PIC16F1716-E/MV - 14KB Flash 8-bit MCU w/ Op Amps | Microchip
Référence : PIC16F1716-E/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.89 | $1,89 |
| 10 | $1.71 | $17,10 |
| 100 | $1.52 | $152,00 |
| 500 | $1.35 | $675,00 |
| 1 000 | $1.18 | $1 180,00 |
PIC16F1716-E/MV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, RAM, non-volatile memory, and peripherals onto one silicon die. The PIC16F1716 belongs to the "8-bit intelligent analog" category, a class of MCUs that combine traditional digital control with on-chip analog peripherals such as operational amplifiers, 10-bit ADCs, 5/8-bit DACs, and high-speed comparators. Within the broader semiconductor taxonomy, an MCU sits below microprocessors (which lack integrated memory) and above discrete logic in integration level, serving as the programmable decision-making element in embedded systems.
Key features include on-chip op amps that eliminate external signal-conditioning components, Peripheral Pin Select (PPS) for flexible pin mapping, and Microchip's eXtreme Low Power (XLP) technology that achieves nanoWatt sleep currents suitable for battery-powered applications. The 10-bit ADC and high-speed comparator allow direct interfacing with analog sensors, while the 5/8-bit DAC enables analog waveform generation for control loops.
Architecturally, the PIC16F1716 uses a RISC-based Harvard processor core with 49 instructions and a 16-level hardware stack. The 32 MHz operation delivers 8 MIPS of throughput, sufficient for sensor processing and PID control loops. Integrated Core Independent Peripherals can operate without CPU intervention, reducing firmware complexity and freeing the core for higher-level tasks.
Typical applications include sensor signal conditioning with on-chip op amps, LED lighting control using the COG peripheral, motor control loops with PWM and comparator feedback, and general-purpose IoT endpoints where low power consumption is critical. The combination of intelligent analog and CIPs makes this MCU particularly suited for cost-sensitive mixed-signal designs.
When designing with this device, place decoupling capacitors within 2 mm of each VDD pin and use the exposed pad to minimize thermal resistance. The PPS feature allows pin reassignment but requires care to avoid conflicts between peripherals sharing alternate pins.
This page synthesizes distributor pricing, drop-in alternatives from the PIC16F170X/171X family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC16F1716-E/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F1716-E/MV (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Comparators, I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F1716-I/MV
✅ Remplacement direct✓ En stock
$1.04 / unité
Voir la fiche technique →PIC16F1716T-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F1713-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F1713T-I/MV
✅ Remplacement direct✓ En stock
$1.18 / unité
Voir la fiche technique →PIC16F1713-E/MV
✅ Remplacement direct✓ En stock
$1.38 / unité
Voir la fiche technique →PIC16F1516T-I/MV
✅ Remplacement direct✓ En stock
$1.62 / unité
Voir la fiche technique →PIC16F1716-E/MV Valeurs maximales et caractéristiques électriques
| Product Family | PIC16F171X |
| Core Architecture | 8-bit PIC RISC (Harvard) |
| Program Memory (Flash) | 14 KB (8K x 14) |
| RAM | 1 KB |
| Maximum CPU Frequency | 32 MHz |
| Operating Voltage | 3 V to 5.5 V |
| ADC | 10-bit |
| DAC | 5/8-bit |
| On-Chip Op Amps | Yes |
| High-Speed Comparators | Yes |
| Core Independent Peripherals | CLC, COG, NCO, ZCD |
| Peripheral Pin Select (PPS) | Yes |
| Communication | EUSART, I2C/SPI |
| PWM / CCP | Yes |
| Boîtier | 28-pin UQFN (MV) 4x4 mm with exposed pad |
| Température de fonctionnement | -40C to +125C (E = Extended) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de PIC16F1716-E/MV
| Broche 1 | RA0/AN0/C1IN+/DAC5OUT/OPA1IN0+/OPA1OUT — Bidirectional I/O with analog input, comparator input, DAC output, and op-amp pins |
| Broche 2 | RA1/AN1/C1IN-/OPA1IN0- — Bidirectional I/O with analog input, comparator input, and op-amp inverting input |
| Broche 3 | RA2/AN2/C2IN+/DAC6OUT/OPA1IN1+/OPA2IN0+ — Bidirectional I/O with analog input, comparator input, DAC output, and op-amp pins |
| Broche 4 | RA3/AN3/C1IN+/OPA2IN1- — Bidirectional I/O with analog input, comparator input, and op-amp input |
| Broche 5 | RA4/AN4/C2IN-/OPA2IN0-/OPA2OUT — Bidirectional I/O with analog input, comparator input, and op-amp output |
| Broche 6 | RA5/AN5/OPA2IN1+ — Bidirectional I/O with analog input and op-amp non-inverting input |
| Broche 7 | RA6 — Bidirectional I/O |
| Broche 8 | VSS — Ground reference |
| Broche 9 | RA7 — Bidirectional I/O |
| Broche 10 | RB0/AN12/C2IN+ — Bidirectional I/O with analog input and comparator input |
| Broche 11 | RB1/AN10/C1IN3+ — Bidirectional I/O with analog input and comparator input |
| Broche 12 | RB2/AN8/C2IN3+ — Bidirectional I/O with analog input and comparator input |
| Broche 13 | VDD — Positive supply voltage (3.0 V to 5.5 V) |
| Broche 14 | VSS — Ground reference |
| Broche 15 | RB3/AN9/C1IN2-/C2IN2- — Bidirectional I/O with analog input and comparator input |
| Broche 16 | RB4/AN11/C1IN1-/C2IN1- — Bidirectional I/O with analog input and comparator input |
| Broche 17 | RB5/AN13 — Bidirectional I/O with analog input |
| Broche 18 | RB6/ICSPCLK — Bidirectional I/O / In-Circuit Serial Programming clock |
| Broche 19 | RB7/ICSPDAT — Bidirectional I/O / In-Circuit Serial Programming data |
| Broche 20 | RC0/SOSCIN/SCL1 — Bidirectional I/O with secondary oscillator input and I2C clock |
| Broche 21 | RC1/SOSCO/SDA1 — Bidirectional I/O with secondary oscillator output and I2C data |
| Broche 22 | RC2/CCP1 — Bidirectional I/O with Capture/Compare/PWM 1 |
| Broche 23 | RC3/CCP2 — Bidirectional I/O with Capture/Compare/PWM 2 |
| Broche 24 | RC4 — Bidirectional I/O |
| Broche 25 | RC5 — Bidirectional I/O |
| Broche 26 | RC6 — Bidirectional I/O / EUSART TX |
| Broche 27 | RC7 — Bidirectional I/O / EUSART RX |
| Broche 28 | VDD — Positive supply voltage (3.0 V to 5.5 V) |
| Broche EP | EP (Exposed Pad) — Thermal pad; must be soldered to PCB ground plane |
Applications typiques
PIC16F1716-E/MV convient pour 7 applications: Sensor Signal Conditioning with On-Chip Op Amps, LED Lighting Control with COG Peripheral, Motor Control Loops with Comparator Feedback, Battery-Powered IoT Endpoints, Industrial Sensor Transmitters (4-20 mA), Smart Home and Building Automation, Automotive Sensor Modules.
Sensor Signal Conditioning with On-Chip Op Amps
The PIC16F1716-E/MV's integrated on-chip op amps and 10-bit ADC make it ideal for direct sensor signal conditioning without external amplifiers. The op amps can be configured for unity-gain buffering of high-impedance sensors or non-inverting amplification of low-level signals (e.g., thermocouple or strain-gauge outputs). According to the Microchip PIC16F171X datasheet, the on-chip op amps support rail-to-rail input and output operation, simplifying single-supply designs. Combined with the eXtreme Low Power (XLP) technology, the MCU can sample sensors periodically and sleep in nanoWatt modes between conversions, extending battery life. The ZCD peripheral enables AC zero-crossing detection for line-powered sensor systems. Compared to discrete op-amp + MCU solutions, this integrated approach reduces PCB area, BOM cost, and design complexity while maintaining 10-bit ADC accuracy for industrial measurement applications.
Recommandé
LED Lighting Control with COG Peripheral
The PIC16F1716-E/MV's Complementary Output Generator (COG) peripheral is specifically designed for driving LED lighting half-bridge and full-bridge topologies with precise dead-band control. The COG generates complementary PWM outputs with programmable dead time, eliminating firmware timing jitter and ensuring MOSFETs never cross-conduct. According to the PIC16F171X datasheet, the COG peripheral can operate in PWM-steering, push-pull, and half-bridge modes for various LED driver configurations. Combined with the on-chip 5/8-bit DAC, designers can implement smooth dimming curves via analog reference adjustment. The CLC peripheral enables custom logic for protection features like over-current detection and fault shutoff without CPU intervention. This architecture suits high-power LED drivers in commercial lighting and architectural installations where deterministic switching and high efficiency are required.
Recommandé
Motor Control Loops with Comparator Feedback
The PIC16F1716-E/MV integrates high-speed comparators and PWM/CCP peripherals that form a complete closed-loop motor control platform. The comparators can sense back-EMF from brushless DC motors or current shunt voltages for closed-loop current control, with response times below 100 ns. According to the Microchip datasheet, the 32 MHz core delivers 8 MIPS of processing throughput, sufficient for 8 kHz PID control loops with margin for sensor fusion. The NCO peripheral provides high-resolution frequency synthesis for stepper motor microstepping applications. On-chip op amps amplify current-sense signals without external components, reducing BOM cost. This combination makes the MCU well-suited for small BLDC, PMSM, and stepper motor control in fans, pumps, and consumer appliances where cost and integration outweigh the need for higher-bit DSP performance.
Recommandé
Battery-Powered IoT Endpoints
The PIC16F1716-E/MV's eXtreme Low Power (XLP) technology achieves nanoWatt sleep currents with full RAM retention, enabling multi-year battery life for IoT sensor nodes. The datasheet specifies typical sleep currents below 50 nA with Watchdog Timer active, allowing periodic wake-up via WDT or external interrupts. According to the PIC16F171X datasheet, the on-chip peripherals can operate in sleep modes, eliminating the need for CPU wake-up to handle ZCD or comparator events. The 32 MHz processing performance provides headroom for sensor data processing and AES-128 encryption before returning to sleep. Combined with EUSART and I2C/SPI interfaces, the MCU can interface with low-power radios (e.g., LoRa, BLE modules) for environmental monitoring, asset tracking, and smart agriculture applications where battery replacement cost dominates total cost of ownership.
Recommandé
Industrial Sensor Transmitters (4-20 mA)
The PIC16F1716-E/MV is well-suited for 4-20 mA industrial sensor transmitters where its integrated peripherals simplify loop-powered designs. The 10-bit ADC captures sensor signals while the on-chip op amps condition low-level outputs from RTDs, thermocouples, or bridge sensors. According to the PIC16F171X datasheet, the 5/8-bit DAC can drive the 4-20 mA current loop directly via an external transistor or current-loop controller, eliminating a separate DAC IC. The extended temperature range (-40C to +125C) ensures operation in harsh industrial environments. The ZCD peripheral enables AC line synchronization for loop-powered designs harvesting power from the 4-20 mA loop. This integration reduces the typical 4-20 mA transmitter bill of materials to MCU + output transistor + protection components, suiting process control and factory automation deployments.
Recommandé
Smart Home and Building Automation
The PIC16F1716-E/MV's combination of analog integration, Core Independent Peripherals, and low power consumption makes it suitable for smart home and building automation devices. The CLC peripheral can implement custom logic for capacitive touch sensing or rotary encoder decoding without CPU load, freeing the core for communication tasks via EUSART or I2C/SPI. According to the PIC16F171X datasheet, the PPS feature simplifies PCB layout by allowing peripheral pin reassignment after board design. The ZCD peripheral detects AC zero-crossing for triac-based dimmer control in lighting fixtures. Operating from 3.0-5.5 V, the MCU can be powered directly from USB or low-voltage DC rails in thermostats, occupancy sensors, and smart switches. Compared to discrete logic + MCU solutions, this integrated approach enables compact, cost-effective designs for high-volume consumer products.
Recommandé
Automotive Sensor Modules
The PIC16F1716-E/MV operates across -40C to +125C with integrated analog peripherals that suit automotive body and chassis sensor modules. While not AEC-Q100 qualified itself, the part supports the voltage and temperature conditions of under-hood and cabin-mounted sensors such as coolant temperature, oil pressure, and battery monitoring. According to the PIC16F171X datasheet, the on-chip op amps amplify sensor signals directly, the 10-bit ADC digitizes them, and the EUSART outputs CAN or LIN bus data via external transceivers. The PPS feature allows flexible pin mapping for board-constrained designs, and the CLC peripheral implements sensor diagnostics in hardware without CPU overhead. This combination targets body-electronics sensor modules where cost-effectiveness, integration, and extended temperature operation outweigh the need for full automotive qualification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F1716-E/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F1716-I/MV | PIC16F1716T-I/MV | PIC16F1713-I/MV | PIC16F1713T-I/MV | PIC16F1713-E/MV | PIC16F1516T-I/MV |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin UQFN (MV) 4x4 mm | 28-pin UQFN (MV) - same | 28-pin UQFN (MV) - same | 28-pin UQFN (MV) - same | 28-pin UQFN (MV) - same | 28-pin UQFN (MV) - same | 28-pin UQFN (MV) - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 7 KB (-50%) | 7 KB (-50%) | 14 KB |
| RAM | 1 KB | 1 KB | 1 KB | 512 B (-50%) | 512 B (-50%) | 512 B (-50%) | 512 B (-50%) |
| On-Chip Op Amps | Yes | Yes | Yes | Yes | Yes | Yes | No |
| CLC / COG / NCO Peripherals | Yes (all four) | Yes | Yes | Yes | Yes | Yes | No |
| Maximum Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 20 MHz |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Approx Unit Price (qty 1, USD) | $1.89 | $1.75 (est.) | $1.75 (est.) | $1.45 (est., lower memory) | $1.45 (est.) | $1.45 (est.) | $1.30 (est., older family) |
Principaux différenciateurs
- On-chip operational amplifiers eliminate external analog ICs (vs PIC16F1516T-I/MV)
- Four Core Independent Peripherals (CLC, COG, NCO, ZCD) (vs PIC16F1516T-I/MV)
- Highest memory configuration in PIC16F171X family (vs PIC16F1713-I/MV)
- Extended temperature grade for harsh environments (vs PIC16F1716-I/MV)
Notes de conception
Place 100 nF decoupling capacitors within 2 mm of each VDD pin (pins 13 and 28) to minimize supply noise during ADC conversions. Add a bulk 10 uF tantalum or ceramic capacitor at the board's power entry point. The exposed thermal pad must be soldered to a PCB ground plane using an array of thermal vias (typically 5-9 vias of 0.3 mm diameter) to achieve the datasheet-specified thermal resistance of 40 C/W. Per Microchip's UQFN layout guidelines, the via pattern must be filled or tented to prevent solder wicking during reflow. The ground plane connection improves electrical performance by reducing ground bounce and provides a low-impedance thermal path for power dissipation.
The PIC16F1716-E/MV operates from 3.0 V to 5.5 V on VDD pins. For battery-powered designs, leverage the XLP sleep modes with typical current consumption below 50 nA at 3 V with RAM retention and Watchdog Timer active. Use the on-chip op amps and ADC in sleep-triggered burst sampling to minimize average current. When switching between active and sleep modes, allow the 16 MHz internal oscillator 4 us settling time before ADC conversions. The PPS feature allows flexibility to map the EUSART or I2C peripherals to low-power-capable pins to simplify PCB routing in mixed-signal designs.
Do not exceed the absolute maximum VDD of 6.5 V or the ESD rating of 2000 V HBM on any pin. The on-chip op amps have limited output drive (approximately 5 mA) - external buffering is required for low-impedance loads. When using the Peripheral Pin Select (PPS) feature, verify that no two peripherals are assigned to the same physical pin to avoid contention. The COG peripheral's dead-band control requires careful configuration to prevent MOSFET cross-conduction in half-bridge drivers - always validate with an oscilloscope before production. Finally, the ICSP programming pins (RB6/ICSPCLK and RB7/ICSPDAT) must not be pulled low at reset or the device will enter programming mode inadvertently.
Estimated: At maximum operating conditions (VDD = 5.5 V, 32 MHz, all peripherals active), the PIC16F1716-E/MV consumes approximately 8 mA active current, dissipating 44 mW of power. With the UQFN-28 package's typical theta_JA of 40 C/W on a JEDEC EIA/JESD51 4-layer test board, the junction temperature rise is approximately 1.8 C above ambient at full active load. The UQFN-28 thermal performance is significantly worse than QFP packages, so designers should not rely on the exposed pad alone for high-current or elevated-temperature applications. The PIC16F1716-E/MV does not generate substantial heat under normal operating conditions - thermal concerns are typically only relevant in dense multi-chip modules.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; choose ATSAM3S8BA-MU or similar AEC-Q100 ARM Cortex-M3 MCU for automotive designs requiring formal qualification.
