MVF50NN151CMK50 - Vybrid VF5xx 32-bit MPU 500MHz 364-LFBGA | NXP
Référence : MVF50NN151CMK50 ✓ ActifMVF50NN151CMK50 Présentation
What is an ARM Cortex-A5 MPU? An MPU (microprocessor unit) is a higher-performance variant of a microcontroller that typically lacks on-chip flash and runs from external memory. The ARM Cortex-A5 is an applications-class core implementing the ARMv7-A architecture with a memory management unit (MMU), enabling full operating systems such as Linux and Android. It sits in the Cortex-A family between the Cortex-A7 (newer, more power-efficient) and the older ARM926/ARM11 cores, balancing performance with low silicon cost. NXP positions the Vybrid VF5xx family at the intersection of microcontroller-level integration and applications-processor-level performance.
Key differentiating features include hardware cryptography acceleration for secure boot and TLS, a 32-channel DMA engine, dual SDHC ports, an LCD controller with touch support, multiple CAN and UART interfaces, and a low-power real-time clock domain. The 500 MHz Cortex-A5 delivers roughly 1.4 DMIPS/MHz of integer performance, sufficient for Linux graphical user interfaces and real-time control loops.
The Vybrid architecture pairs the Cortex-A5 with a separate Cortex-M4 microcontroller-style core on higher-tier VF6xx devices, but the VF5xx line is single-core for cost-sensitive designs. The integrated L2 Ethernet switch eliminates external switch chips in gateway and HMI applications.
Typical applications include industrial human-machine interfaces (HMIs), building automation gateways, smart energy and IoT edge nodes, point-of-sale terminals, and medical patient monitors. The combination of DDR3 support and an integrated display controller makes the part attractive for graphics-rich HMIs without an external companion GPU.
A critical design consideration is PCB layout for the 364-ball LFBGA: a minimum 4-layer stack-up with continuous ground reference beneath the package is required to maintain signal integrity on the DDR3 interface. Engineers should also plan for the boot configuration pins, which select between quad-SPI flash, SD card, and UART bootstrap modes.
This page synthesizes distributor pricing, drop-in alternatives within the Vybrid family, and practical design notes that go beyond the manufacturer datasheet, helping engineers shorten the BOM selection cycle and avoid common pitfalls.
Alternatives de remplacement direct pour MVF50NN151CMK50 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MVF50NN151CMK50 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Number of Cores, Security Features.
MVF50NS151CMK50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MVF51NN151CMK50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MVF61NN151CMK50
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MVF61NS151CMK50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MVF60NN151CMK50
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →MVF50NN151CMK50 Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-A5 |
| Number of Cores | 1 |
| Core Frequency | 500 MHz |
| Largeur du bus de données | 32-bit |
| On-chip SRAM | 1.5 MB |
| Instruction Set Architecture | ARMv7-A |
| Memory Interface | DDR2 / DDR3 with ECC support |
| Flash Memory | External (no on-chip flash) |
| Quad-SPI Interfaces | 2 (Execute-in-Place / XIP) |
| USB Controllers | 2x USB 2.0 High-Speed with integrated PHY |
| Ethernet MACs | 2x 10/100 Mbps with integrated L2 switch |
| Boîtier | 364-LFBGA (MAPBGA-364), 17x17 mm |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Type de montage | Surface Mount (BGA) |
| Security | No security / No secure boot (per suffix decoding) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MVF50NN151CMK50 364-lfbga (mapbga-364), 17x17 mm
Configuration des broches du MVF50NN151CMK50 (boîtier 364-lfbga (mapbga-364), 17x17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MVF50NN151CMK50.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MVF50NN151CMK50 convient pour 6 applications: Industrial Human-Machine Interface (HMI), Building Automation Gateway, Smart Energy / IoT Edge Node, Point-of-Sale (POS) Terminal, Medical Patient Monitor, Industrial Printer / Label Maker.
Industrial Human-Machine Interface (HMI)
The MVF50NN151CMK50 fits industrial HMI panels because it combines a 500 MHz Cortex-A5 capable of running Linux/Qt with an integrated LCD controller supporting WVGA parallel RGB panels, dual Ethernet for network redundancy, and the industrial -40C to +85C operating range. Placed at the heart of a 7-inch panel-mount HMI, it drives graphics, touch input, and fieldbus protocols (PROFINET, EtherNet/IP) from the same chip. The 1.5 MB on-chip SRAM accelerates framebuffer compositing while the DDR3 controller feeds the display pipeline.
Recommandé
Building Automation Gateway
For BACnet, KNX, or Modbus gateways bridging building automation networks to cloud services, the MVF50NN151CMK50's dual Ethernet MACs with integrated L2 switch allow two physical ports (LAN + daisy-chain) without an external switch IC. The Cortex-A5 at 500 MHz runs a Linux user-space BACnet stack while the dual quad-SPI interfaces XIP-boot from NOR flash and provide redundant firmware images. USB 2.0 ports support 802.11 Wi-Fi or Bluetooth dongles for wireless commissioning.
Recommandé
Smart Energy / IoT Edge Node
In smart-meter data concentrators and edge nodes, the MVF50NN151CMK50 provides the deterministic processing power required for DLMS/COSEM protocol parsing while keeping power consumption manageable through its multiple low-power modes. The hardware crypto (on the secure variant MVF50NS) accelerates TLS handshake for secure MQTT uploads. DDR3 support handles large time-series buffers before cloud sync. Operates fanless from -40C to +85C in outdoor enclosures.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals need a Linux-capable processor with PCI-friendly security, a touchscreen interface, and reliable peripheral connectivity. The MVF50NN151CMK50's integrated LCD controller and touch interface drive the cashier display directly, the dual USB ports connect to a magnetic-stripe reader and printer, and the Cortex-A5 handles EMV transaction flows. Pairing with the secure-boot sibling MVF50NS151CMK50 meets PCI PTS POI v6 firmware-authentication requirements.
Recommandé
Medical Patient Monitor
Patient monitors require IEC 60601-1-compliant isolation but a Linux-capable processor for waveform rendering and HL7 data export. The MVF50NN151CMK50 runs a Qt-based monitor UI at 500 MHz while the dual Ethernet ports separate the bedside network from the hospital network. The Cortex-A5's MMU isolates patient-data memory from RTOS areas when paired with the dual-core VF61xx upgrade for hard real-time sampling.
Recommandé
Industrial Printer / Label Maker
Industrial label printers stream rasterized graphics from the host over USB or Ethernet, then drive thermal printheads via GPIO. The MVF50NN151CMK50's dual high-speed USB with integrated PHY directly interfaces to printhead controllers and host PCs, while the DDR2/DDR3 controller buffers large label images at high print speeds. The industrial temperature rating ensures 24/7 factory-floor operation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MVF50NN151CMK50 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MVF50NS151CMK50 | MVF51NN151CMK50 | MVF61NN151CMK50 | MVF61NS151CMK50 | MVF60NN151CMK50 |
|---|---|---|---|---|---|---|
| Package | 364-MAPBGA (17x17 mm) | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same | 364-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 1 (Cortex-A5) | 1 (Cortex-A5) | 1 (Cortex-A5) | 2 (A5 + M4) | 2 (A5 + M4) | 2 (A5 + M4) |
| Cortex-A5 Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| On-chip SRAM | 1.5 MB | 1.5 MB | 1.5 MB | 1.5 MB | 1.5 MB | 1.5 MB |
| Hardware Security | No | Yes (secure boot, HW crypto) | No | No | Yes (secure boot, HW crypto) | No |
| Dual Ethernet + L2 Switch | Yes | Yes | Yes | Yes | Yes | Yes |
| Dual USB 2.0 with PHY | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Dual Ethernet with integrated L2 switch eliminates external switch IC (vs MVF50NS151CMK50 (secure variant))
- Single-core A5 keeps cost and power below dual-core VF61xx (vs MVF61NN151CMK50)
- Vybrid pin compatibility spans both VF5xx and VF6xx (vs MVF61NS151CMK50)
Notes de conception
The 364-ball MAPBGA at 0.8 mm pitch demands a 4-layer PCB minimum with a continuous solid ground plane on the layer directly beneath the package. Microvia-in-pad is recommended for production assemblies; tented vias under the BGA will cause solder-joint voids. Use ENIG or OSP surface finish (not HASL) for fine-pitch BGA reliability. Match trace lengths for the DDR3 interface within +/- 25 mil and route DQ/DQS pairs with 100-ohm differential impedance for the DQS signals.
Estimated: at full CPU + DDR3 + dual Ethernet activity, the MVF50NN151CMK50 dissipates approximately 2.2 W. With a 4-layer JEDEC board (theta-JA ~ 18 C/W), junction rises 40 C above ambient. Provide a thermal via array (9 vias at 0.3 mm drill on 1.0 mm pitch) directly under the die shadow to reduce theta-JB. For sealed enclosures with no airflow, derate ambient to 70 C maximum.
Sequence the Vybrid power rails with a companion PMIC such as the TPS65910 or PF0100. The Vybrid requires VDD_SOC and VDD_ARM to come up before the 1.2 V DDR rail. Failure to sequence properly can cause latch-up on the DDR3 interface. Add 22 uF ceramic + 100 nF HF decoupling on every rail pin, placed within 5 mm of the BGA ball. Estimated bulk decoupling for the 1.5 V SoC rail: 4 x 22 uF X5R 0805 ceramics in parallel.
Boot mode pins (BOOT_MODE[0:1]) must be held stable during POR and not glitched by a reset supervisor. Floating boot mode pins are a frequent cause of bricked boards that appear 'dead' on first power-up. Always use 10 kohm pull-ups or pull-downs to define the boot source. Additionally, the Vybrid's JTAG TDI pin doubles as a GPIO after reset; if JTAG is not used, configure the pin as input with internal pull-up to avoid leakage current.
Informations de conformité
RoHS and lead-free compliance per NXP product page. AEC-Q100 not applicable - the part is not qualified to automotive standard. For automotive Vybrid derivatives see the VF5xA series.
