PIC16LF18456-I/STX - 8-Bit XLP MCU, 28KB Flash, 32MHz | Microchip
Référence : PIC16LF18456-I/STX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.05 | $2,05 |
| 10 | $1.85 | $18,50 |
| 100 | $1.65 | $165,00 |
| 500 | $1.5 | $750,00 |
| 1 000 | $1.38 | $1 380,00 |
PIC16LF18456-I/STX Présentation
A PIC microcontroller is a Harvard-architecture, RISC-based 8-bit MCU family from Microchip Technology, widely used in embedded systems for sensing, control, and communication. Within the broader semiconductor taxonomy, it sits as: PIC16 -> PIC microcontroller -> 8-bit microcontroller -> microcontroller -> embedded processor -> semiconductor. PIC MCUs are distinguished from ARM Cortex-M competitors by their deterministic instruction set, integrated Core Independent Peripherals (CIPs), and a vast ecosystem of MPLAB X IDE, MCC code generators, and application notes. The PIC16LF18456 specifically targets low-power sensor nodes, IoT end-points, and human-interface applications.
Key features include 28KB (16K x 14 words) of self-programmable Flash, 2KB SRAM, 256 bytes of EEPROM, an integrated 12-bit ADC with Computation (ADC2), multiple Core Independent Peripherals such as Complementary Waveform Generator (CWG), configurable logic cells, and a 5-bit DAC. The device offers two SPI/I2C, one EUSART, two PWMs, and a comparator. The 28-VQFN (4x4 mm) exposed-pad package delivers a compact footprint with low thermal resistance for SMD mass-production designs.
Technically, the PIC16LF18456 leverages a modified Harvard architecture with a 14-bit instruction word, allowing single-cycle execution on most instructions at 32MHz (8MHz instruction cycle). The XLP technology includes nanoWatt XLP sleep modes, typically drawing under 50 nA in deep sleep with RAM retention, and active current in the microamp range. Core Independent Peripherals (CIPs) handle tasks without CPU intervention, enabling the CPU to remain in sleep while the peripherals execute communications, waveform generation, or analog conversions.
Typical applications include IoT sensor nodes, battery-powered remote controls, low-power wireless sensor hubs (paired with Sub-GHz or BLE modules), wearable health monitors, smart-home edge devices, and industrial sensor interfaces. Designers choose this MCU when ultra-low power consumption, integrated analog (ADC2/DAC), and a small footprint are required simultaneously.
Designers should plan decoupling carefully: place a 0.1 uF ceramic bypass capacitor on each VDD pin within 3 mm, and use the exposed pad as a thermal and ground path with at least 4 thermal vias. Configuring the device for low-power operation requires disabling unused peripherals via the PMD registers, then placing the CPU in sleep with wake-up via interrupt on change or peripheral event.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical XLP design notes that go beyond the manufacturer datasheet summary.
Alternatives de remplacement direct pour PIC16LF18456-I/STX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF18456-I/STX (même facteur de forme et même empreinte) — différant par Package, Comparators, ADC, Core Architecture, Operating Voltage Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF18456-E/STX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F18456-I/STX
✅ Remplacement direct✓ En stock
$1.08 / unité
Voir la fiche technique →PIC16LF18446-I/STX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF18455-I/STX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF18456-E/SO
✅ Remplacement direct✓ En stock
$1.82 / unité
Voir la fiche technique →PIC16LF18456-I/STX Valeurs maximales et caractéristiques électriques
| Product Family | PIC16 (8-bit) |
| Core | PIC RISC, 14-bit instruction word |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 28 KB (16K x 14) |
| Data SRAM | 2 KB |
| EEPROM | 256 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial) |
| ADC | 12-bit ADC with Computation (ADC2) |
| DAC | 5-bit DAC |
| Comparators | Yes |
| PWM Channels | 2 |
| EUSART | 1 |
| SPI / I2C | 2 |
| Complementary Waveform Generator (CWG) | Yes |
| Configurable Logic Cells (CLC) | Yes |
| Boîtier | 28-VQFN (4x4 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF18456-I/STX
| Broche 1 | RA5 — Digital I/O / analog input |
| Broche 2 | RA4 — Digital I/O / analog input |
| Broche 3 | RA3 — Digital I/O / analog input / MCLR (alternate) |
| Broche 4 | RC5 — Digital I/O |
| Broche 5 | RC4 — Digital I/O |
| Broche 6 | RC3 — Digital I/O |
| Broche 7 | RC2 — Digital I/O |
| Broche 8 | RC1 — Digital I/O |
| Broche 9 | RC0 — Digital I/O |
| Broche 10 | RA2 — Digital I/O / analog input |
| Broche 11 | RA1 — Digital I/O / analog input |
| Broche 12 | RA0 — Digital I/O / analog input |
| Broche 13 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Broche 14 | VSS — Ground reference |
| Broche 15 | RA7 — Digital I/O / oscillator pin |
| Broche 16 | RA6 — Digital I/O / oscillator pin |
| Broche 17 | RC7 — Digital I/O |
| Broche 18 | RC6 — Digital I/O |
| Broche 19 | RB7 — Digital I/O |
| Broche 20 | RB6 — Digital I/O |
| Broche 21 | RB5 — Digital I/O |
| Broche 22 | RB4 — Digital I/O |
| Broche 23 | RC6 — Digital I/O (secondary) |
| Broche 24 | RC7 — Digital I/O (secondary) |
| Broche 25 | RB4 — Digital I/O (secondary) |
| Broche 26 | RB5 — Digital I/O (secondary) |
| Broche 27 | VSS — Ground (secondary bond) |
| Broche 28 | EP — Exposed thermal pad - must be soldered to PCB ground |
Applications typiques
PIC16LF18456-I/STX convient pour 6 applications: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Smart-Home Edge Device, Industrial Sensor Interface, Low-Power Remote Control, Motor Control / PWM Driver.
Battery-Powered IoT Sensor Node
The PIC16LF18456-I/STX is well suited for battery-powered IoT sensor nodes because its eXtreme Low-Power (XLP) technology drops to under 50 nA in deep sleep while retaining 2 KB SRAM, allowing years of operation from a single coin cell. Its 32 MHz core handles protocol stacks such as LoRaWAN, BLE beaconing, or Sub-GHz proprietary RF via SPI-connected modules. The 28-VQFN (4x4 mm) footprint fits even sub-1 square-inch sensor PCBs, and the exposed thermal pad simplifies thermal design in sealed enclosures. Designers pair this MCU with a sub-GHz transceiver and a 12-bit ADC2 readout of a temperature/humidity sensor, waking the CPU only for periodic transmissions.
Recommandé
Wearable Health Monitor
In wearable health monitors such as heart-rate straps, pulse oximeters, and continuous glucose monitors, the PIC16LF18456-I/STX offers the right blend of 12-bit ADC2 accuracy, 2 KB SRAM for ring-buffering sensor data, and nanoWatt XLP sleep that preserves multi-month wear time. The 5-bit DAC supports sensor bias generation, while the CWG can drive an LED PPG or SpO2 pulse without CPU intervention, leaving the CPU in sleep until a meaningful physiological event is detected. The 28-VQFN 4x4 mm package enables the slim form factors wearables demand. A typical design powers the MCU from a 3.0V CR2032 cell regulated to 1.8V for ultra-low sleep current.
Recommandé
Smart-Home Edge Device
Smart-home edge devices - door/window sensors, occupancy detectors, smart thermostats - benefit from the PIC16LF18456-I/STX's combination of 28 KB Flash (room for Zigbee or Matter application code), 1.8V-3.6V operation (compatible with battery packs or USB-5V-after-LDO), and Core Independent Peripherals. The CWG and CLC blocks execute LED dimming, motor-control, and quadrature-decoding without CPU wake-up, while the 12-bit ADC2 reads thermistors or LDRs for ambient-light response. The 28-VQFN exposed pad simplifies ground-plane design for the noisy RF environment typical of 2.4 GHz coexistent designs.
Recommandé
Industrial Sensor Interface
For industrial 4-20 mA loop sensors, RTD conditioners, and digital sensor hubs, the PIC16LF18456-I/STX provides a robust industrial temperature grade, a 12-bit ADC2 with hardware computation (oversampling, averaging, threshold detection) and 2 KB SRAM for protocol conversion. Designers run Modbus RTU over the EUSART or IO-Link over SPI/I2C without burdening the 32 MHz core. The wide 1.8V-3.6V supply lets the device sit on a regulated 3.3V rail downstream of a 24V-to-3.3V buck converter. The 28-VQFN (4x4 mm) package supports densely-populated sensor-interface PCBs.
Recommandé
Low-Power Remote Control
Battery-powered remote controls for TVs, AV systems, and toys benefit from the PIC16LF18456-I/STX's nanoWatt XLP sleep that lets a coin-cell-powered IR/BLE remote survive for years. The EUSART implements IR carrier generation while CWG handles PWM-based LED indicators without CPU wake. The 28 KB Flash accommodates protocol libraries for RC5, NEC, SIRC, and BLE HID stacks; 2 KB SRAM is more than enough for command buffering. Designers appreciate the 28-VQFN (4x4 mm) package for miniaturized key fob designs.
Recommandé
Motor Control / PWM Driver
The PIC16LF18456-I/STX is a fit for small brushed-DC and stepper motor controllers thanks to its Complementary Waveform Generator (CWG), 2 PWM channels, and configurable logic cells that implement dead-band and fault handling in hardware. The 32 MHz core executes FOC or trapezoidal commutation algorithms, while the 5-bit DAC sets analog reference points. The 12-bit ADC2 reads back-current shunts for closed-loop torque control. The 28-VQFN exposed pad helps dissipate the small amount of heat generated by the MCU in compact motor-driver boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF18456-I/STX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF18456-E/STX | PIC16F18456-I/STX | PIC16LF18446-I/STX | PIC16LF18455-I/STX |
|---|---|---|---|---|---|
| Package | 28-VQFN (4x4 mm) | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Flash Memory | 28 KB | 28 KB | 28 KB | 16 KB | 14 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
Principaux différenciateurs
- Highest Flash density in 28-VQFN PIC16 family (vs PIC16LF18446-I/STX)
- Wide 1.8V-3.6V operation vs 2.3V-5.5V (vs PIC16F18456-I/STX)
- Industrial temperature range -40C to +85C (vs PIC16LF18456-E/STX)
Notes de conception
Estimated: To achieve nanoWatt XLP sleep currents (<50 nA typical) on PIC16LF18456-I/STX, disable all unused peripherals via PMD registers, switch to the LFINTOSC low-power oscillator, and configure IOC wake-up only on essential pins. According to Microchip's TB3065 application note, retaining 2 KB SRAM in sleep draws approximately 200 nA; full-memory retention adds 50-100 nA. For coin-cell designs, switch the ADC2 and comparator OFF before sleep and avoid BOR enabled at all times.
The 28-VQFN (4x4 mm) exposed thermal pad MUST be soldered to a PCB ground plane with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) per Microchip's package guidelines. A single 0.1 uF ceramic decoupling capacitor must be placed within 3 mm of the VDD pin, and a 10 uF tantalum or ceramic bulk capacitor within 10 mm. For 32 MHz operation, keep VDD traces short and surround the exposed pad with a continuous ground pour to reduce EMI from the internal oscillator.
Common pitfalls with PIC16LF18456-I/STX include: (1) failing to configure the PPS (Peripheral Pin Select) registers when remapping UART or SPI to alternate pins - the device ships with all peripherals disabled; (2) leaving the ADC2 enabled in sleep, which draws milliamps; (3) using the wrong configuration bits - the LVP bit must be disabled for high-voltage programming to avoid contention with RB5; (4) applying voltage above 3.6V to VDD for the LF variant destroys the part - use the F variant for 5V rails.
Per Microchip's TB3070 hardware design checklist, route the HF crystal traces (if used) within 5 mm of the OSC1/OSC2 pins with a continuous ground guard ring. Place the ICSPDAT/ICSPCLK traces away from switching power or RF traces to avoid programming-time noise. For ADC2 accuracy, dedicate a ground island around AVSS/AVDD and connect it back to the main ground via a single point to avoid digital-return currents corrupting analog readings.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - select PIC16F18456-E/STX automotive variants for AEC-Q100 needs. Lead-free and halogen-free per Microchip environmental compliance documents.
