PIC16LF18456-I/STX - 8-Bit XLP MCU, 28KB Flash, 32MHz | Microchip
MPN: PIC16LF18456-I/STX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.05 | $2.05 |
| 10 | $1.85 | $18.50 |
| 100 | $1.65 | $165.00 |
| 500 | $1.5 | $750.00 |
| 1,000 | $1.38 | $1,380.00 |
PIC16LF18456-I/STX Overview
A PIC microcontroller is a Harvard-architecture, RISC-based 8-bit MCU family from Microchip Technology, widely used in embedded systems for sensing, control, and communication. Within the broader semiconductor taxonomy, it sits as: PIC16 -> PIC microcontroller -> 8-bit microcontroller -> microcontroller -> embedded processor -> semiconductor. PIC MCUs are distinguished from ARM Cortex-M competitors by their deterministic instruction set, integrated Core Independent Peripherals (CIPs), and a vast ecosystem of MPLAB X IDE, MCC code generators, and application notes. The PIC16LF18456 specifically targets low-power sensor nodes, IoT end-points, and human-interface applications.
Key features include 28KB (16K x 14 words) of self-programmable Flash, 2KB SRAM, 256 bytes of EEPROM, an integrated 12-bit ADC with Computation (ADC2), multiple Core Independent Peripherals such as Complementary Waveform Generator (CWG), configurable logic cells, and a 5-bit DAC. The device offers two SPI/I2C, one EUSART, two PWMs, and a comparator. The 28-VQFN (4x4 mm) exposed-pad package delivers a compact footprint with low thermal resistance for SMD mass-production designs.
Technically, the PIC16LF18456 leverages a modified Harvard architecture with a 14-bit instruction word, allowing single-cycle execution on most instructions at 32MHz (8MHz instruction cycle). The XLP technology includes nanoWatt XLP sleep modes, typically drawing under 50 nA in deep sleep with RAM retention, and active current in the microamp range. Core Independent Peripherals (CIPs) handle tasks without CPU intervention, enabling the CPU to remain in sleep while the peripherals execute communications, waveform generation, or analog conversions.
Typical applications include IoT sensor nodes, battery-powered remote controls, low-power wireless sensor hubs (paired with Sub-GHz or BLE modules), wearable health monitors, smart-home edge devices, and industrial sensor interfaces. Designers choose this MCU when ultra-low power consumption, integrated analog (ADC2/DAC), and a small footprint are required simultaneously.
Designers should plan decoupling carefully: place a 0.1 uF ceramic bypass capacitor on each VDD pin within 3 mm, and use the exposed pad as a thermal and ground path with at least 4 thermal vias. Configuring the device for low-power operation requires disabling unused peripherals via the PMD registers, then placing the CPU in sleep with wake-up via interrupt on change or peripheral event.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical XLP design notes that go beyond the manufacturer datasheet summary.
Drop-in alternatives for PIC16LF18456-I/STX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18456-I/STX (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), SPI / I2C.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF18456-E/STX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18456-I/STX
✅ Drop-In✓ In Stock
$1.08 / Unit
View Datasheet →PIC16LF18446-I/STX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18455-I/STX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18456-E/SO
✅ Drop-In✓ In Stock
$1.82 / Unit
View Datasheet →PIC16LF18456-I/STX Maximum Ratings & Electrical Characteristics
| Product Family | PIC16 (8-bit) |
| Core | PIC RISC, 14-bit instruction word |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 28 KB (16K x 14) |
| Data SRAM | 2 KB |
| EEPROM | 256 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| ADC | 12-bit ADC with Computation (ADC2) |
| DAC | 5-bit DAC |
| Comparators | Yes |
| PWM Channels | 2 |
| EUSART | 1 |
| SPI / I2C | 2 |
| Complementary Waveform Generator (CWG) | Yes |
| Configurable Logic Cells (CLC) | Yes |
| Package | 28-VQFN (4x4 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC16LF18456-I/STX Pin Configuration
| Pin 1 | RA5 — Digital I/O / analog input |
| Pin 2 | RA4 — Digital I/O / analog input |
| Pin 3 | RA3 — Digital I/O / analog input / MCLR (alternate) |
| Pin 4 | RC5 — Digital I/O |
| Pin 5 | RC4 — Digital I/O |
| Pin 6 | RC3 — Digital I/O |
| Pin 7 | RC2 — Digital I/O |
| Pin 8 | RC1 — Digital I/O |
| Pin 9 | RC0 — Digital I/O |
| Pin 10 | RA2 — Digital I/O / analog input |
| Pin 11 | RA1 — Digital I/O / analog input |
| Pin 12 | RA0 — Digital I/O / analog input |
| Pin 13 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RA7 — Digital I/O / oscillator pin |
| Pin 16 | RA6 — Digital I/O / oscillator pin |
| Pin 17 | RC7 — Digital I/O |
| Pin 18 | RC6 — Digital I/O |
| Pin 19 | RB7 — Digital I/O |
| Pin 20 | RB6 — Digital I/O |
| Pin 21 | RB5 — Digital I/O |
| Pin 22 | RB4 — Digital I/O |
| Pin 23 | RC6 — Digital I/O (secondary) |
| Pin 24 | RC7 — Digital I/O (secondary) |
| Pin 25 | RB4 — Digital I/O (secondary) |
| Pin 26 | RB5 — Digital I/O (secondary) |
| Pin 27 | VSS — Ground (secondary bond) |
| Pin 28 | EP — Exposed thermal pad - must be soldered to PCB ground |
Typical Applications
PIC16LF18456-I/STX is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Smart-Home Edge Device, Industrial Sensor Interface, Low-Power Remote Control, Motor Control / PWM Driver.
Battery-Powered IoT Sensor Node
The PIC16LF18456-I/STX is well suited for battery-powered IoT sensor nodes because its eXtreme Low-Power (XLP) technology drops to under 50 nA in deep sleep while retaining 2 KB SRAM, allowing years of operation from a single coin cell. Its 32 MHz core handles protocol stacks such as LoRaWAN, BLE beaconing, or Sub-GHz proprietary RF via SPI-connected modules. The 28-VQFN (4x4 mm) footprint fits even sub-1 square-inch sensor PCBs, and the exposed thermal pad simplifies thermal design in sealed enclosures. Designers pair this MCU with a sub-GHz transceiver and a 12-bit ADC2 readout of a temperature/humidity sensor, waking the CPU only for periodic transmissions.
Recommended
Wearable Health Monitor
In wearable health monitors such as heart-rate straps, pulse oximeters, and continuous glucose monitors, the PIC16LF18456-I/STX offers the right blend of 12-bit ADC2 accuracy, 2 KB SRAM for ring-buffering sensor data, and nanoWatt XLP sleep that preserves multi-month wear time. The 5-bit DAC supports sensor bias generation, while the CWG can drive an LED PPG or SpO2 pulse without CPU intervention, leaving the CPU in sleep until a meaningful physiological event is detected. The 28-VQFN 4x4 mm package enables the slim form factors wearables demand. A typical design powers the MCU from a 3.0V CR2032 cell regulated to 1.8V for ultra-low sleep current.
Recommended
Smart-Home Edge Device
Smart-home edge devices - door/window sensors, occupancy detectors, smart thermostats - benefit from the PIC16LF18456-I/STX's combination of 28 KB Flash (room for Zigbee or Matter application code), 1.8V-3.6V operation (compatible with battery packs or USB-5V-after-LDO), and Core Independent Peripherals. The CWG and CLC blocks execute LED dimming, motor-control, and quadrature-decoding without CPU wake-up, while the 12-bit ADC2 reads thermistors or LDRs for ambient-light response. The 28-VQFN exposed pad simplifies ground-plane design for the noisy RF environment typical of 2.4 GHz coexistent designs.
Recommended
Industrial Sensor Interface
For industrial 4-20 mA loop sensors, RTD conditioners, and digital sensor hubs, the PIC16LF18456-I/STX provides a robust industrial temperature grade, a 12-bit ADC2 with hardware computation (oversampling, averaging, threshold detection) and 2 KB SRAM for protocol conversion. Designers run Modbus RTU over the EUSART or IO-Link over SPI/I2C without burdening the 32 MHz core. The wide 1.8V-3.6V supply lets the device sit on a regulated 3.3V rail downstream of a 24V-to-3.3V buck converter. The 28-VQFN (4x4 mm) package supports densely-populated sensor-interface PCBs.
Recommended
Low-Power Remote Control
Battery-powered remote controls for TVs, AV systems, and toys benefit from the PIC16LF18456-I/STX's nanoWatt XLP sleep that lets a coin-cell-powered IR/BLE remote survive for years. The EUSART implements IR carrier generation while CWG handles PWM-based LED indicators without CPU wake. The 28 KB Flash accommodates protocol libraries for RC5, NEC, SIRC, and BLE HID stacks; 2 KB SRAM is more than enough for command buffering. Designers appreciate the 28-VQFN (4x4 mm) package for miniaturized key fob designs.
Recommended
Motor Control / PWM Driver
The PIC16LF18456-I/STX is a fit for small brushed-DC and stepper motor controllers thanks to its Complementary Waveform Generator (CWG), 2 PWM channels, and configurable logic cells that implement dead-band and fault handling in hardware. The 32 MHz core executes FOC or trapezoidal commutation algorithms, while the 5-bit DAC sets analog reference points. The 12-bit ADC2 reads back-current shunts for closed-loop torque control. The 28-VQFN exposed pad helps dissipate the small amount of heat generated by the MCU in compact motor-driver boards.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18456-I/STX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF18456-E/STX | PIC16F18456-I/STX | PIC16LF18446-I/STX | PIC16LF18455-I/STX |
|---|---|---|---|---|---|
| Package | 28-VQFN (4x4 mm) | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same | 28-VQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Flash Memory | 28 KB | 28 KB | 28 KB | 16 KB | 14 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
Key Differentiators
- Highest Flash density in 28-VQFN PIC16 family (vs PIC16LF18446-I/STX)
- Wide 1.8V-3.6V operation vs 2.3V-5.5V (vs PIC16F18456-I/STX)
- Industrial temperature range -40C to +85C (vs PIC16LF18456-E/STX)
Design Notes
Estimated: To achieve nanoWatt XLP sleep currents (<50 nA typical) on PIC16LF18456-I/STX, disable all unused peripherals via PMD registers, switch to the LFINTOSC low-power oscillator, and configure IOC wake-up only on essential pins. According to Microchip's TB3065 application note, retaining 2 KB SRAM in sleep draws approximately 200 nA; full-memory retention adds 50-100 nA. For coin-cell designs, switch the ADC2 and comparator OFF before sleep and avoid BOR enabled at all times.
The 28-VQFN (4x4 mm) exposed thermal pad MUST be soldered to a PCB ground plane with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) per Microchip's package guidelines. A single 0.1 uF ceramic decoupling capacitor must be placed within 3 mm of the VDD pin, and a 10 uF tantalum or ceramic bulk capacitor within 10 mm. For 32 MHz operation, keep VDD traces short and surround the exposed pad with a continuous ground pour to reduce EMI from the internal oscillator.
Common pitfalls with PIC16LF18456-I/STX include: (1) failing to configure the PPS (Peripheral Pin Select) registers when remapping UART or SPI to alternate pins - the device ships with all peripherals disabled; (2) leaving the ADC2 enabled in sleep, which draws milliamps; (3) using the wrong configuration bits - the LVP bit must be disabled for high-voltage programming to avoid contention with RB5; (4) applying voltage above 3.6V to VDD for the LF variant destroys the part - use the F variant for 5V rails.
Per Microchip's TB3070 hardware design checklist, route the HF crystal traces (if used) within 5 mm of the OSC1/OSC2 pins with a continuous ground guard ring. Place the ICSPDAT/ICSPCLK traces away from switching power or RF traces to avoid programming-time noise. For ADC2 accuracy, dedicate a ground island around AVSS/AVDD and connect it back to the main ground via a single point to avoid digital-return currents corrupting analog readings.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - select PIC16F18456-E/STX automotive variants for AEC-Q100 needs. Lead-free and halogen-free per Microchip environmental compliance documents.
