche 75 | P8.2 — General-purpose digital I/O |
| Broche 76 | P8.3 — General-purpose digital I/O |
| Broche 77 | P8.4 — General-purpose digital I/O |
| Broche 78 | P8.5 — General-purpose digital I/O |
| Broche 79 | LFXTIN — Low-frequency crystal input (32.768 kHz) |
| Broche 80 | LFXTOUT — Low-frequency crystal output (32.768 kHz) |
Applications typiques
MSP430F5329IPN convient pour 6 applications: Smart-Grid Metering and AMI Endpoints, Industrial Sensor Transmitters (4-20 mA, IO-Link), Portable Medical and Fitness Devices, Building Automation Nodes (HVAC, Lighting, Access Control), Ultra-Low-Power Wireless Sensor Network Base Stations, Battery-Powered HVAC and Energy-Harvesting Controllers.
Smart-Grid Metering and AMI Endpoints
The MSP430F5329IPN is well suited to smart-grid electricity, gas, and water metering endpoints that demand years of battery life while running a wireless stack. The 128 KB Flash hosts a full LWM2M, wM-Bus, or proprietary RF stack, and the 10 KB SRAM handles measurement buffers and protocol state. The integrated 12-bit ADC delivers 200 ksps for power-quality and harmonics measurements, while the four 16-bit timers drive pulse-counting for LED calibration pulses and tamper detection. The five low-power modes, including LPMx.5 for sub-microamp standby, allow a typical AMI endpoint to sleep >99% of the time, with the RTC alarm waking the device for scheduled metering reads.
Recommandé
Industrial Sensor Transmitters (4-20 mA, IO-Link)
For 4-20 mA loop-powered or IO-Link sensor transmitters, the MSP430F5329IPN provides the precision analog and low-power digital performance needed for industrial process instrumentation. The 12-bit SAR ADC with separate AVCC rail and integrated analog comparator delivers accurate pressure, temperature, and flow measurements, while the hardware 32-bit multiplier accelerates linearization and compensation math for thermocouples and strain gauges. The two USCI modules drive SPI sensors and UART IO-Link transceivers simultaneously, and the DMA controller offloads cyclic ADC-to-memory transfers so the CPU can sleep between samples. The 80-LQFP footprint provides 63 GPIO pins for redundant sensor interfaces, status LEDs, and HART modem connections.
Recommandé
Portable Medical and Fitness Devices
Battery-powered medical and fitness devices such as blood-pressure monitors, glucose meters, pedometers, and wearable health patches benefit from the MSP430F5329IPN's ultra-low-power operation. The 180 uA/MHz active current at 3 V combined with sub-microamp standby (LPMx.5 with RAM off) extends coin-cell and AAA battery life well beyond a year for intermittent-use applications. The 12-bit ADC captures PPG, ECG, and temperature signals with adequate resolution for clinical-grade measurements, while the integrated comparator simplifies threshold detection for heart-rate events. The hardware multiplier runs DSP primitives for heart-rate variability and step-count algorithms in real time without external DSP chips. The 80-LQFP provides ample GPIO for display drivers, button matrices, and BLE companion module connections.
Recommandé
Building Automation Nodes (HVAC, Lighting, Access Control)
Building automation controllers for HVAC dampers, lighting ballasts, and access-control panels fit naturally into the MSP430F5329IPN's peripheral mix. The four 16-bit timers drive TRIAC phase-angle control for AC dimming, PWM for LED drivers, and stepper-motor sequencing for damper actuators. The two USCI modules carry BACnet MS-TP, Modbus RTU, or KNX transceivers simultaneously over UART, while the 12-bit ADC reads 0-10 V analog setpoints and current-sense amplifiers for closed-loop control. The 128 KB Flash supports full BACnet or Modbus application stacks with margin, and the LPM3 standby at sub-3 uA keeps battery-backed nodes operational for the full product lifetime without service.
Recommandé
Ultra-Low-Power Wireless Sensor Network Base Stations
Wireless sensor network gateways and 6LoWPAN base stations need a microcontroller that can run a TCP/IP or Thread stack while keeping power low. The MSP430F5329IPN's 128 KB Flash accommodates Contiki, RIOT, or OpenWSN with room for application logic, while the 10 KB SRAM handles IPv6/6LoWPAN neighbor tables. The integrated hardware 32-bit multiplier accelerates AES-128 and ECC primitives for security handshakes. The five low-power modes allow the base station to enter LPM2 between packet bursts while still meeting sub-second latency requirements. The 12-bit ADC and analog comparator provide sensor-readout interfaces for local environmental monitoring alongside the wireless role.
Recommandé
Battery-Powered HVAC and Energy-Harvesting Controllers
Energy-harvesting HVAC controllers, wireless thermostats, and battery-backed damper actuators find a strong fit with the MSP430F5329IPN. The integrated 3.3-V LDO simplifies power-tree design by allowing direct connection of a 2.4-3.6 V battery or supercap source. The four timers handle TRIAC firing, PWM valve control, and a wakeup counter for scheduled HVAC cycles, while the 12-bit ADC reads thermistor bridges and current shunts. The RTC alarm with LPM3.5 retention keeps time-of-day scheduling accurate across months of standby. The hardware multiplier executes PID control loops efficiently, and the DMA channels offload ADC-to-memory conversion so the CPU can stay asleep until interrupt-driven control updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSP430F5329IPN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSP430F5329IPNR | MSP430F5327IPN | MSP430F5325IPN | MSP430F5529IPN | MSP430F5529IPNR |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 80-LQFP (PN) 12x12 mm | 80-LQFP (PN) 12x12 mm - same | 80-LQFP (PN) 12x12 mm - same | 80-LQFP (PN) 12x12 mm - same | 80-LQFP (PN) 12x12 mm - same | 80-LQFP (PN) 12x12 mm - same |
| Flash | 128 KB | 128 KB | 96 KB (-25%) | 64 KB (-50%) | 128 KB | 128 KB |
| SRAM | 10 KB | 10 KB | 10 KB | 10 KB | 10 KB | 10 KB |
| Core | MSP430 CPUXV2 | MSP430 CPUXV2 | MSP430 CPUXV2 | MSP430 CPUXV2 | MSP430 CPUXV2 | MSP430 CPUXV2 |
| Maximum Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Integrated USB PHY | No | No | No | No | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Highest Flash density in the F532x sub-family (vs MSP430F5327IPN (96 KB Flash))
- Full USB-equipped drop-in upgrade available (vs MSP430F5529IPN)
- Integrated 3.3-V LDO simplifies power tree (vs MSP430F5327IPN)
Notes de conception
Decouple DVCC with one 100 nF ceramic capacitor on every DVCC pin pair, plus one 4.7 uF bulk capacitor near the package. Tie AVCC through a ferrite bead to DVCC and decouple AVCC with a separate 100 nF plus 1 uF capacitor network; never share AVCC and DVCC bulk capacitors because ADC reference noise couples through the supply pin. The integrated 3.3-V LDO does not require external pass components, but adding a 1 uF output capacitor on the LDO output improves transient response under load steps.
JTAG and Spy-Bi-Wire programming pins (TEST/SBWTCK and RST/NMI/SBWTDIO) must be left in their default configuration or pulled high during reset for proper startup. Do not exceed 3.6 V on any GPIO or supply pin. The 32.768 kHz crystal on LFXTIN/LFXTOUT must use a load capacitor per the crystal datasheet (typically 12 pF); using a crystal with the wrong load capacitance causes RTC drift and may prevent low-power mode entry. Brownout reset (BOR) must be enabled in firmware after each reset to protect against low-voltage Flash corruption.
Estimated: At 25 MHz active mode with all peripherals enabled, the MSP430F5329IPN draws approximately 5 mA from a 3.3 V supply, dissipating roughly 16.5 mW. In LPM4 standby, current drops below 1 uA, dissipating under 3.3 uW. The 80-LQFP (PN) package has a typical theta_JA of approximately 50 C/W, so at full active load the junction temperature rise above ambient is approximately 0.8 C - well within the 125 C junction limit. No external heatsink is required; standard PCB thermal relief patterns are sufficient for industrial -40C to +85C ambient operation.
Route the 32.768 kHz crystal traces as short as possible, symmetric, and guarded by ground pour to minimize load-capacitance mismatch. Keep ADC analog traces (A0-A7, VREF+, VeREF-) away from digital switching lines and clock traces to avoid digital-coupling noise. Place the 100 nF decoupling capacitors within 2 mm of the corresponding supply pins. The 80-LQFP (PN) 12x12 mm package uses 0.5 mm pitch - follow TI's MSP430 LQFP-80 land pattern recommendations with via-in-pad or near-pad stitching vias for ground returns.
Informations de conformité
RoHS compliant per TI product page. Halogen-free per TI MSP430 family green-compliance documentation. Not AEC-Q100 qualified - this is an industrial-grade part (-40C to +85C). For automotive applications, evaluate AEC-Q100-qualified MSP430 variants separately.
