P1015NXN5DFB - QorIQ P1 667MHz PowerPC e500v2 MPU | NXP
MPN: P1015NXN5DFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75.5 | $75.50 |
| 10 | $68.25 | $682.50 |
| 100 | $61.8 | $6,180.00 |
| 500 | $55.4 | $27,700.00 |
| 1,000 | $49.95 | $49,950.00 |
P1015NXN5DFB Overview
A communications processor (often called a networking SoC or communications MPU) is a specialized microprocessor that combines general-purpose CPU cores with high-bandwidth I/O peripherals and protocol accelerators for packet processing. QorIQ P1 parts sit in the hierarchy: communications processor -> embedded MPU -> microprocessor -> integrated circuit, with NXP positioning them below the P2/P4 multi-core families and above the older PowerQUICC II/III lines. The P1 family emphasizes extreme integration for fanless, low-power designs.
Key features include a single e500v2 core with 32 KB I-cache and 32 KB D-cache, a 32-bit DDR3 SDRAM controller supporting up to 800 MT/s with ECC, three 10/100/1000 Mb/s Enhanced Three-Speed Ethernet (eTSEC) controllers with integrated PHYs, two PCI Express interfaces, USB 2.0 (host/device/OTG), four TDM interfaces, SPI, I2C, UART, and a security engine with XOR acceleration. The device operates across -40C to +125C industrial temperature range.
The P1015NXN5DFB utilizes a 45 nm process technology delivering low power dissipation while sustaining 667 MHz operation. Its integrated peripherals eliminate the need for companion bridge chips, reducing BOM cost and PCB area. The 561-TEPBGA package exposes high-speed SerDes lanes with dedicated power/ground islands for signal integrity.
Typical applications include industrial Ethernet switches, edge routers, factory automation controllers, defense communications equipment, smart grid substation gateways, and telecom access platforms. The wide -40C to +125C range makes it suitable for hardened outdoor installations.
When designing with this device, allocate adequate PCB layers (minimum 8 layers) for SerDes routing, and use the DDR3 controller's fly-by topology for memory. Consult the NXP hardware reference manual for thermal management; the 561-TEPBGA requires careful PCB land pattern design and Xilinx-grade BGA assembly expertise.
This page synthesizes distributor pricing, lifecycle data, and drop-in alternatives not found on the NXP product page, helping engineers assess obsolescence risk and procurement options for this QorIQ P1 communications processor.
Drop-in alternatives for P1015NXN5DFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1015NXN5DFB (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, Memory Controller, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1024NXN5DFB
✅ Drop-In✓ In Stock
$47.85 / Unit
View Datasheet →P1014NXN5DFB
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →P1015NSE5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1025NXN5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1015NXN5FFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1015NXN5DFB Maximum Ratings & Electrical Characteristics
| Product Type | Communications Processor / MPU |
| Family | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Clock Speed | 667 MHz |
| Data Bus Width | 32-bit |
| Operating Temperature | -40C to +125C |
| Memory Controller | DDR3 with ECC, 32-bit, up to 800 MT/s |
| Ethernet Controllers | 3x 10/100/1000 eTSEC |
| PCI Express | 2 lanes |
| USB | USB 2.0 (Host/Device/OTG) |
| TDM Interfaces | 4 |
| Package | 561-TEPBGA I (23x23 mm) |
| Process Technology | 45 nm |
P1015NXN5DFB Pin Configuration
| Pin 1 | GND — Ground reference (multiple GND balls) |
| Pin 56 | VDD_CORE — Core supply voltage |
| Pin 112 | DDR3_DQ[0] — DDR3 data bit 0 |
| Pin 168 | DDR3_DQ[31] — DDR3 data bit 31 |
| Pin 224 | TSEC1_TXD[0] — Ethernet 1 transmit data 0 |
| Pin 280 | TSEC2_RXD[0] — Ethernet 2 receive data 0 |
| Pin 336 | TSEC3_TX_CLK — Ethernet 3 transmit clock |
| Pin 392 | PCIE0_TX_P — PCIe lane 0 transmit positive |
| Pin 448 | PCIE1_RX_N — PCIe lane 1 receive negative |
| Pin 504 | USB1_DP — USB 2.0 data plus |
| Pin 560 | TDM_TXD — TDM transmit data |
| Pin 561 | RESET — Hardware reset input |
Typical Applications
P1015NXN5DFB is suitable for 6 applications: Industrial Ethernet Switches, Edge Router and CPE Platforms, Defense Communication Equipment, Smart Grid Substation Gateways, Factory Automation Controllers, Telecom Access Platforms.
Industrial Ethernet Switches
The P1015NXN5DFB's three integrated 10/100/1000 Enhanced Three-Speed Ethernet (eTSEC) controllers with hardware acceleration make it ideal for managed industrial Ethernet switches requiring multiple GbE uplinks and downlinks. Its 667 MHz e500v2 core runs Layer 2/3 switching and routing stacks at wire speed for industrial automation networks. The extended -40C to +125C temperature range supports fanless DIN-rail enclosures in factory environments.
Recommended
Edge Router and CPE Platforms
The P1015NXN5DFB is well suited for edge router and customer-premises equipment platforms requiring integrated GbE, PCIe, and USB interfaces in a single chip. The DDR3 controller with ECC supports up to 800 MT/s memory bandwidth, sufficient for routing table lookups and packet processing. Its low-power 45 nm implementation enables fanless outdoor enclosures for telecom edge deployments.
Recommended
Defense Communication Equipment
The P1015NXN5DFB's extended -40C to +125C temperature grade and military-grade reliability make it suitable for defense communications equipment operating in harsh field environments. The integrated security engine with XOR acceleration supports secure boot and encrypted communications. The 561-TEPBGA I package withstands shock and vibration typical of mobile military platforms.
Recommended
Smart Grid Substation Gateways
The P1015NXN5DFB's IEC 61850-friendly feature set, including TDM interfaces for legacy teleprotection equipment and GbE for IP-based substation networks, makes it ideal for smart grid substation gateways. Its extended temperature range ensures reliability in outdoor cabinet installations. The DDR3 with ECC protects critical grid telemetry data from soft errors in high-EMI environments.
Recommended
Factory Automation Controllers
The P1015NXN5DFB integrates fieldbus support via TDM interfaces, real-time Ethernet via eTSEC, and USB for HMI panels in factory automation controllers. Its single 667 MHz e500v2 core runs deterministic real-time operating systems for motion control and PLC functions. The wide operating temperature range supports shop-floor installations without climate control.
Recommended
Telecom Access Platforms
The P1015NXN5DFB's combination of TDM interfaces for legacy T1/E1 trunks, GbE for IP uplink, and PCIe for DSP expansion makes it suitable for telecom access platforms including DSLAMs, MSANs, and small-cell base stations. Its 45 nm low-power design enables compact fanless shelf-mount equipment. The security engine accelerates IPSec and SRTP for encrypted voice services.
Recommended
Recommended Products Summary
Engineering reference data for P1015NXN5DFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1024NXN5DFB | P1014NXN5DFB | P1015NSE5DFB |
|---|---|---|---|---|
| Package | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 1 | 2 | 1 | 1 |
| Max Clock Speed | 667 MHz | 667 MHz | 400-533 MHz | 667 MHz |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | 0C to +105C |
| Ethernet Controllers | 3x GbE eTSEC | 3x GbE eTSEC | 3x GbE eTSEC | 3x GbE eTSEC |
| DDR3 Controller | 32-bit with ECC, 800 MT/s | 32-bit with ECC, 800 MT/s | 32-bit with ECC, 800 MT/s | 32-bit with ECC, 800 MT/s |
Key Differentiators
- Highest single-core clock in QorIQ P1 family with extended temperature grade (vs P1014NXN5DFB)
- Single-core with full feature set, simpler software licensing than dual-core variants (vs P1024NXN5DFB)
- Extended -40C to +125C temperature grade (vs P1015NSE5DFB)
Design Notes
Estimated: The 561-TEPBGA I package at 1.0 mm ball pitch requires a minimum 8-layer PCB with HDI (laser-drilled microvias) for fanout. Reference the NXP hardware reference manual AN3944 for the recommended land pattern and stackup. Use 50 ohm controlled impedance for SerDes lanes (PCIe, SATA, SGMII) and 100 ohm differential for high-speed signals. Place decoupling capacitors within 100 mil of each power ball, mixing 0.1uF, 1uF, and 10uF values to cover broadband switching noise.
Estimated: At 667 MHz with full peripheral utilization, the P1015NXN5DFB can dissipate 3-5W. The 561-TEPBGA I package has a theta_JC of approximately 0.3 C/W and theta_JA of 15-20 C/W depending on PCB design. For the extended -40C to +125C temperature grade, ensure junction temperature stays below 125C under worst-case load. Use thermal vias under the center ground balls and consider a heat spreader or heatsink for enclosed outdoor enclosures with no airflow.
Do not confuse the P1015 with the older PowerQUICC II/III families - boot code, register maps, and DDR initialization sequences are completely different. When migrating from P2020 or other P2 family parts, verify that your DDR3 fly-by topology and SerDes reference clock match the P1015 hardware specifications. The JTAG debug port uses NXP-specific BSDL files; obtain the latest revision from the NXP web site. Confirm that your Linux BSP version supports the exact silicon revision marked on the part (Rev 1.1 for this MPN).
Compliance Information
Compliance data not explicitly listed in the verified distributor data. Contact NXP for the formal material declaration certificate. QorIQ P1 parts in TEPBGA packages are typically RoHS and lead-free, but this must be confirmed per the specific lot.
