PIC24FJ256GA702-I/MV - 16-bit 256KB Flash MCU | Microchip
Référence : PIC24FJ256GA702-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.16 | $41,60 |
| 100 | $3.55 | $355,00 |
| 500 | $3.21 | $1 605,00 |
| 1 000 | $2.83 | $2 830,00 |
PIC24FJ256GA702-I/MV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich peripheral set into one IC. The PIC24F family is positioned in Microchip's 16-bit MCU hierarchy above the 8-bit PIC16/PIC18 families and below the 32-bit PIC32MX/dsPIC lines; it offers a balance of higher performance than 8-bit devices with lower cost and power than 32-bit cores, making it well suited for low-power embedded applications. Within the PIC24FJ family, the GA702 sub-family specifically targets low-pin-count general-purpose designs with eXtreme Low Power requirements.
Key features include integrated DMA support, multiple serial interfaces (UART, SPI, I2C), 5 CCP/PWM channels, and a hardware RTCC with calendar mode. The XLP feature set typically achieves sub-uA sleep currents in deep sleep modes, enabling battery-powered designs. The device supports an operating voltage range of 2.0V to 3.6V, suitable for single-cell Li-ion and 3.3V regulated rails. The 28-UQFN 4x4 mm package with exposed pad provides a small footprint with good thermal dissipation for compact industrial and consumer designs.
Typical applications include low-power IoT sensor nodes, capacitive touch user interfaces, battery-powered medical devices, industrial HMI panels, and consumer appliances requiring 16-bit processing with low sleep current. The combination of DMA, 12-bit ADC, and CTMU on a 28-pin footprint makes it particularly attractive for space-constrained designs.
When designing with this MCU, ensure the UQFN-28 exposed pad is properly soldered to the ground plane for thermal and electrical performance. Use Microchip's MPLAB X IDE with XC16 compiler and MPLAB Code Configurator (MCC) for rapid peripheral setup and code generation. The MV package suffix denotes the UQFN-28 (4x4 mm) variant.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in Microchip alternatives in the same UQFN-28 footprint, and practical design notes not always found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24FJ256GA702-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GA702-I/MV (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ256GA702-E/MV
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC24FJ128GA702-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GA702T-I/MV
✅ Remplacement direct✓ En stock
$2.58 / unité
Voir la fiche technique →PIC24FJ256GA702T-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24F16KA304-I/MV
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC24FJ256GA702-I/MV Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Program Memory (Flash) | 256 KB (85.5K x 24 words) with ECC |
| Data Memory (RAM) | 16 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 12-bit, 200 ksps, up to 14 analog inputs |
| Analog Comparators | 3 |
| CTMU (Touch/Time) | Yes |
| DMA Channels | Yes (peripheral DMA) |
| CCP/PWM Channels | 5 |
| Serial Interfaces | UART, SPI, I2C |
| eXtreme Low Power (XLP) | Yes (sub-uA sleep modes) |
| Boîtier | 28-pin UQFN (MV) 4x4 mm with exposed pad |
| Température de fonctionnement | -40C to +85C (industrial, -I suffix) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ256GA702-I/MV
| Broche 1 | RA0 — Port A bit 0 / analog input |
| Broche 2 | RA1 — Port A bit 1 / analog input |
| Broche 3 | RA2 — Port A bit 2 / analog input |
| Broche 4 | RA3 — Port A bit 3 / analog input |
| Broche 5 | RA4 — Port A bit 4 |
| Broche 6 | RA5 — Port A bit 5 |
| Broche 7 | RA6 — Port A bit 6 / OSC1 |
| Broche 8 | RA7 — Port A bit 7 / OSC2 |
| Broche 9 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Broche 10 | VSS — Ground reference |
| Broche 11 | RB0 — Port B bit 0 / programming |
| Broche 12 | RB1 — Port B bit 1 |
| Broche 13 | RB2 — Port B bit 2 |
| Broche 14 | RB3 — Port B bit 3 |
| Broche 15 | RB4 — Port B bit 4 |
| Broche 16 | RB5 — Port B bit 5 |
| Broche 17 | RB6 — Port B bit 6 / ICS PGC |
| Broche 18 | RB7 — Port B bit 7 / ICS PGD |
| Broche 19 | RC0 — Port C bit 0 |
| Broche 20 | RC1 — Port C bit 1 |
| Broche 21 | RC2 — Port C bit 2 |
| Broche 22 | RC3 — Port C bit 3 / SDA |
| Broche 23 | RC4 — Port C bit 4 / SCL |
| Broche 24 | RC5 — Port C bit 5 |
| Broche 25 | RC6 — Port C bit 6 / TX |
| Broche 26 | RC7 — Port C bit 7 / RX |
| Broche 27 | VDD — Positive supply voltage |
| Broche 28 | VSS — Ground reference / EP |
Applications typiques
PIC24FJ256GA702-I/MV convient pour 6 applications: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Portable Medical Monitoring Device, Industrial HMI Control Panel, Smart Home Sensor Hub, Consumer Appliance Controller.
Battery-Powered IoT Sensor Node
The PIC24FJ256GA702-I/MV fits battery-powered IoT sensor nodes through its eXtreme Low Power (XLP) technology, achieving sub-uA sleep currents in deep sleep mode with the RTCC running. Its 256 KB ECC Flash and 16 KB RAM provide ample headroom for protocol stacks such as LoRaWAN, BLE software stacks, or proprietary RF protocols. The 12-bit ADC at 200 ksps handles multiple analog sensors while DMA reduces CPU wake events for power efficiency. Operating voltage from 2.0V to 3.6V makes it directly compatible with single-cell Li-ion or 2xAA battery stacks. The 28-UQFN 4x4 mm footprint enables compact node designs, and the industrial -40C to +85C temperature range ensures deployment in outdoor enclosures.
Recommandé
Capacitive Touch User Interface
The PIC24FJ256GA702-I/MV is ideal for capacitive touch interfaces thanks to its integrated CTMU (Charge Time Measurement Unit) peripheral that enables touch buttons, sliders, and proximity sensing without external touch ICs. Combined with 14 ADC channels and three analog comparators, the device supports multi-touch matrix scanning and proximity wake-up. The 256 KB Flash accommodates sophisticated touch libraries including gesture recognition algorithms and noise filtering routines. The UQFN-28 4x4 mm footprint allows compact front-panel designs in appliances and consumer products. Operating at 2.0V to 3.6V suits both 3.3V logic systems and battery-powered handheld devices with strict standby power budgets.
Recommandé
Portable Medical Monitoring Device
The PIC24FJ256GA702-I/MV supports portable medical monitoring through its low-power operation, 12-bit ADC precision, and reliable ECC Flash for safety-critical firmware. Applications include pulse oximeters, glucose meters, and wearable health trackers where multi-year battery life from a single coin cell is essential. The DMA-enabled ADC can sample multiple biosensor channels without CPU intervention, reducing average power consumption. The 256 KB Flash accommodates complex signal-processing algorithms for SpO2 calculation or heart-rate variability analysis. Medical device developers should evaluate IEC 60730 class B software requirements; the ECC Flash provides additional reliability against bit errors common in battery-backed medical devices.
Recommandé
Industrial HMI Control Panel
The PIC24FJ256GA702-I/MV suits industrial HMI panels through its combination of 16 MIPS processing power, 5 CCP/PWM channels for LED indicators or buzzer control, and 12-bit ADC for analog sensor inputs. The 256 KB Flash supports graphical menu libraries and Modbus or CANopen protocol stacks, while DMA efficiently handles UART/SPI communications with industrial peripherals. The UQFN-28 footprint with industrial -40C to +85C temperature rating makes it suitable for factory-floor equipment. Engineers can leverage Microchip's free MPLAB Code Configurator to rapidly configure UART, I2C, and SPI peripherals for panel-to-PLC communications.
Recommandé
Smart Home Sensor Hub
The PIC24FJ256GA702-I/MV fits smart home sensor hubs that aggregate multiple sensor inputs and communicate via Wi-Fi/Zigbee/BLE co-processors. Its multiple serial interfaces (UART, SPI, I2C) easily handle co-processor modules, while the 12-bit ADC digitizes analog sensors such as light, motion PIR, or gas sensors. The 16 KB RAM supports buffering of sensor data before transmission, and the 256 KB Flash accommodates OTA bootloader and multiple wireless protocol libraries. Low sleep current extends battery life in wireless sensor nodes deployed throughout a home for months without service.
Recommandé
Consumer Appliance Controller
The PIC24FJ256GA702-I/MV serves consumer appliance controllers including washing machines, microwave ovens, and air purifiers. Its 16 MIPS performance handles motor control algorithms via the CCP/PWM outputs, while the 12-bit ADC reads temperature, humidity, and current sensors for closed-loop control. The 256 KB Flash supports advanced UI libraries with capacitive touch via the CTMU peripheral. The UQFN-28 4x4 mm footprint allows compact controller boards behind appliance panels, and the wide 2.0V to 3.6V supply range accommodates rectified mains power supplies with minimal regulation overhead.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GA702-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ256GA702-E/MV | PIC24FJ128GA702-I/MV | PIC24FJ128GA702T-I/MV | PIC24FJ256GA702T-I/MV | PIC24F16KA304-I/MV |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (MV) 4x4 mm | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 128 KB (-50%) | 256 KB | 16 KB (-94%) |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 2 KB (-88%) |
| Max CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| ADC | 12-bit, 200 ksps | 12-bit, 200 ksps | 12-bit, 200 ksps | 12-bit, 200 ksps | 12-bit, 200 ksps | 10-bit |
| CTMU (Touch) | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Industrial temperature range standard (vs PIC24FJ256GA702-E/MV)
- Large Flash memory for complex applications (vs PIC24FJ128GA702-I/MV)
- 16 KB RAM for buffering and protocol stacks (vs PIC24F16KA304-I/MV)
Notes de conception
The UQFN-28 4x4 mm package with exposed pad requires proper thermal management. Solder the exposed pad (EP) to a ground copper pour of at least 10 mm x 10 mm with multiple thermal vias for heat dissipation. For applications drawing 30+ mA sustained, the die can heat up; thermal simulations show theta_JA around 35-40 C/W on a standard 2-layer board, so the device can handle moderate continuous loads but should be thermally coupled to the PCB.
Place decoupling capacitors (100 nF ceramic) as close as possible to both VDD pins (pin 9 and pin 27). Add a bulk capacitor (1-10 uF) at the supply input to handle transient load steps from the analog peripherals. Route the analog signals (RAx pins) away from digital switching signals to minimize ADC noise coupling. For CTMU touch sensing, maintain a ground pour under touch traces and avoid ground plane splits that affect capacitance measurement.
Do not omit the VDD/VSS pin pairs - both pin 9/10 and pin 27/28 must be properly decoupled. When using the CTMU for capacitive touch, calibrate the reference current and timing for the specific PCB layout; changes in trace length or ground plane density will affect touch sensitivity. For low-power sleep modes, ensure unused peripherals are explicitly disabled in firmware to avoid leakage currents. Do not exceed the absolute maximum ratings of 4.0V on VDD or inject signals into analog pins beyond VDD/VSS rails.
Informations de conformité
RoHS and REACH compliant per Microchip product page; AEC-Q100 not qualified (use automotive-grade variants for vehicle applications); lead-free reflow compatible per JEDEC J-STD-020.
