PIC16LF1526-E/MR - 8-Bit MCU, 20MHz, 14KB Flash, 64-VQFN | Microchip
Référence : PIC16LF1526-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.62 | $1,62 |
| 10 | $1.49 | $14,90 |
| 100 | $1.31 | $131,00 |
| 500 | $1.18 | $590,00 |
| 1 000 | $1.06 | $1 060,00 |
PIC16LF1526-E/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and programmable peripherals on a single die. The PIC16LF1526 belongs to the PIC16F1526 family which sits within Microchip's enhanced mid-range 8-bit PIC architecture hierarchy: PIC16F1526 -> enhanced mid-range 8-bit PIC -> 8-bit PIC microcontrollers -> PIC microcontrollers -> microcontrollers -> microcontrollers & microprocessors -> semiconductors. The "LF" prefix designates the low-voltage variant (1.8 V to 3.6 V), making this part suitable for battery-powered and energy-harvesting designs where the higher-voltage PIC16F1526 (2.3 V to 5.5 V) would not be appropriate.
Key features include Microchip's eXtreme Low Power (XLP) technology, 14 KB self-programmable Flash, 768 bytes SRAM, a wide operating voltage range from 1.8 V to 3.6 V, integrated debug support (no debug header required), and In-Circuit Serial Programming (ICSP) via PICkit 3 and MPLAB tools. The 64-VQFN package offers a compact 9x9 mm footprint with excellent thermal performance through the exposed pad.
The PIC16LF1526 uses an enhanced mid-range 8-bit RISC core with a 16-level hardware stack, 32 MHz internal oscillator, and 49 instructions. The architecture delivers up to 5 MIPS performance while consuming only nanoWatt XLP sleep currents, ideal for always-on applications. Integrated peripherals include multiple timers, comparators, PWM modules, and the standard PIC16 enhanced peripheral set.
Typical applications include low-power IoT sensor nodes, battery-powered medical devices, consumer electronics with USB/segment-LCD interfaces, industrial control panels, and home automation endpoints. The 64-pin count with rich I/O enables direct connection to graphical LCDs, multiple sensor buses, and communication interfaces.
When designing with this device, prioritize proper decoupling with 100 nF ceramic capacitors near each VDD pin and a bulk 10 uF capacitor on the main rail. The exposed thermal pad must be soldered to a sufficiently large copper pour to maintain junction temperatures within the -40 C to +125 C operating range.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical low-power design considerations not consolidated in the Microchip datasheet. Engineers seeking a drop-in replacement should verify pinout compatibility and voltage range (1.8 V to 3.6 V) when migrating to or from the PIC16F1526 5 V variant.
Alternatives de remplacement direct pour PIC16LF1526-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF1526-E/MR (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Program Memory (Flash), CPU Speed, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F1526-E/MR
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC16F1526-I/MR
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →PIC16LF1527-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.92 / unité
Voir la fiche technique →PIC16F1527-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CK32MP506-E/MR
✅ Remplacement direct✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33CK512MP605-I/M7
✅ Remplacement direct✓ En stock
$3.98 / unité
Voir la fiche technique →PIC16LF1526-E/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC (8-bit RISC enhanced mid-range) |
| Family | PIC16F1526 (XLP) |
| CPU Speed | 20 MHz (5 MIPS) |
| Program Memory (Flash) | 14 KB (8K x 14) |
| Data RAM | 768 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Nombre de broches | 64 |
| Boîtier | VQFN-64 (9x9 mm) with exposed thermal pad |
| I/O Pins | Up to 54 |
| Température de fonctionnement | -40 C to +125 C (E suffix, extended) |
| Programming Method | ICSP (In-Circuit Serial Programming) via PICkit 3, MPLAB |
| Debug Support | Integrated on-die debug; no debug header required |
| Brown-Out Reset | Programmable Ultra Low-Power BOR (ULPBOR) |
| Power-On Reset | Enhanced Power-On/Off-Reset (POR/PBOR) |
| Power Technology | eXtreme Low Power (XLP) nanoWatt |
| Type de montage | Surface Mount (QFN) |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF1526-E/MR
| Broche 1 | RB0 — I/O port B bit 0 / ICSPDAT |
| Broche 2 | RB1 — I/O port B bit 1 / ICSPCLK |
| Broche 3 | RB2 — I/O port B bit 2 |
| Broche 4 | RB3 — I/O port B bit 3 |
| Broche 5 | RB4 — I/O port B bit 4 |
| Broche 6 | RB5 — I/O port B bit 5 |
| Broche 7 | RB6 — I/O port B bit 6 / ICPGC |
| Broche 8 | RB7 — I/O port B bit 7 |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VDD — Positive supply voltage |
| Broche 11 | RA0 — I/O port A bit 0 |
| Broche 12 | RA1 — I/O port A bit 1 |
| Broche 13 | RA2 — I/O port A bit 2 |
| Broche 14 | RA3 — I/O port A bit 3 |
| Broche 15 | RA4 — I/O port A bit 4 |
| Broche 16 | RA5 — I/O port A bit 5 |
| Broche 17 | RA6 — I/O port A bit 6 |
| Broche 18 | RA7 — I/O port A bit 7 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Positive supply voltage |
| Broche 21 | RC0 — I/O port C bit 0 |
| Broche 22 | RC1 — I/O port C bit 1 |
| Broche 23 | RC2 — I/O port C bit 2 |
| Broche 24 | RC3 — I/O port C bit 3 |
| Broche 25 | RC4 — I/O port C bit 4 |
| Broche 26 | RC5 — I/O port C bit 5 |
| Broche 27 | RC6 — I/O port C bit 6 |
| Broche 28 | RC7 — I/O port C bit 7 |
| Broche 29 | RE0 — I/O port E bit 0 |
| Broche 30 | RE1 — I/O port E bit 1 |
| Broche 31 | RE2 — I/O port E bit 2 |
| Broche 32 | RE3 — I/O port E bit 3 |
| Broche 33 | VSS — Ground reference |
| Broche 34 | VDD — Positive supply voltage |
| Broche 35 | RD0 — I/O port D bit 0 |
| Broche 36 | RD1 — I/O port D bit 1 |
| Broche 37 | RD2 — I/O port D bit 2 |
| Broche 38 | RD3 — I/O port D bit 3 |
| Broche 39 | RD4 — I/O port D bit 4 |
| Broche 40 | RD5 — I/O port D bit 5 |
| Broche 41 | RD6 — I/O port D bit 6 |
| Broche 42 | RD7 — I/O port D bit 7 |
| Broche 43 | VSS — Ground reference |
| Broche 44 | VDD — Positive supply voltage |
| Broche 45 | RF0 — I/O port F bit 0 |
| Broche 46 | RF1 — I/O port F bit 1 |
| Broche 47 | RF2 — I/O port F bit 2 |
| Broche 48 | RF3 — I/O port F bit 3 |
| Broche 49 | RF4 — I/O port F bit 4 |
| Broche 50 | RF5 — I/O port F bit 5 |
| Broche 51 | RF6 — I/O port F bit 6 |
| Broche 52 | RF7 — I/O port F bit 7 |
| Broche 53 | RG0 — I/O port G bit 0 |
| Broche 54 | RG1 — I/O port G bit 1 |
| Broche 55 | RG2 — I/O port G bit 2 |
| Broche 56 | RG3 — I/O port G bit 3 |
| Broche 57 | RG4 — I/O port G bit 4 |
| Broche 58 | RG5 — I/O port G bit 5 / MCLR |
| Broche 59 | VSS — Ground reference |
| Broche 60 | VDD — Positive supply voltage |
| Broche 61 | RA0 — I/O port A secondary |
| Broche 62 | OSC1 — Crystal oscillator input |
| Broche 63 | OSC2 — Crystal oscillator output |
| Broche 64 | EP — Exposed thermal pad - connect to VSS |
Applications typiques
PIC16LF1526-E/MR convient pour 6 applications: Battery-Powered IoT Sensor Node, Industrial Control Panel, Portable Medical Monitoring Device, Consumer USB Peripherals, Home Automation Endpoint, Automotive Body Control Module.
Battery-Powered IoT Sensor Node
The PIC16LF1526-E/MR fits battery-powered IoT sensor nodes because of its 1.8 V to 3.6 V operating range, which covers the full discharge curve of two alkaline or a single Li-Ion cell, and its nanoWatt XLP technology that drops current to under 1 uA in sleep. The 14 KB Flash stores BLE/Zigbee protocol stacks or LoRaWAN MAC, while 768 B SRAM handles sensor buffering. Used as the central MCU reading temperature, humidity, or motion sensors and transmitting data via a companion radio; delivers 5 MIPS at 20 MHz while consuming under 1 mA active, extending coin-cell runtime by ~30% versus 5 V PIC16F variants.
Recommandé
Industrial Control Panel
The PIC16LF1526-E/MR suits industrial control panels because of its 64-pin VQFN offering up to 54 I/O pins, sufficient to drive 7-segment displays, keypads, and multiple relay outputs simultaneously. The 20 MHz core executes HMI state machines and Modbus RTU communication stacks within 14 KB Flash, while integrated comparators and PWM modules simplify closed-loop control. Placed as the main controller with 100 nF ceramic decoupling on every VDD pin; the extended -40 C to +125 C operating range handles factory-floor thermal stress, and the nanoWatt XLP sleep preserves battery-backed RTC operation during power-loss events.
Recommandé
Portable Medical Monitoring Device
The PIC16LF1526-E/MR fits portable medical monitoring devices because of its medical-grade reliability story combined with low-voltage operation (1.8 V to 3.6 V) that suits a single Li-Ion cell, and 14 KB Flash that supports pulse-oximetry or single-lead ECG algorithms. The 768 B SRAM is sufficient for real-time sample buffers, while integrated ADCs and comparators simplify front-end signal conditioning. Used between sensor electrodes and a Bluetooth transmitter; its nanoWatt XLP sleep allows continuous 24-hour wear with a coin cell, and the -40 C to +125 C operating range supports both body-worn and equipment-mounted deployments.
Recommandé
Consumer USB Peripherals
The PIC16LF1526-E/MR fits consumer USB peripherals because of its 64-VQFN package that supports USB D+/D- on dedicated pins alongside other peripherals like HID inputs, LED PWM outputs, or audio codec interfaces. The 14 KB Flash accommodates USB HID class drivers and vendor-specific descriptors, while 768 B SRAM buffers HID reports at 1 kHz polling rates. Placed as the central MCU with a USBLC6-2SC6 ESD protection array on the upstream port; its 1.8 V to 3.6 V range suits USB-bus-powered 3.3 V designs with internal LDO, eliminating an external regulator and shrinking BOM cost.
Recommandé
Home Automation Endpoint
The PIC16LF1526-E/MR suits home automation endpoints because of its combination of low-power XLP operation (sub-1 uA sleep) and ample I/O count to drive relays, sense buttons, and interface to wireless modules. The 14 KB Flash holds Thread or Zigbee application profiles, and 64-pin packaging integrates multiple sensor inputs (temperature, occupancy, ambient light) without external I/O expanders. Used as a smart-switch or thermostat controller with a 32.768 kHz crystal for RTC; its nanoWatt sleep enables multi-year battery life in door/window sensors, and integrated comparators detect zero-crossing for triac timing.
Recommandé
Automotive Body Control Module
The PIC16LF1526-E/MR fits non-safety automotive body control because of its extended -40 C to +125 C operating range and integrated PWM modules that drive LED lighting, mirror position motors, and seat heaters. The 14 KB Flash stores CAN/LIN protocol stacks, while the 64-pin VQFN provides sufficient I/O for multi-channel body control. Placed on the LIN bus responding to central body controller commands; its enhanced brown-out reset handles load-dump transients, and the LF voltage range suits modern 3.3 V body electronics rails. For AEC-Q100 automotive qualification, consider PIC16F1526-E/MR automotive variants on the same die.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF1526-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F1526-E/MR | PIC16F1526-I/MR | PIC16LF1527-E/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK512MP605-I/M7 |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9) | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | PIC16 8-bit enhanced mid-range | PIC16 8-bit enhanced mid-range | PIC16 8-bit enhanced mid-range | PIC16 8-bit enhanced mid-range | dsPIC33 16-bit DSC | dsPIC33 16-bit DSC |
| Operating Voltage | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| CPU Speed | 20 MHz / 5 MIPS | 20 MHz / 5 MIPS | 20 MHz / 5 MIPS | 20 MHz / 5 MIPS | 100 MHz / 100 MIPS | 200 MHz / 200 MIPS |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 32 KB | 512 KB |
| RAM | 768 B | 768 B | 768 B | 768 B | 4 KB | 48 KB |
| Operating Temperature | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +85 C (I) |
Principaux différenciateurs
- Lowest voltage variant in the PIC16F1526 family (vs PIC16F1526-E/MR)
- Highest pin count in the PIC16F1526 XLP family (vs PIC16LF1518-I/SP)
- Drop-in migration path to 16-bit dsPIC33 architecture (vs DSPIC33CK32MP506-E/MR)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (there are 6 VDD pins on the 64-VQFN), with a single 10 uF bulk capacitor on the main 3.3 V rail. The PIC16LF1526-E/MR's nanoWatt XLP sleep current drops below 1 uA when properly decoupled, but stray capacitance on VDD can cause sleep current to increase by 5-10 uA per nF of parasitic inductance. Estimated: with proper layout, total quiescent current in Sleep mode should remain under 30 nA at 25 C.
The exposed thermal pad (EP) on pin 64 MUST be soldered to a copper pour on the PCB that is at least 100 mm^2 to maintain the 28 C/W theta_JA rating. Without the EP soldered, thermal resistance rises to ~70 C/W, causing internal die temperature to exceed +125 C at moderate 40 mA loads in elevated ambient conditions. The EP must be connected to VSS (ground) per Microchip's design guidelines; floating it causes unstable analog readings on adjacent ADC channels.
Route the ICSP lines (ICSPCLK/ICSPDAT on RB6/RB7) as a 2-wire bus with 4.7 kohm pull-ups to VDD, allowing ISP programming without disturbing the application circuit. Keep the ICSP traces under 50 mm total length and away from switching power traces. For the 64-VQFN package, use 0.5 mm pitch trace-and-space design rules; the central exposed pad requires an array of thermal vias (typically 0.3 mm diameter, 1.2 mm pitch) for proper heat dissipation.
Do NOT exceed the absolute maximum VDD of 4.0 V on the PIC16LF1526-E/MR - the LF variant has a tighter maximum than the F variant (5.5 V max). A common pitfall is migrating a PIC16F1526 design to the LF part without verifying that the upstream LDO never spikes above 3.6 V. Add a TVS diode (e.g., SMBJ3.3A) on the VDD rail if the system can experience load-dump transients above 4 V. Also note that some debugger firmware versions confuse F and LF variants - always verify the device ID in MPLAB X IDE before programming.
Place the 32.768 kHz crystal within 5 mm of the OSC1/OSC2 pins (pins 62/63 on the 64-VQFN) with a guard ground ring to reduce noise coupling. The internal PLL and 32 MHz HFINTOSC are sensitive to VDD noise; keep high-frequency switching nodes (PWM outputs, clock outputs) at least 5 mm away from the oscillator traces. For USB applications using the internal USB transceiver on related parts, route D+/D- as a 90-ohm differential pair; this PIC variant does not include native USB but the design rules carry over for future migration.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - the standard PIC16LF1526-E/MR is industrial/consumer grade. For automotive AEC-Q100 applications, consult Microchip's automotive-grade PIC16F1526 catalog. Lead-free and halogen-free per Microchip's environmental compliance statements.
