PIC16F18857-E/ML - 8-bit MCU, 56KB Flash, 28-pin QFN | PIC16
Référence : PIC16F18857-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.56 | $25,60 |
| 100 | $2.28 | $228,00 |
| 500 | $2.05 | $1 025,00 |
| 1 000 | $1.83 | $1 830,00 |
PIC16F18857-E/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. PIC microcontrollers use a RISC architecture optimized for deterministic interrupt response and ultra-low power operation, placing them in the broader category of embedded microcontrollers and, at the highest level, semiconductor ICs used in power-sensitive control applications.
Key features include a 10-bit Analog-to-Digital Converter with Computation (ADCC), Complementary Waveform Generator (CWG), up to four 10-bit Pulse-Width Modulation (PWM) outputs, Hardware Limit Timer (HLT), Windowed Watchdog Timer (WWDT), and SCAN/CRC hardware for functional safety. Communication peripherals comprise UART, SPI, and I2C with SMBus/PMBus support. The integrated Core Independent Peripherals (CIPs) offload timing-sensitive tasks from the CPU, enabling deterministic operation in closed-loop control.
The architecture combines a 16-bit wide instruction word with an 8-bit data path, deep hardware FIFO buffering on the ADC, and an instruction cache that improves throughput while keeping active current below 1 mA in many configurations. The nanoWatt XLP technology delivers sleep currents below 50 nA with real-time clock retention, making the part attractive for energy harvesting and remote sensor nodes.
Typical applications include IoT sensor nodes, low-power wireless sensor platforms, industrial process control, battery-powered instrumentation, smart home devices, and automotive body/sensor subsystems where compact QFN packaging and AEC-Q100-like operating ranges (-40C to +125C) help meet harsh-environment requirements.
When designing with this part, carefully follow the Microchip datasheet recommendations for power-supply decoupling, exposed-pad soldering, and configuration-bit settings to ensure reliable operation. Programming is supported through MPLAB X IDE with the XC8 compiler, and debug is performed via ICD 3 or PICkit 4 in-circuit tools.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet, delivering unique engineering value for BOM selection.
Alternatives de remplacement direct pour PIC16F18857-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F18857-E/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Core Architecture, Core Independent Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F18857-I/ML
✅ Remplacement direct✓ En stock
$1.39 / unité
Voir la fiche technique →PIC16F18857T-I/ML
✅ Remplacement direct✓ En stock
$1.88 / unité
Voir la fiche technique →PIC16F18856-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F18855-E/ML
✅ Remplacement direct✓ En stock
$0.71 / unité
Voir la fiche technique →PIC16F18855-I/ML
✅ Remplacement direct✓ En stock
$1.38 / unité
Voir la fiche technique →PIC16F18855T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.26 / unité
Voir la fiche technique →PIC16F18857-E/ML Valeurs maximales et caractéristiques électriques
| Device Family | PIC16F1885x/7x |
| Core Architecture | 8-bit PIC RISC (enhanced mid-range) |
| Program Memory (Flash) | 56 KB |
| Data RAM | 4 KB |
| EEPROM | 256 bytes |
| Operating Voltage | 1.8 V to 5.5 V |
| Maximum CPU Speed | 32 MHz |
| ADC | 10-bit ADCC (Analog-to-Digital Converter with Computation) |
| PWM Channels | Up to four 10-bit PWM outputs |
| Timers | HLT, WWDT, multiple 8/16-bit timers |
| Communication | UART, SPI, I2C with SMBus/PMBus |
| Boîtier | 28-pin QFN (HVQCCN) with EP, 6x6 mm |
| Température de fonctionnement | -40C to +125C (E grade, automotive) |
| Type de montage | Surface Mount |
| Low-Power Technology | eXtreme Low Power (XLP) - nanoWatt |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Programming/Debug | MPLAB X, XC8, ICD 3 / PICkit 4 |
Configuration des broches de PIC16F18857-E/ML
| Broche 1 | RA5 — Bidirectional I/O / ADC input / CWG output |
| Broche 2 | RA4 — Bidirectional I/O / ADC input |
| Broche 3 | RA3 — Bidirectional I/O / MCLR (configuration dependent) |
| Broche 4 | RC5 — Bidirectional I/O / PWM output |
| Broche 5 | RC4 — Bidirectional I/O / PWM output |
| Broche 6 | RC3 — Bidirectional I/O / SPI/I2C |
| Broche 7 | RC6 — Bidirectional I/O / UART TX |
| Broche 8 | RC7 — Bidirectional I/O / UART RX |
| Broche 9 | RB7 — Bidirectional I/O / I2C SCL / ICSP data |
| Broche 10 | RB6 — Bidirectional I/O / I2C SDA / ICSP clock |
| Broche 11 | RB5 — Bidirectional I/O / PWM output |
| Broche 12 | RB4 — Bidirectional I/O / PWM output |
| Broche 13 | RB3 — Bidirectional I/O |
| Broche 14 | RB2 — Bidirectional I/O |
| Broche 15 | RB1 — Bidirectional I/O |
| Broche 16 | RB0 — Bidirectional I/O / interrupt-on-change |
| Broche 17 | VDD — Positive supply voltage (1.8V to 5.5V) |
| Broche 18 | VSS — Ground reference |
| Broche 19 | RA2 — Bidirectional I/O / ADC input / DAC output |
| Broche 20 | RA1 — Bidirectional I/O / ADC input |
| Broche 21 | RA0 — Bidirectional I/O / ADC input |
| Broche 22 | RC2 — Bidirectional I/O / PWM output |
| Broche 23 | RC1 — Bidirectional I/O / PWM output |
| Broche 24 | RC0 — Bidirectional I/O |
| Broche 25 | RA7 — Bidirectional I/O / oscillator input |
| Broche 26 | RA6 — Bidirectional I/O / oscillator output |
| Broche 27 | VDDIO2 — Secondary I/O supply voltage |
| Broche 28 | VSS — Ground reference |
Applications typiques
PIC16F18857-E/ML convient pour 6 applications: IoT Sensor Nodes, Industrial Process Control, Battery-Powered Instrumentation, Smart Home Devices, Automotive Body/Sensor Subsystems, LED Lighting and Signage.
IoT Sensor Nodes
The PIC16F18857-E/ML is well suited for battery-powered IoT sensor nodes thanks to its eXtreme Low Power nanoWatt technology with sub-50 nA sleep current and 1.8-5.5V supply range. With 56 KB Flash, firmware images for BLE/Zigbee stacks, sensor-fusion routines, and over-the-air update bootloaders fit comfortably, while the 4 KB RAM supports buffers for protocol stacks. The 10-bit ADCC with computation offloads averaging and threshold detection from the CPU, enabling ultra-low duty-cycle operation. Use it paired with a sub-GHz or 2.4 GHz transceiver for wireless environmental, asset-tracking, or smart-agriculture nodes.
Recommandé
Industrial Process Control
In industrial process-control loops, the PIC16F18857-E/ML delivers deterministic PWM and timer behavior via Core Independent Peripherals (CIPs). The CWG and HLT modules handle dead-band, blanking, and fault response in hardware, freeing the CPU for supervisory control and communications over UART, SPI, or I2C with SMBus/PMBus. The -40C to +125C automotive temperature grade (E suffix) gives plenty of margin for cabinet installations near motors or heaters. The 28-pin QFN exposed pad provides good thermal dissipation for sustained ADC-sampling workloads.
Recommandé
Battery-Powered Instrumentation
For handheld meters, e-paper labels, and portable medical/wearable devices, the PIC16F18857-E/ML nanoWatt XLP modes deliver multi-year battery life. Sleep currents under 50 nA with RTC retention let the device wake only for periodic measurements, and the wide 1.8-5.5V range lets a single design accept primary LiSO2, alkaline, or Li-ion chemistries without level shifting. The 256-byte EEPROM stores calibration constants and user preferences without consuming Flash endurance. Pair it with an external low-noise ADC for precision sensing where 10 bits is insufficient.
Recommandé
Smart Home Devices
Smart-home hubs, occupancy sensors, and connected thermostats benefit from the PIC16F18857-E/ML's combination of generous Flash/RAM, low-power operation, and small 28-pin QFN footprint. Hardware PWM drives LED indicators and triac-compatible dimmers directly, while the CWG provides complementary switching for H-bridge motor drivers used in blinds or valves. I2C with SMBus lets the MCU act as a controller on residential sensor buses. Firmware fits comfortably with TLS stacks and OTA bootloaders in 56 KB Flash.
Recommandé
Automotive Body/Sensor Subsystems
With the -E grade rated to +125C, the PIC16F18857-E/ML fits under-hood or cabin body controllers, seat-control modules, and LIN-attached sensor clusters. The CWG and 10-bit PWM drive small BLDC or brushed motors for actuators, while the WWDT and SCAN/CRC hardware support ASIL-friendly diagnostics. CIPs allow deterministic response without CPU intervention, reducing software overhead. Use it as a slave to a higher-end MCU or as a stand-alone node communicating over UART/SPI to a CAN/LIN transceiver.
Recommandé
LED Lighting and Signage
LED drivers and dimmable lighting controllers use the PIC16F18857-E/ML's PWM, CWG, and ADCC to perform high-resolution dimming, color-mixing, and constant-current regulation in firmware-light hardware. The 32 MHz CPU and instruction cache deliver fast update rates for chasing/breathing effects, while nanoWatt XLP modes keep standby power negligible. The exposed-pad QFN package dissipates heat efficiently when the MCU sits close to LED driver FETs, and 1.8-5.5V operation supports both USB-powered and PoE-fed lighting designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F18857-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F18857-I/ML | PIC16F18857T-I/ML | PIC16F18856-E/ML | PIC16F18855-E/ML | PIC16F18855-I/ML |
|---|---|---|---|---|---|---|
| Package | QFN-28 (HVQCCN) 6x6mm | QFN-28 (HVQCCN) - same | QFN-28 (HVQCCN) - same | QFN-28 (HVQCCN) - same | QFN-28 (HVQCCN) - same | QFN-28 (HVQCCN) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 56 KB | 56 KB | 56 KB | 56 KB | 14 KB | 14 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 1 KB | 1 KB |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| ADC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC |
Principaux différenciateurs
- Largest memory in the PIC16F1885x/7x QFN-28 family (vs PIC16F18855-E/ML)
- Automotive-grade (-40C to +125C) operating range (vs PIC16F18857-I/ML)
- Hardware CIPs offload timing-critical tasks from CPU (vs PIC16F1825-I/ML)
Notes de conception
The 28-pin QFN package has an exposed thermal pad on the underside that MUST be soldered to the PCB ground pour for proper thermal and electrical performance. Microchip recommends a 0.5 mm clearance between the EP pad and other traces, with thermal vias (0.3 mm diameter, 1.2 mm pitch) stitched into the ground plane to reduce junction temperature. A non-soldered EP can cause thermal stress and erratic ADC readings due to missing ground reference.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin, with an additional 1 uF to 10 uF bulk capacitor on the main VDD rail. For designs that cycle frequently between active and nanoWatt XLP sleep, a small bulk capacitor (>=4.7 uF) helps supply instantaneous inrush when waking the ADC or PWM. Use star-ground routing so the AGND/AVSS return is not shared with high-current digital returns.
Configuration bits are non-volatile settings that lock the MCLR, oscillator mode, watchdog, and code-protect features. A wrong configuration bit can disable ICSP programming or freeze the device. Always set configuration bits explicitly in source code (e.g., #pragma config in XC8) and verify them against the datasheet's CONFIGURATION WORD section before programming production parts. Use MPLAB X's configuration-bit window for visual review.
When using the 10-bit ADCC, route analog traces away from PWM and switching signals to minimize coupled noise. The ADCC's hardware computation (averaging, oversampling) can effectively increase resolution, but only if the analog front-end is clean. Add an RC low-pass filter (1 kohm / 100 nF) on heavily loaded analog inputs, and consider using the dedicated DAC reference output as a known voltage for periodic self-calibration.
Informations de conformité
E temperature grade (-40C to +125C) is automotive-style but AEC-Q100 qualification status is not explicitly stated in the distributor snippet; check Microchip product page for AEC-Q100 documentation before automotive qualification.
