PIC16LF1507-E/GZ - 8-bit MCU 3.5KB Flash 128B RAM 20MHz | Microchip
Référence : PIC16LF1507-E/GZ ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.27 | $12,70 |
| 100 | $1.05 | $105,00 |
| 500 | $0.92 | $460,00 |
| 1 000 | $0.78 | $780,00 |
PIC16LF1507-E/GZ Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. Within the broader electronics taxonomy, the PIC16LF1507 belongs to the 8-bit microcontroller family, sitting under the 16-bit MCU and 32-bit MCU hierarchies. Its "LF" prefix denotes a low-voltage (F-range) variant of the PIC16F1507, designed for ultra-low-power battery applications. Compared with discrete logic plus ADC solutions, an integrated MCU reduces BOM count, PCB area, and firmware-driven flexibility.
Key features of the PIC16LF1507 include 17 digital I/O pins, two 8-bit timers plus one 16-bit timer, an enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART), and an MSSP module supporting SPI and I2C. The device also carries the Configurable Logic Cell (CLC), Numerically Controlled Oscillator (NCO), and Complementary Waveform Generator (CWG) peripherals found across the PIC16F150x family, enabling mixed-signal functions without external hardware.
The PIC16LF1507 uses Microchip's nanoWatt XLP technology to achieve very low sleep currents in the sub-microamp range. Combined with its 20 MHz internal oscillator accuracy and 4 hardware breakpoints, this makes the device suitable for cost-sensitive, low-power sensor and human-interface designs. The "E" suffix in the part number specifies the -40C to +125C automotive/extended temperature grade, while the "GZ" package code designates the 20-pin UQFN exposed-pad package.
Typical applications include consumer LED lighting, battery-powered IoT sensor nodes, low-cost remote controls, white goods and small appliance controls, and general-purpose digital logic replacement in space-constrained PCB layouts. The integrated ADC and CWG also allow direct driving of half-bridges for fans or piezo buzzers.
When designing with this MCU, allocate a 0.1 uF decoupling capacitor adjacent to VDD and a 10 uF bulk capacitor on the main supply rail, and tie the exposed pad (EP) to ground for thermal dissipation and noise immunity. For production programming, use Microchip's MPLAB X IDE with the PICkit 4 or MPLAB ICD 4 in-circuit debugger; both are supported by the free XC8 compiler.
Alternatives de remplacement direct pour PIC16LF1507-E/GZ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF1507-E/GZ (même facteur de forme et même empreinte) — différant par Number of I/O Pins, Package, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF1507-I/GZ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF1507T-E/GZ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F1507-E/GZ
✅ Remplacement direct✓ En stock
$0.58 / unité
Voir la fiche technique →PIC16F1507-I/GZ
✅ Remplacement direct✓ En stock
$0.61 / unité
Voir la fiche technique →PIC16LF1507-E/GZ Valeurs maximales et caractéristiques électriques
| Core | PIC 8-bit enhanced mid-range |
| Core Size | 8-bit |
| Maximum CPU Speed | 20 MHz |
| Program Memory (Flash) | 3.5 KB |
| RAM | 128 B |
| EEPROM | 0 B (none) |
| Number of I/O Pins | 17 |
| ADC | 10-bit, up to 12 channels |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (Extended) |
| Boîtier | 20-UQFN (4x4) with exposed pad |
| Package Code | GZ (HVQCCN) |
| Type de montage | Surface Mount |
| Oscillator Type | Internal (factory calibrated) |
| Connectivity | EUSART, MSSP (SPI/I2C) |
| Timers | 2x 8-bit, 1x 16-bit |
| Special Peripherals | CLC, NCO, CWG, Temp Indicator |
| Low-Power Technology | nanoWatt XLP |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF1507-E/GZ
| Broche 1 | RA5 — Bidirectional I/O / ADC channel |
| Broche 2 | RA4 — Bidirectional I/O / ADC channel |
| Broche 3 | RA3/MCLR — Input / Master Clear (reset) |
| Broche 4 | RA2 — Bidirectional I/O / ADC channel |
| Broche 5 | RA1 — Bidirectional I/O / ADC channel |
| Broche 6 | RA0 — Bidirectional I/O / ADC channel |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RB7 — Bidirectional I/O / ICSP programming |
| Broche 9 | RB6 — Bidirectional I/O / ICSP clock |
| Broche 10 | RB5 — Bidirectional I/O / ADC channel |
| Broche 11 | RB4 — Bidirectional I/O / ADC channel |
| Broche 12 | RB3 — Bidirectional I/O / ADC channel |
| Broche 13 | RB2 — Bidirectional I/O / ADC channel |
| Broche 14 | RB1 — Bidirectional I/O / ADC channel |
| Broche 15 | RB0 — Bidirectional I/O / ADC channel |
| Broche 16 | VDD — Positive supply 1.8V to 3.6V |
| Broche 17 | RA7 — Bidirectional I/O / ADC channel |
| Broche 18 | RA6 — Bidirectional I/O / ADC channel |
| Broche 19 | RC0 — Bidirectional I/O / ADC channel |
| Broche 20 | RC1 — Bidirectional I/O / ADC channel |
Applications typiques
PIC16LF1507-E/GZ convient pour 6 applications: Low-Power IoT Sensor Node, Consumer LED Lighting Controller, Battery-Powered Remote Control, White Goods and Fan Control, Automotive Interior Sensor Module, Industrial Process Sensor.
Low-Power IoT Sensor Node
The PIC16LF1507-E/GZ is well suited for battery-powered wireless sensor nodes thanks to its 1.8V to 3.6V supply range and nanoWatt XLP technology, which keeps sleep current in the sub-microamp region. Its 12-channel 10-bit ADC handles multiple analog sensors (temperature, light, battery voltage) on a single die, while the CLC and NCO peripherals can synthesize precision timing without waking the CPU. The 20-UQFN 4x4 mm package fits beneath a CR2032 footprint coin-cell holder. Use it as the housekeeping MCU alongside a sub-GHz radio such as the Microchip MRF89XA.
Recommandé
Consumer LED Lighting Controller
For LED bulbs and strip drivers, the PIC16LF1507-E/GZ combines the Complementary Waveform Generator (CWG) for hardware PWM dimming, the Configurable Logic Cell for fault handling, and 17 GPIO for key and indicator matrix. The CWG can drive a half-bridge directly, eliminating an external gate driver in cost-sensitive retrofit lamps. ADC channels sense LED current via a shunt, enabling closed-loop constant-current control. The 4x4 mm UQFN footprint fits inside E12 LED bulb form factors.
Recommandé
Battery-Powered Remote Control
Infrared or BLE remote controls benefit from the PIC16LF1507-E/GZ ultra-low sleep current and 1.8V minimum supply, extending coin-cell life past five years. The EUSART handles RC5/SIRC IR protocols, while the CLC can debounce the key matrix in hardware, reducing firmware wake-ups. The MSSP peripheral drives SPI OLED displays or external EEPROM. Its 125 C extended temperature grade is valuable for kitchen and outdoor remotes.
Recommandé
White Goods and Fan Control
The PIC16LF1507-E/GZ handles brushless DC and AC induction fan control through its CWG and NCO peripherals. Up to 12 ADC channels read temperature, humidity, and motor current for closed-loop RPM regulation. Its extended temperature grade suits refrigerator and oven environments. The 20-UQFN exposed pad ensures reliable thermal dissipation for sustained MCU activity near heating elements.
Recommandé
Automotive Interior Sensor Module
In cabin-monitoring and seat-occupancy modules, the PIC16LF1507-E/GZ automotive -40 C to +125 C grade is required. The 10-bit ADC reads weight-sensing strain gauges and ambient-light sensors, while the MSSP drives an LIN slave transceiver. The CLC implements a state machine for child-presence detection, freeing the CPU from polling. The UQFN 4x4 mm footprint mounts on flex PCBs inside seat frames.
Recommandé
Industrial Process Sensor
For 4-20 mA loop-powered industrial sensors, the PIC16LF1507-E/GZ ADC reads bridge pressure or flow sensors with 10-bit resolution, while the EUSART produces a UART output for diagnostic boards. The MSSP configures as SPI master to read a calibration EEPROM. Its wide supply range and low Iq allow direct operation from a 24V loop with a low-dropout regulator such as the MCP1700.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF1507-E/GZ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF1507-I/GZ | PIC16LF1507T-E/GZ | PIC16F1507-E/GZ | PIC16F1507-I/GZ |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-UQFN (4x4) GZ | 20-UQFN (4x4) GZ | 20-UQFN (4x4) GZ | 20-UQFN (4x4) GZ | 20-UQFN (4x4) GZ |
| Program Memory | 3.5 KB Flash | 3.5 KB Flash | 3.5 KB Flash | 3.5 KB Flash | 3.5 KB Flash |
| RAM | 128 B | 128 B | 128 B | 128 B | 128 B |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Max CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +85 C (I) |
| Number of I/O | 17 | 17 | 17 | 17 | 17 |
| Packaging Format | Tube | Tube | Tape & Reel | Tube | Tube |
Principaux différenciateurs
- Lowest supply voltage in the PIC16F1507 family (vs PIC16F1507-E/GZ)
- Extended -40C to +125C automotive temperature grade (vs PIC16LF1507-I/GZ)
- On-chip CLC, NCO, and CWG peripherals (vs PIC16LF1503-I/SL)
Notes de conception
Place a 0.1 uF X7R decoupling capacitor within 2 mm of the VDD pin (pin 16) and a 10 uF bulk capacitor on the same supply net. For coin-cell designs, connect VDD through a 100 ohm ferrite bead to suppress battery inrush transients. The MCU draws under 1 uA in sleep with peripherals disabled, but bursts to ~3 mA during ADC conversion and Flash write - the bulk cap prevents VDD droop during these events.
Solder the UQFN exposed pad (EP) directly to a continuous ground plane using at least eight thermal vias to the inner ground layer. EP connectivity is critical for both thermal dissipation and electrical reference; a floating EP increases junction temperature and may cause ADC offset errors. Avoid routing signal traces beneath the EP pad, and keep the EP copper area at least 80 percent of the package footprint.
Route the ICSP signals PGD (RB7) and PGC (RB6) with no series resistors unless your programmer explicitly requires them; keep trace lengths under 50 mm and add a 4.7 kohm pull-up on MCLR to VDD. For ADC accuracy, isolate analog traces (RA0-RA5, RB0-RB5, RC0-RC1) from switching signals and add a ground guard ring around the analog section of the chip.
Do not assume 5V tolerant I/O: the PIC16LF1507-E/GZ absolute maximum on any I/O pin is VDD + 0.3 V, so interfacing to 5V peripherals requires a level translator such as the LTC4317. Also note that RA3 doubles as MCLR; configuring RA3 as a digital output requires MCLRE configuration bit = 0 and removes the external reset function.
Informations de conformité
Microchip publishes extended temperature grades as -40C to +125C automotive grade but does not claim formal AEC-Q100 qualification for the PIC16LF1507 family. For formal automotive certification, request PPAP documentation from Microchip sales.
