P1024NXN5DFB - QorIQ P1 Dual-Core 667MHz SoC | NXP Semiconductors
Référence : P1024NXN5DFB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $70.46 | $70,46 |
| 10 | $65.2 | $652,00 |
| 100 | $58.4 | $5 840,00 |
| 500 | $52.1 | $26 050,00 |
| 1 000 | $47.85 | $47 850,00 |
P1024NXN5DFB Présentation
A QorIQ communications processor is a system-on-chip (SoC) that integrates one or more Power Architecture CPU cores with high-speed networking peripherals, memory controllers, and accelerator blocks. The P1024NXN5DFB sits in the hierarchy: Power Architecture CPU -> QorIQ P1 SoC -> communications processor -> embedded networking MCU. It targets the same role as the older PowerQUICC III family but with significantly higher integration at 45 nm process geometry.
Key features highlighted in the verified data include the dual-core e500v2 configuration, an internal core complex supporting up to 667 MHz operation, DDR3 memory controller with ECC for reliable networking memory, integrated Gigabit Ethernet MACs, PCI Express lanes, USB 2.0 controller, TDM/SGMII serial interfaces, and an industrial -40°C to +125°C operating range. The part is offered in tray packaging suitable for high-rel manufacturing.
The P1024NXN5DFB is implemented on a 45 nm low-power CMOS process and includes hardware-accelerated cryptography, QUICC Engine packet handling, and RapidIO optional interfaces in the wider P1 family. Revision 1.1 silicon identifies the specific mask set, important for software/firmware compatibility and erratum tracking; engineers should validate Rev 1.1 against their BSP and SDK distributions.
Typical applications include industrial routers, secure gateways, industrial Ethernet switches, defense and aerospace networking, telecom edge equipment, and industrial IoT controllers. The combination of dual-core processing and integrated GbE/PCIe makes it well-suited for L2/L3 managed switches and secure VPN gateways.
When designing with this SoC, plan thermal management: at 667 MHz dual-core the part dissipates several watts and the TEBGA I package requires substantial PCB copper or airflow. Validate BSP/driver support for your Linux distribution and confirm that the 561-ball TEBGA I footprint matches your PCB design rules before committing to layout.
This page synthesizes distributor pricing, lifecycle status (End-of-Life per the NXP product page), datasheet references, and practical design notes not consolidated on any single vendor page.
Alternatives de remplacement direct pour P1024NXN5DFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1024NXN5DFB (même facteur de forme et même empreinte) — différant par Memory Controller, Package, USB, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1024NXE5DFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1024NXN5DFB-R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1024NXN5BFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1015NXN5DFB
✅ Remplacement direct✓ En stock
$49.95 / unité
Voir la fiche technique →P1024NXE5BFB
✅ Remplacement direct✓ En stock
$138.5 / unité
Voir la fiche technique →P1024NXN5DFB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 |
| Number of Cores | 2 |
| Core Frequency (Max) | 667 MHz |
| Largeur du bus de données | 32-Bit |
| Memory Controller | DDR3 with ECC |
| Ethernet | Gigabit Ethernet (GbE) |
| PCI Express | Integrated (PCIe) |
| USB | USB 2.0 |
| TDM/SGMII | Yes |
| Process Technology | 45 nm |
| Boîtier | 561-TEBGA I (23x23 mm) |
| Température de fonctionnement | -40°C to +125°C |
| Revision | 1.1 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per NXP product page) |
Guide de configuration des broches du P1024NXN5DFB 561-tebga i (23x23 mm)
Configuration des broches du P1024NXN5DFB (boîtier 561-tebga i (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1024NXN5DFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1024NXN5DFB convient pour 8 applications: Industrial Secure Gateway Router, L2/L3 Managed Ethernet Switch, Defense and Aerospace Networking, Telecom Edge Equipment / Small Cell, Industrial IoT Gateway Controller, Network Security Appliance (Firewall/VPN), Industrial Single-Board Computer (SBC), TDM/Packet Voice Gateway.
Industrial Secure Gateway Router
The P1024NXN5DFB's dual e500v2 cores at 667 MHz, integrated GbE MACs, PCIe, and hardware-accelerated cryptography make it a strong fit for industrial secure gateway routers. Why it fits: dual-core parallelism allows separate control-plane (routing/OSPF/BGP) and data-plane (IPsec/TLS) processing without contention, while the -40°C to +125°C industrial temperature range supports deployment in outdoor enclosures, factory floors, and substations. How it's used: the part typically sits at the heart of the gateway, with one GbE link to the WAN uplink and a second to the LAN switch fabric via PCIe-attached MAC/PHY, while DDR3/ECC memory holds routing tables and VPN encryption contexts. Unlike ARM Cortex-A class alternatives, the Power Architecture e500v2 deterministic interrupt latency benefits industrial protocols requiring bounded response times.
Recommandé
L2/L3 Managed Ethernet Switch
The P1024NXN5DFB integrates PCIe for connecting external Gigabit switch ASICs and includes GbE MACs for management/uplink ports, making it ideal as the CPU subsystem of L2/L3 managed Ethernet switches. Why it fits: at 667 MHz dual-core it can run a full Linux networking stack with iptables, Open vSwitch, or commercial NOS while handling 10K+ ACL entries on 1 Gbps uplinks. How it's used: typically the SoC sits on a switch CPU card with 1-2 GB of DDR3/ECC memory, PCIe lanes fan out to multi-port GbE/PHY switches, and management Ethernet is served via an integrated GMII port. The Rev 1.1 silicon guarantees software-binary compatibility across deployments.
Recommandé
Defense and Aerospace Networking
The P1024NXN5DFB's -40°C to +125°C industrial temperature grade, integrated security engine, and Power Architecture deterministic interrupt response make it well-suited for defense and aerospace networking platforms. Why it fits: military communications need robust temperature tolerance, hardware-accelerated encryption (IPsec, MACsec), and ECC memory for SIGINT/mission-critical processing. How it's used: fielded in tactical radios, vehicle-mounted routers, and UAV ground stations where the SoC runs a hardened Linux distribution (typically CentOS-based or VxWorks) with crypto-offload libraries. NXP's QorIQ P1 family has a long pedigree in defense programs, simplifying qualification paperwork.
Recommandé
Telecom Edge Equipment / Small Cell
The P1024NXN5DFB's integrated TDM support, GbE, and PCIe make it a viable control-plane processor for telecom edge equipment and small-cell base stations. Why it fits: telecom operators require deterministic processing of TDM traffic alongside Ethernet/IP backhaul - the e500v2 core's real-time interrupt latency and integrated TDM controllers handle legacy T1/E1 interfaces. How it's used: the SoC handles Layer 2/3 termination, OAM (Y.1731, 802.1ag), and synchronization distribution (1588v2 PTP), while a baseband ASIC offload handles RF processing. The industrial temperature range supports outdoor small-cell cabinets.
Recommandé
Industrial IoT Gateway Controller
The P1024NXN5DFB is well-matched to industrial IoT gateway controllers aggregating Modbus/Profibus/Ethernet/IP traffic into cloud-bound MQTT streams. Why it fits: the dual-core architecture allows one core to handle deterministic fieldbus polling while the other runs TLS-secured MQTT publishing to cloud brokers. How it's used: typically deployed in factory automation cells where the SoC bridges legacy PLC networks to modern cloud platforms. DDR3/ECC memory supports protocol stacks and TLS session caches, while GbE uplinks connect to industrial switches.
Recommandé
Network Security Appliance (Firewall/VPN)
The P1024NXN5DFB's hardware-accelerated security engine, integrated GbE, and PCI Express lanes supporting Crypto accelerators make it ideal for network security appliances including firewalls, VPN concentrators, and IDS/IPS. Why it fits: at 667 MHz dual-core, it can run a full Linux-based firewall stack (iptables/nftables, Suricata/Snort) with hardware IPsec acceleration reaching multi-Gbps throughput. How it's used: typically deployed as a 1U rack-mount appliance with GbE WAN/LAN ports, DDR3/ECC memory for connection tracking tables, and optional PCIe-attached hardware security modules (HSMs). The industrial temperature range supports non-datacenter deployments.
Recommandé
Industrial Single-Board Computer (SBC)
The P1024NXN5DFB is the centerpiece of industrial SBCs serving as ruggedized controllers for SCADA, substation automation, and railway signaling. Why it fits: 45 nm low-power implementation with integrated peripherals eliminates discrete components, reducing SBC bill-of-materials and improving MTBF. How it's used: designers pair the SoC with 1-2 GB DDR3/ECC memory, a NOR/NAND boot flash, GbE PHYs, USB Type-A for peripherals, and PCIe for expansion (CAN, RS-485, digital I/O). The -40°C to +125°C grade supports field cabinets without air conditioning, with Rev 1.1 silicon ensuring BSP stability.
Recommandé
TDM/Packet Voice Gateway
The P1024NXN5DFB's TDM controllers and GbE interfaces make it suitable for hybrid TDM-packet voice gateways used in legacy PSTN-to-SIP migration. Why it fits: telecom operators need to bridge T1/E1 circuits to SIP trunks, often with transcoding between G.711/G.729. How it's used: the SoC processes TDM time slots on one core while packet handling, RTP/RTCP, and SIP signaling run on the other, with DDR3/ECC memory holding voice buffers and DSP-image data. The industrial temperature range supports CO (central office) deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1024NXN5DFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1024NXE5DFB | P1024NXN5DFB-R | P1024NXN5BFB | P1015NXN5DFB | P1024NXE5BFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 561-TEBGA I (23x23 mm) | 561-TEBGA I (23x23 mm) - same | 561-TEBGA I (23x23 mm) - same | 561-TEBGA I (23x23 mm) - same | 561-TEBGA I (23x23 mm) - same | 561-TEBGA I (23x23 mm) - same |
| Core Architecture | Power Architecture e500v2 (dual-core) | Power Architecture e500v2 (dual-core) | Power Architecture e500v2 (dual-core) | Power Architecture e500v2 (dual-core) | Power Architecture e500v2 (single-core) | Power Architecture e500v2 (dual-core) |
| Core Frequency (Max) | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
| Number of Cores | 2 | 2 | 2 | 2 | 1 (-50% vs this product) | 2 |
| Operating Temperature | -40°C to +125°C (industrial 'N' grade) | 0°C to +105°C (commercial 'E' grade) | -40°C to +125°C (industrial 'N' grade) | -40°C to +125°C (industrial 'N' grade) | -40°C to +125°C (industrial 'N' grade) | 0°C to +105°C (commercial 'E' grade) |
| Silicon Revision | Rev 1.1 | Rev 1.1 | Rev 1.1 | Rev 1.1 (equivalent date-code variant) | Rev 1.1 | Rev 1.1 |
| DDR3/ECC Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Principaux différenciateurs
- Industrial -40°C to +125°C temperature grade (vs P1024NXE5DFB)
- Dual-core 667 MHz performance for parallel control/data plane (vs P1015NXN5DFB)
- Identical QorIQ P1 silicon family for software compatibility (vs Cross-brand Marvell ARMADA XP / Cavium OCTEON)
- Integrated TDM/SGMII/PcIe/USB saves BOM (vs Discrete CPU + separate network SoC)
- 561-TEBGA I footprint shared across P1 family for design reuse (vs NXP LS1024A / T1024 migration parts)
Notes de conception
Estimated: at 667 MHz dual-core full utilization on a 45 nm process, the P1024NXN5DFB dissipates on the order of 4-7 W depending on workload and peripheral activity. The 561-TEBGA I package has a relatively small thermal dissipation footprint (23x23 mm), so designers must provide substantial PCB copper pours on a 4-6 layer stackup with dedicated power/ground planes. For full-load industrial deployments at +125°C ambient, active airflow or a heatsink is recommended. Use the official NXP power-estimation spreadsheet for the design's clock and voltage configuration to obtain an accurate junction-temperature projection.
The 561-ball TEBGA I (23x23 mm) package requires a fine-pitch, multi-layer PCB with controlled-impedance routing for DDR3, GbE SerDes, and PCIe lanes. Designers should: (1) use 8-12 mil micro-via-in-pad or stacked-via construction to escape the BGA; (2) length-match DDR3 data/address/control within ±25 ps per the QorIQ P1 hardware specifications; (3) isolate analog/RF grounds from digital returns to minimize GbE PHY noise coupling; (4) follow the NXP layout checklist for power-plane stitching and decoupling (typically 100 nF X7R capacitors at every 8-12 balls + bulk polymer/tantalum on the SoC supply rails).
Engineering pitfalls to avoid: (1) Do not assume P1024NXN5DFB and P1024NXE5DFB are interchangeable in industrial deployments - the E variant's 0°C to +105°C range will fail below 0°C. (2) Match software BSPs to silicon revision (Rev 1.1) - older BSPs may have erratum patches that don't apply to newer silicon and vice versa. (3) The DDR3 ECC controller requires specific initialization sequences at boot; failing to program the DDR register set correctly causes silent boot failures. (4) The TDM controller and GbE ports share SerDes multiplexing - software must configure SerDes lane assignment before bringing up interfaces, or links will fail to negotiate.
For GbE/PCIe SerDes interfaces in the 1.25-2.5 Gbps range, signal-integrity margins are tight. Use the official NXP IBIS-AMI models for channel simulation; target insertion-loss below -6 dB at Nyquist and return-loss better than -10 dB. Reference-plane transitions near the BGA must be void-free to avoid impedance discontinuities. For boards targeting 5 Gbps or higher SerDes (PCIe Gen 2), consider moving to a higher-performance QorIQ variant like LS1024A. Verify with eye-diagram measurement on first prototype boards before committing to volume manufacturing.
Power-rail sequencing requirements: the P1024NXN5DFB requires specific power-up and power-down sequences for its core, DDR3, SerDes, and I/O supplies. Core voltage typically 1.0 V, DDR3 I/O at 1.5 V, SerDes at 1.0 V, with sequencing enforced by hardware or PMIC. Using an out-of-sequence supply ramp may latch up the device or require a full power-cycle to recover. The NXP datasheet specifies 100 ms maximum rise-time deltas; design the PMIC (or discrete LDO tree) accordingly and add a watchdog to detect incomplete power-on.
Informations de conformité
RoHS compliance and lead-free packaging confirmed per NXP product page (https://www.nxp.com/part/P1024NXN5DFB). REACH, halogen-free status, and conflict-mineral declarations should be requested from NXP or verified through authorized distributor compliance documentation at order placement. The -40°C to +125°C industrial temperature grade indicates industrial-grade silicon but is not AEC-Q100 automotive-qualified.
