PIC16LF1527-E/MR - 8-Bit 20MHz 28KB Flash MCU | Microchip
Référence : PIC16LF1527-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $2.95 | $29,50 |
| 100 | $2.51 | $251,00 |
| 500 | $2.18 | $1 090,00 |
| 1 000 | $1.92 | $1 920,00 |
PIC16LF1527-E/MR Présentation
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, integrating a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of peripherals such as timers, communication interfaces, and analog-to-digital converters. Within the embedded hierarchy, the PIC16LF1527 belongs to the PIC16 mid-range family, which sits above baseline 8-bit PIC10/PIC12 devices but below the PIC18 and dsPIC33 product lines in both compute performance and addressable memory. The "LF" prefix denotes the low-voltage / low-power variant, optimized for battery-operated and energy-harvesting designs.
Key features of the PIC16LF1527-E/MR include the XLP™ (eXtreme Low Power) technology for sub-µA sleep currents, an operating voltage range of 2.5 V to 3.6 V suitable for 3.3 V systems, 18 I/O ports, integrated communication peripherals such as I2C, SPI, and EUSART, plus multiple timers and ADC channels. The 28 KB Flash and roughly 1.5 KB RAM provide ample headroom for state-machine-driven firmware and small RTOS kernels. The 64-VQFN package offers a compact 9 mm × 9 mm footprint with a thermal pad that improves heat dissipation in continuous-active applications.
Architecturally, the PIC16LF1527 uses Microchip's enhanced mid-range core with a 14-bit instruction word and a hardware multiplier for faster arithmetic. The XLP™ design integrates nanoWatt XLP sleep modes, peripheral module disable, and ultra-low-power wake-on-change logic, enabling multi-year battery life in applications such as wireless sensor nodes and remote controls.
Typical applications include consumer electronics, industrial sensor nodes, home appliances, LED lighting controllers, low-power wireless HMI, and small-footprint IoT end nodes. The combination of 28 KB Flash, 18 I/O, and 64-pin VQFN makes it a strong fit for designs that need more memory and pins than smaller PIC16 packages offer.
When designing with this MCU, ensure the 64-VQFN exposed pad is soldered to a sufficient copper pour to meet thermal and electrical ground requirements. Decoupling capacitors should be placed close to VDD/VSS pairs and the XLP sleep mode sequencing should be validated against the application's wake-up latency budget.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate, source, and integrate the PIC16LF1527-E/MR with confidence.
Alternatives de remplacement direct pour PIC16LF1527-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF1527-E/MR (même facteur de forme et même empreinte) — différant par Package, I/O Pins, CPU Speed, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F1527-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC16LF1526-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.06 / unité
Voir la fiche technique →PIC16F1526-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.55 / unité
Voir la fiche technique →PIC16LF1527-E/MR Valeurs maximales et caractéristiques électriques
| Product Family | PIC® XLP™ 16F |
| Core Architecture | 8-bit PIC mid-range enhanced core |
| CPU Speed | 20 MHz |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| I/O Pins | 18 |
| Boîtier | 64-VQFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Program Memory Type | Flash |
| Low-Power Technology | XLP™ (nanoWatt XLP) |
| Plage de température de fonctionnement | -40 °C to +125 °C (E suffix) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Package Code (JEDEC) | HVQCCN, 4 x 4 mm base, 0.90 mm height |
| Temperature Grade | Automotive |
| Peripherals | I2C, SPI, EUSART, Timers, ADC, PWM |
Configuration des broches de PIC16LF1527-E/MR
| Broche 1 | RA0 — Port A bit 0 / analog input |
| Broche 2 | RA1 — Port A bit 1 / analog input |
| Broche 3 | RA2 — Port A bit 2 / analog input |
| Broche 4 | RA3 — Port A bit 3 / analog input |
| Broche 5 | RA4 — Port A bit 4 |
| Broche 6 | RA5 — Port A bit 5 |
| Broche 7 | RA6 — Port A bit 6 / oscillator |
| Broche 8 | RA7 — Port A bit 7 / oscillator |
| Broche 9 | VDD — Positive supply |
| Broche 10 | VSS — Ground |
| Broche 11 | RB0 — Port B bit 0 / interrupt-on-change |
| Broche 12 | RB1 — Port B bit 1 / interrupt-on-change |
| Broche 13 | RB2 — Port B bit 2 / interrupt-on-change |
| Broche 14 | RB3 — Port B bit 3 / interrupt-on-change |
| Broche 15 | RB4 — Port B bit 4 / interrupt-on-change |
| Broche 16 | RB5 — Port B bit 5 / interrupt-on-change |
| Broche 17 | RB6 — Port B bit 6 / interrupt-on-change / ICSP clock |
| Broche 18 | RB7 — Port B bit 7 / interrupt-on-change / ICSP data |
| Broche 19 | VDD — Positive supply |
| Broche 20 | VSS — Ground |
| Broche 21 | RC0 — Port C bit 0 |
| Broche 22 | RC1 — Port C bit 1 |
| Broche 23 | RC2 — Port C bit 2 |
| Broche 24 | RC3 — Port C bit 3 |
| Broche 25 | RC4 — Port C bit 4 |
| Broche 26 | RC5 — Port C bit 5 |
| Broche 27 | RC6 — Port C bit 6 |
| Broche 28 | RC7 — Port C bit 7 |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Positive supply |
| Broche 31 | RD0 — Port D bit 0 |
| Broche 32 | RD1 — Port D bit 1 |
| Broche 33 | RD2 — Port D bit 2 |
| Broche 34 | RD3 — Port D bit 3 |
| Broche 35 | RD4 — Port D bit 4 |
| Broche 36 | RD5 — Port D bit 5 |
| Broche 37 | RD6 — Port D bit 6 |
| Broche 38 | RD7 — Port D bit 7 |
| Broche 39 | VSS — Ground |
| Broche 40 | VDD — Positive supply |
| Broche 41 | RE0 — Port E bit 0 |
| Broche 42 | RE1 — Port E bit 1 |
| Broche 43 | RE2 — Port E bit 2 |
| Broche 44 | RE3 — Port E bit 3 |
| Broche 45 | RE4 — Port E bit 4 |
| Broche 46 | RE5 — Port E bit 5 |
| Broche 47 | RE6 — Port E bit 6 |
| Broche 48 | RE7 — Port E bit 7 |
| Broche 49 | VSS — Ground |
| Broche 50 | VDD — Positive supply |
| Broche 51 | RF0 — Port F bit 0 |
| Broche 52 | RF1 — Port F bit 1 |
| Broche 53 | RF2 — Port F bit 2 |
| Broche 54 | RF3 — Port F bit 3 |
| Broche 55 | RF4 — Port F bit 4 |
| Broche 56 | RF5 — Port F bit 5 |
| Broche 57 | RF6 — Port F bit 6 |
| Broche 58 | RF7 — Port F bit 7 |
| Broche 59 | RG0 — Port G bit 0 |
| Broche 60 | RG1 — Port G bit 1 |
| Broche 61 | RG2 — Port G bit 2 |
| Broche 62 | RG3 — Port G bit 3 |
| Broche 63 | RG4 — Port G bit 4 |
| Broche 64 | RG5 — Port G bit 5 |
Applications typiques
PIC16LF1527-E/MR convient pour 7 applications: Battery-Powered Sensor Nodes, Consumer Remote Controls, Home Appliance Control Boards, LED Lighting Controllers, Industrial Sensor Transmitters, IoT Edge Nodes, Automotive Body Electronics.
Battery-Powered Sensor Nodes
The PIC16LF1527-E/MR is well suited for battery-powered wireless sensor nodes thanks to its XLP™ nanoWatt technology with sub-µA sleep currents and 2.5–3.6 V VDD range compatible with lithium coin cells. With 28 KB Flash and 18 I/O, it can host a small protocol stack (e.g., Modbus, BLE HCI passthrough) plus sensor drivers. The 64-VQFN exposed pad provides thermal relief for always-on applications such as HVAC transmitters or environmental monitors where multi-year battery life is critical.
Recommandé
Consumer Remote Controls
In IR/RF remote control designs, the PIC16LF1527-E/MR's XLP™ sleep modes extend battery life beyond one year on a pair of AA cells. The 20 MHz CPU decodes button matrices quickly enough for sub-50 ms response, while 28 KB Flash fits complex keymaps and learning-mode firmware. Its 18 I/Os easily drive a 6×4 key scan plus an LED indicator, and the 64-VQFN keeps the PCB compact for handheld enclosures.
Recommandé
Home Appliance Control Boards
The PIC16LF1527-E/MR drives mixed-signal control in washing machines, microwave ovens, and dishwashers, where 18 I/O ports manage relay drivers, triac interfaces, and user display segments. Its 20 MHz core handles user-interface state machines and sensor acquisition in real time, while 28 KB Flash supports multiple firmware variants for product SKUs. The -40 °C to +125 °C operating range and automotive temperature grade suit harsh kitchen and laundry environments.
Recommandé
LED Lighting Controllers
For commercial and architectural LED drivers, the PIC16LF1527-E/MR's PWM modules and 20 MHz CPU enable smooth dimming curves and DMX-512 address parsing. The 2.5–3.6 V VDD range is ideal for 3.3 V regulator outputs inside constant-current LED drivers. 28 KB Flash supports lighting effects libraries, while the 64-VQFN package's exposed pad simplifies thermal coupling to the driver heatsink. XLP™ sleep reduces standby power when fixtures are off.
Recommandé
Industrial Sensor Transmitters
The PIC16LF1527-E/MR serves as the MCU core in 4–20 mA loop-powered or wirelessHART sensor transmitters, where its 10-bit ADC and 18 I/Os connect to multiple sensor bridges and HART modems. XLP™ sleep current below 1 µA preserves loop compliance, while 28 KB Flash hosts HART command libraries and calibration tables. The 64-VQFN industrial temperature rating ensures operation in field-mounted enclosures with extended thermal stress.
Recommandé
IoT Edge Nodes
For IoT edge devices such as smart thermostats and occupancy sensors, the PIC16LF1527-E/MR provides enough Flash (28 KB) for TLS-like handshake stubs, sensor fusion code, and OTA bootloaders. The PIC16 XLP™ core wakes from sleep in microseconds, supporting event-driven edge processing. Its 64-VQFN footprint and exposed pad integrate cleanly with multi-layer IoT PCBs that combine Wi-Fi/BLE modules and sensors on a single board.
Recommandé
Automotive Body Electronics
The PIC16LF1527-E/MR's automotive temperature grade and 64-VQFN package suit body-control modules such as seat controllers, mirror adjusters, and accessory multiplexers. LIN slave communication via the EUSART plus 18 I/Os handle switch inputs and small motor drivers. 28 KB Flash supports AUTOSAR-style configuration and diagnostic routines, while XLP™ sleep limits quiescent draw to comply with parasitic-key-off budgets under 100 µA.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF1527-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F1527-I/MR | PIC16LF1526-E/MR | PIC16F1526-E/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Core | 8-bit PIC16 XLP | 8-bit PIC16 XLP | 8-bit PIC16 XLP | 8-bit PIC16 XLP |
| CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Flash Memory | 28 KB (16K x 14) | 28 KB | 14 KB (-50%) | 14 KB (-50%) |
| Operating Voltage (VDD) | 2.5 V to 3.6 V | 1.8 V to 5.5 V (wider) | 2.5 V to 3.6 V | 1.8 V to 5.5 V (wider) |
| I/O Pins | 18 | 18 | 18 | 18 |
| Low-Power Technology | XLP™ nanoWatt | XLP™ nanoWatt | XLP™ nanoWatt | XLP™ nanoWatt |
| Operating Temperature | -40 °C to +125 °C (E suffix) | -40 °C to +85 °C (I suffix) | -40 °C to +125 °C | -40 °C to +125 °C |
Principaux différenciateurs
- Larger Flash density in the same 64-VQFN footprint (vs PIC16LF1526-E/MR)
- Extended automotive temperature grade option in same package (vs PIC16F1527-I/MR)
- Low-voltage 2.5–3.6 V VDD optimized for battery-direct designs (vs PIC16F1527-I/MR)
Notes de conception
Solder the 64-VQFN exposed thermal pad to a continuous ground copper pour that is at least 1 square inch (645 mm²) to keep junction temperature within safe limits. While the PIC16LF1527 typically dissipates less than 100 mW, the exposed pad also serves as the primary low-impedance ground return for high-speed I/O switching. Thermal vias in 0.3 mm pitch rows beneath the pad improve heat transfer to internal ground planes.
Place a 100 nF decoupling capacitor within 2 mm of each VDD pin and a single 10 µF bulk capacitor near the package. For battery-powered designs, add a 100 kΩ pull-up on MCLR to avoid unwanted resets, and configure the BOR (Brown-Out Reset) voltage threshold to match the minimum operating VDD (2.5 V) to ensure predictable cold-start behavior.
Route the 20 MHz system clock traces on an internal layer with a continuous ground reference to minimize radiated EMI. Keep ICSP pins RB6/ICCK and RB7/ICDAT isolated from high-current switching nodes to avoid programming interference. Use guard rings around analog inputs (RA0–RA5) and route the analog AVdd/AVss pair separately from digital VDD/VSS for best ADC accuracy.
Do not assume all PIC16LF1527 variants share the same memory map; verify the device ID and configuration words at startup. Watch for register naming differences between PIC16F1527 and PIC16LF1527 when porting firmware. Avoid enabling peripherals before configuring their PPS mapping, as some I/O defaults may not match the datasheet pinout table if remapping is used.
Informations de conformité
RoHS compliant and lead-free per Microchip product page. AEC-Q100 qualification is not listed; the 'E' temperature suffix denotes -40 °C to +125 °C operating range but is not equivalent to full automotive certification. Refer to Microchip's automotive-grade PIC16F1527 variants for AEC-Q100 needs.
