MVF60NS151CMK50551 - Vybrid F 32-bit MPU, ARM Cortex-A5/M4 | NXP
Référence : MVF60NS151CMK50551 ✓ ActifMVF60NS151CMK50551 Présentation
A microprocessor (MPU) is a system-on-chip that integrates a CPU, memory interfaces, and a wide range of peripherals. Heterogeneous dual-core MPUs like the Vybrid VF6xx pair an application-class core (Cortex-A5) for Linux/RTOS GUI stacks with a microcontroller-class core (Cortex-M4) for low-latency motor control, sensor fusion, and safety routines. This architecture reduces board area, BOM cost, and inter-IC latency versus using two separate processors with shared buses.
Key features include dual USB 2.0 OTG controllers with integrated PHY, dual 10/100 Ethernet MACs for redundant networking, a TFT/LCD controller for direct display attachment, hardware encryption accelerators, and a 32-channel DMA engine. The device integrates 1.5 MB of on-chip SRAM and supports external DDR3/LPDDR2 memory through a 16-bit interface. Industrial temperature grade operation from -40C to +105C makes it suitable for factory floor deployment.
Typical applications include industrial human-machine interfaces (HMIs), programmable logic controllers (PLCs), building automation gateways, point-of-sale terminals, and connected medical devices. The M4 core's deterministic interrupt response is well-matched to motor control loops while the A5 core handles touch-screen GUI, OPC-UA, and Ethernet/IP protocol stacks.
When designing with this part, allocate the 364-ball MAPBGA escape routing carefully and provide a 4-layer or higher PCB stack-up to break out the LFBGA's 0.8 mm pitch balls. Ensure the DDR3/LPDDR2 interface follows the JEDEC layout rules for length-matched, impedance-controlled traces.
Alternatives de remplacement direct pour MVF60NS151CMK50551 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MVF60NS151CMK50551 (même facteur de forme et même empreinte) — différant par Ethernet, Mounting Type, Operating Temperature, Package, USB.
MVF60NS151CMK50
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MVF60NS151CMK50-Q
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MVF60NS152CMK50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MVF60NS151CMK50551-Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MVF60NS151CMK50551 Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-A5 + ARM Cortex-M4 (heterogeneous dual-core) |
| A5 Core Clock | 500 MHz |
| M4 Core Clock | 167 MHz |
| Bit Width | 32-bit |
| Family | Vybrid VF6xx |
| On-chip SRAM | 1.5 MB |
| External Memory Interface | DDR3 / LPDDR2, 16-bit |
| Boîtier | 364-LFBGA (17x17 mm, 0.8 mm pitch) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +105C (industrial) |
| USB | 2x USB 2.0 OTG with integrated PHY |
| Ethernet | 2x 10/100 MAC |
| Display Controller | TFT/LCD, up to WXGA |
| DMA Channels | 32 |
| Statut RoHS | Compliant |
| Tension d'alimentation | 1.2 V core / 3.3 V I/O (typical) |
Configuration des broches de MVF60NS151CMK50551
| Broche B1 | DDR3_DQ0 — DDR3 data lane 0 (LDI) |
| Broche A18 | VDD_ARM — Cortex-A5 core supply 1.2 V |
| Broche K18 | VDD_SOC — SoC core supply 1.2 V |
| Broche T4 | USB1_VBUS — USB OTG 1 VBUS detect |
| Broche U18 | GPIO_EMC_39 — General-purpose I/O / display control |
Applications typiques
MVF60NS151CMK50551 convient pour 7 applications: Industrial Human-Machine Interface (HMI), Programmable Logic Controller (PLC), Building Automation Gateway, Point-of-Sale (POS) Terminal, Connected Medical Device Controller, IoT Edge Gateway, Automotive Infotainment Head Unit.
Industrial Human-Machine Interface (HMI)
The MVF60NS151CMK50551's heterogeneous dual-core architecture pairs a 500 MHz ARM Cortex-A5 with a 167 MHz ARM Cortex-M4, making it ideal for industrial HMI panels that must drive a TFT/LCD touch display while handling real-time I/O scanning. The integrated TFT/LCD display controller supports WXGA resolution directly, eliminating the need for an external graphics controller and reducing BOM cost. The M4 core's deterministic interrupt response handles touch-panel scanning and emergency-stop latency-critical loops while the A5 core runs the GUI stack, OPC-UA, and HTTPS communications. Dual 10/100 Ethernet ports enable redundant ring-network topologies for factory-floor deployments.
Recommandé
Programmable Logic Controller (PLC)
In PLC applications the MVF60NS151CMK50551 combines an application processor for ladder-logic editors and web-based configuration UIs with a real-time core for deterministic scan loops. The M4 core at 167 MHz handles the 5-10 ms scan rate required by IEC 61131-3, while the A5 core runs the engineering tool interface and Modbus/TCP server. The 1.5 MB on-chip SRAM supports substantial I/O tables without external expansion, and the 32-channel DMA engine streams analog inputs without CPU load. Industrial -40C to +105C operation ensures deployment in unheated control cabinets.
Recommandé
Building Automation Gateway
The MVF60NS151CMK50551's dual 10/100 Ethernet ports and dual USB 2.0 OTG with integrated PHY make it a strong fit for building automation gateways that bridge BACnet/IP, KNX, Modbus, and Wi-Fi subnets. The A5 core handles the protocol translation stack while the M4 core manages real-time sensor polling and actuator safety routines. Hardware AES/SHA accelerators offload TLS termination for cloud connectivity, and the DDR3 interface supports large local databases of building telemetry. The 364-LFBGA package supports compact DIN-rail enclosure designs.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals benefit from the MVF60NS151CMK50551's combination of a Cortex-A5 application core for transaction processing, secure payment application execution, and a Cortex-M4 for real-time peripheral management including card readers, receipt printers, and barcode scanners. The integrated TFT/LCD controller drives the main operator display, while the dual USB OTG ports support peripherals without external hub ICs. Hardware encryption accelerators accelerate PCI-PTS compliant PIN encryption, and the 1.5 MB SRAM supports substantial transaction buffering during network outages.
Recommandé
Connected Medical Device Controller
Medical device controllers such as infusion pumps and patient monitors leverage the MVF60NS151CMK50551's deterministic M4 core for safety-critical loop control (drug delivery rate, alarm handling) and the A5 core for the touchscreen UI and HL7/DICOM network protocols. The hardware AES accelerator secures HIPAA-compliant data transmission, and the -40C to +105C industrial temperature range supports deployment in clinical and home-care environments. The DDR3 interface accommodates large patient data buffers and waveform recording.
Recommandé
IoT Edge Gateway
Industrial IoT edge gateways use the MVF60NS151CMK50551 as a single-chip protocol converter between legacy fieldbus networks and modern cloud MQTT brokers. The A5 core at 500 MHz runs the Linux-based MQTT/HTTPS stack and local time-series database, while the M4 core handles real-time polling of Modbus RTU, RS-485, and CAN sensors. The dual 10/100 Ethernet ports separate the fieldbus LAN from the IT network for security, and the DDR3/LPDDR2 controller supports large local data buffering during WAN outages. Industrial temperature grade ensures operation in outdoor enclosures.
Recommandé
Automotive Infotainment Head Unit
The MVF60NS151CMK50551's automotive-grade sibling variant supports automotive infotainment head units requiring CAN bus connectivity, TFT/LCD display driving, and rich multimedia processing. The dual-core architecture separates the safety-critical CAN stack on the M4 core from the Android/QNX infotainment OS on the A5 core. Hardware encryption secures vehicle-to-cloud communications, and the integrated USB OTG ports connect to smartphones for CarPlay/Android Auto bridging. The 364-LFBGA package fits behind standard 7-inch automotive displays.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MVF60NS151CMK50551 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MVF60NS151CMK50 | MVF60NS151CMK50-Q | MVF60NS152CMK50 | MVF60NS151CMK50551-Q |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 364-LFBGA (17x17) | 364-LFBGA (17x17) - same | 364-LFBGA (17x17) - same | 364-LFBGA (17x17) - same | 364-LFBGA (17x17) - same |
| A5 Core Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| M4 Core Clock | 167 MHz | 167 MHz | 167 MHz | 167 MHz | 167 MHz |
| Automotive Grade | Industrial | Industrial | Automotive (Q suffix) | Industrial | Automotive (Q suffix) |
| Ordering Suffix | CMK50551 | CMK50 | CMK50-Q | CMK50 | CMK50551-Q |
| Distributor Stock (as of 2026-10-17) | In stock (Rochester, Kynix) | In stock (DigiKey, Octopart) | Quote-only at distributors | Limited stock | Quote-only at distributors |
Principaux différenciateurs
- Heterogeneous dual-core architecture on a single die (vs MVF60NS151CMK50)
- Industrial temperature range out of the box (vs MVF60NS151CMK50-Q)
- Ordering suffix provides ordering/packaging clarity (vs MVF60NS151CMK50 (no 551 suffix))
Notes de conception
The 364-ball LFBGA at 0.8 mm pitch requires a 4-layer PCB minimum with microvia-in-pad (VIP) or via-in-pad (VIPPO) capability to break out the inner balls. Use a high-Tg (Tg >= 170C) FR-4 substrate such as Isola 370HR to survive the -40C to +105C industrial temperature range. Power plane splits under the BGA must avoid crossing the DDR3 reference voltage region.
DDR3/LPDDR2 traces must be routed as 50 ohm single-ended controlled impedance with length matching within 25 mils across the byte lane per JEDEC JESD79-3F rules. Place the DDR3 chips on the same PCB side as the BGA within 50 mm trace length. Reference the NXP hardware design guidelines (AN4727) for the exact stack-up and via pattern recommendations.
Do not apply power to VDD_ARM (1.2 V) before VDD_SOC is stable; the power-on sequencing requirement is documented in the Vybrid VF6xx datasheet. Decouple each supply pin with a 100 nF X7R ceramic plus a 4.7 uF bulk capacitor placed within 5 mm of the pin. Omitting the decoupling can lead to boot failures and corrupted SRAM contents at temperature extremes.
Estimated: at 500 MHz A5 + 167 MHz M4 dual-core operation with typical industrial workload, die power dissipation is approximately 1.2 W. The 364-LFBGA package theta_JA of approximately 18 C/W on a JEDEC 4-layer test board yields a junction temperature rise of about 22 C above ambient. Confirm final thermals with the NXP thermal model after PCB layout is finalized.
Informations de conformité
RoHS and REACH compliant per NXP product page. Industrial temperature range, not automotive qualified - choose MVF60NS151CMK50-Q for AEC-Q100 applications.
