P1021NSN2DFB - QorIQ P1 Dual-Core 800MHz SoC | NXP | PBGA-689
Référence : P1021NSN2DFB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $74.73 | $74,73 |
| 10 | $68.95 | $689,50 |
| 100 | $63.4 | $6 340,00 |
| 500 | $58.2 | $29 100,00 |
| 1 000 | $53.8 | $53 800,00 |
P1021NSN2DFB Présentation
A QorIQ SoC (System-on-Chip) is a highly integrated communications processor that combines CPU cores, memory controllers, networking peripherals, and acceleration engines on a single die. It sits within the MPU (microprocessor) tier of the system hierarchy: MPU -> microprocessor -> processor -> SoC -> integrated circuit -> semiconductor. QorIQ P1 platforms target networking, telecom, defense, and industrial markets where deterministic protocol handling and packet throughput dominate over raw application-processor performance.
Key features include dual e500 cores at 800MHz total (533/333/667 rated), 45nm low-power process, integrated QUICC Engine for HDLC/TDM/ATM, dedicated security acceleration, and a wide operating temperature range of 0C to 125C. The DDR2/3 controller supports ECC for high-reliability memory subsystems, while the multi-gigabit Ethernet MACs handle line-rate traffic for switches and routers. The device is offered in revision R1.1 of the silicon, ensuring silicon-level errata fixes versus the original P1021 mask.
Architecturally, the P1021NSN2DFB combines a coherent dual-core SMP subsystem with flexible I/O and high-bandwidth interconnect. The QUICC Engine offloads protocol processing, freeing the cores for control-plane software. Power consumption scales with operating frequency and is optimized for fanless industrial designs via 45nm process geometry.
Typical applications include industrial routers, secure VPN gateways, defense avionics networking, smart-grid RTUs, factory automation controllers, and LTE/LTE-Advanced small-cell base stations. The integrated peripherals and QUICC Engine make it a strong fit for protocol-heavy designs that need deterministic throughput.
When designing with the P1021NSN2DFB, pay attention to PCB substrate via-in-pad requirements for the 689-TEPBGA, thermal management via the exposed pad, and decoupling for the DDR2/3 interface. Multi-layer boards with controlled-impedance layers are strongly recommended.
This page synthesizes distributor stock levels, drop-in QorIQ P1 family alternatives, and lifecycle status data not consolidated in any single source, providing faster sourcing clarity for embedded engineers.
Alternatives de remplacement direct pour P1021NSN2DFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1021NSN2DFB (même facteur de forme et même empreinte) — différant par Ethernet, Operating Temperature, PCI Express, Processor Type, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1012NSN2DFB
✅ Remplacement direct✓ En stock
$38.66 / unité
Voir la fiche technique →P1020NSN2DFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1011NSN2DFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1021NSN2DFB Valeurs maximales et caractéristiques électriques
| Processor Type | QorIQ P1, MPU |
| Core Architecture | Power Architecture e500 dual-core |
| Core Frequency | 800MHz |
| Operating Modes | 533/333/667 MHz |
| Revision | R1.1 |
| Ethernet | Gigabit Ethernet (GbE) |
| Memory Controller | DDR2/DDR3 with ECC |
| Acceleration | QUICC Engine (QE) |
| PCI Express | PCIe Gen1/Gen2 |
| USB | USB 2.0 |
| TDM | TDM interface |
| Température de fonctionnement | 0C to 125C |
| Boîtier | 689-TEPBGA (31x31mm) |
| Type de montage | Surface Mount |
| Lead Free / RoHS | Lead Free / RoHS Compliant |
Guide de configuration des broches du P1021NSN2DFB 689-tepbga (31x31mm)
Configuration des broches du P1021NSN2DFB (boîtier 689-tepbga (31x31mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1021NSN2DFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1021NSN2DFB convient pour 7 applications: Industrial Router / Gateway, Defense Avionics Networking, Smart Grid Remote Terminal Unit (RTU), LTE Small-Cell Base Station, Factory Automation Controller (PLC/RPAC), Network Attached Storage / NAS SoC, Secure VPN / Industrial Firewall Appliance.
Industrial Router / Gateway
The P1021NSN2DFB's dual e500 cores at 800MHz, integrated Gigabit Ethernet, and QUICC Engine make it ideal for industrial routers and IPsec VPN gateways. The QE handles HDLC, TDM, and serial protocol encapsulation offloaded from the cores, freeing up cycle budget for routing tables, firewall DPI, and IPSec acceleration. The DDR2/3 with ECC controller supports reliable large routing tables and crypto buffers, while the GbE MACs deliver line-rate throughput. Power consumption stays manageable in fanless enclosures thanks to the 45nm process and 0C to 125C thermal envelope, making it suitable for DIN-rail mounted factory floor routers.
Recommandé
Defense Avionics Networking
The P1021NSN2DFB is widely adopted in defense avionics platforms due to its 0C to 125C operating range, deterministic QUICC Engine for MIL-STD-1553 / ARINC-429 bridges, and long-term support contracts via Rochester Electronics. The dual-core SMP subsystem supports partitioned ARINC-653 hypervisors, while the DDR ECC provides required SEU resilience for flight systems. The device's longevity and consistent silicon revision (R1.1) help defense integrators maintain stable BOMs across multi-decade program lifecycles.
Recommandé
Smart Grid Remote Terminal Unit (RTU)
For smart-grid RTUs communicating with substations via IEC 61850, DNP3, and serial legacy SCADA, the P1021NSN2DFB offers dedicated protocol offload in the QUICC Engine alongside powerful control-plane CPU cores. The integrated TDM interface ties into legacy teleprotection channels, while GbE supports modern substation networks. Industrial temperature and ECC memory back the reliability targets of utility operators. Field deployments often retain this QorIQ P1 across 15-20 year service cycles, justifying long-term support agreements.
Recommandé
LTE Small-Cell Base Station
The P1021NSN2DFB's combination of dual e500 cores, DDR2/3 bandwidth, multiple GbE ports, and PCIe link targets small-cell eNodeB designs handling Layer 2/3 termination. The QUICC Engine is repurposed for backhaul protocols while the CPUs run PHY stack and SON (Self-Organizing Network) software. USB 2.0 hosts diagnostic dongles or supervisory modules. The BGA's high pin count supports rich peripheral routing needed for radio cards and backhaul interfaces in compact form factor small cells.
Recommandé
Factory Automation Controller (PLC/RPAC)
In factory automation controllers, the P1021NSN2DFB serves as the protocol-conversion brain between PROFINET, EtherCAT, Modbus, and legacy fieldbuses. The dual cores split deterministic EtherCAT / PROFINET processing from application control-plane code, while the QE accelerates lower-level fieldbus master cycles. Wide 0C to 125C operating range supports cabinet-free mounting in hot industrial environments. The PCI Express link provides expansion to FPGA coprocessors for high-speed analog frontend processing in motion control.
Recommandé
Network Attached Storage / NAS SoC
Mid-range enterprise NAS appliances leverage the P1021NSN2DFB's GbE interfaces for multi-port link aggregation, while dual e500 cores run filesystem services and RAID management. DDR3 with ECC supports large page-cache memory; SATA/Pcie expansion connects to disk shelves. The QUICC Engine can compress or deduplicate incoming data streams, offloading the main cores from compute-heavy transfers. Energy-efficient 45nm silicon supports fanless home/SMB NAS chassis.
Recommandé
Secure VPN / Industrial Firewall Appliance
The P1021NSN2DFB with hardware-accelerated QUICC Engine and cryptographic helpers suits mid-range VPN and stateful firewall appliances for OT environments. Dual cores handle encrypted tunnels (IPsec/SSL) while GbE supports multi-WAN deployment. The 689-TEPBGA exposed pad provides solid thermal performance for sealed fanless enclosures under sustained crypto load. ECC memory prevents bit-flip induced security breaches in industrial sites.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1021NSN2DFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1012NSN2DFB | P1020NSN2DFB | P1011NSN2DFB |
|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31mm) | 689-TEPBGA II (31x31mm) - same | 689-TEPBGA II (31x31mm) - same | 689-TEPBGA II (31x31mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | Dual e500 (2 cores) | Single e500 (1 core) | Dual e500 (2 cores) | Single e500 (1 core) |
| Core Frequency | 800MHz | 800MHz | 800MHz | 800MHz |
| Memory Controller | DDR2/3 with ECC | DDR2/3 with ECC | DDR2/3 with ECC | DDR2/3 with ECC |
| Ethernet | Gigabit Ethernet (GbE) | Gigabit Ethernet | Gigabit Ethernet | Gigabit Ethernet |
| QUICC Engine | Yes (QE) | Yes (QE) | Yes (QE) | Yes (QE) |
| Operating Temperature | 0C to 125C | 0C to 125C | 0C to 125C | 0C to 125C |
Principaux différenciateurs
- Dual-core version with full 800MHz spec maintained (vs P1012NSN2DFB)
- R1.1 revision silicon with errata fixes (vs Older P1021 R1.0 parts)
- Identical package to facilitate inventory commonality (vs LS1028AXE7PQA)
Notes de conception
Estimated: The 689-TEPBGA II 31x31mm package at 1mm pitch requires microvia-in-pad PCB stackup (e.g., 8-layer with 4 mil trace/space). Designers should specify ENIG surface finish to ensure reliable BGA solder joints across thermal cycles. Per IPC-7093, NSMD land pads outperform SMD for BGA reliability, especially in industrial temperatures.
Estimated: The exposed thermal pad must be soldered to a 4x thermal via array (0.3mm drill, 1.2mm pitch) connecting to an internal copper plane. Without proper via thermal management the junction can exceed 125C in fanless enclosures above 60C ambient. A minimum 1 oz internal copper pour under the BGA is recommended based on typical QorIQ P1 family thermal data.
Estimated: At 800MHz dual-core with GbE active, typical core power is in the 4-6 W range. Designers should provision the core rail with a 2% accurate DC-DC regulator (e.g., 1.0V at 6A) and bulk bypass of 22uF ceramic + 470uF polymer near the SoC. Sequence core before IO rails to avoid memory controller lockup during cold boot.
Estimated: Do not assume newer silicon revisions are pin-compatible; the P1021NSN2DFB is revision R1.1 and BSPs targeted at R1.0 may exhibit lockup. Confirm RCW (Reset Configuration Word) sources from production silicon boundary scan before mass production. Avoid placing the QUICC Engine timebase on the same clock domain as the USB PHY to prevent jitter-induced TDM drift.
Informations de conformité
RoHS compliant and lead-free per NXP and distributor datasheets. AEC-Q100 not applicable - industrial MPU, not automotive. Halogen-free status not explicitly documented in available web data - request material declaration sheet from NXP for definitive confirmation.
