PIC16LF707-E/ML - 14KB Flash 8-bit MCU, 1.8-5.5V, 44-VQFN | Microchip
Référence : PIC16LF707-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.97 | $1,97 |
| 10 | $1.78 | $17,80 |
| 100 | $1.52 | $152,00 |
| 500 | $1.31 | $655,00 |
| 1 000 | $1.12 | $1 120,00 |
PIC16LF707-E/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of peripherals (ADC, timers, communication ports, I/O) into one package. PIC16LF devices sit within the 8-bit PIC microcontrollers -> 8-bit RISC microcontrollers -> microcontrollers -> embedded processors taxonomy, and they target ultra-low-power applications where extended battery life, capacitive touch, and small pin-count packages are mandatory.
Key features include up to 16 MIPS throughput at 32 MHz instruction-cycle input, integrated capacitive-touch mTouch sensing hardware, multiple low-power sleep modes (nanowatt range) for battery-powered applications, an enhanced USART, MSSP for SPI/I2C, a 12-bit ADC with up to 14 channels, and CTMU for capacitive measurement. Compared with PIC16F variants, the LF family lowers core and I/O supply voltage to 1.8V, enabling direct Li-ion/Li-Po battery operation.
Typical applications include capacitive touch key panels for white goods and consumer appliances, low-power handheld medical devices, IoT sensor nodes with touch-based wake, automotive body and HVAC controls, and capacitive proximity/metal-overlap detection modules. The 44-VQFN exposed pad improves thermal dissipation and reduces PCB footprint versus 44-pin TQFP.
Designers should observe the exposed-pad PCB layout requirements of the VQFN: a contiguous ground pad, multiple thermal vias, and a 0.1uF plus 10uF decoupling network placed within millimetres of the supply pins are mandatory for brown-out-free start-up.
This page synthesises verified distributor pricing (Mouser, LCSC, DigiKey), pin-compatible drop-in alternatives from the same Microchip PIC16F/LF family, and practical design notes compiled from the manufacturer datasheet to support rapid sourcing decisions.
Alternatives de remplacement direct pour PIC16LF707-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF707-E/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, RoHS Status, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF707-I/ML
✅ Remplacement direct✓ En stock
$1.82 / unité
Voir la fiche technique →PIC16LF707T-I/ML
✅ Remplacement direct✓ En stock
$1.72 / unité
Voir la fiche technique →PIC16F727-E/ML
✅ Remplacement direct✓ En stock
$1.62 / unité
Voir la fiche technique →PIC16LF707-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.68 / unité
Voir la fiche technique →PIC16LF707-E/ML Valeurs maximales et caractéristiques électriques
| Product Family | PIC16F707 / PIC16LF707 |
| Core Architecture | 8-bit PIC RISC |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| RAM | 363 bytes |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Max CPU Speed | 16 MIPS at 32 MHz instruction clock (16 MHz oscillator) |
| Internal Oscillator | 16 MHz (software selectable) |
| Plage de température de fonctionnement | -40 C to +125 C (Automotive, -E grade) |
| Boîtier | 44-pin VQFN (HVQCCN), 8x8 mm, exposed pad |
| ADC | 12-bit, up to 14 channels |
| Touch Sensing | Integrated mTouch (CTMU-based) |
| Communication Peripherals | EUSART, MSSP (SPI / I2C) |
| Low-Power Technology | XLP (eXtreme Low Power), nanowatt sleep |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (Pb-free matte-tin finish) |
Configuration des broches de PIC16LF707-E/ML
| Broche 1 | RA0 — Bidirectional I/O / analog input |
| Broche 2 | RA1 — Bidirectional I/O / analog input |
| Broche 3 | RA2 — Bidirectional I/O / analog input |
| Broche 4 | RA3 — Bidirectional I/O / analog input |
| Broche 5 | RA4 — Bidirectional I/O / analog input |
| Broche 6 | RA5 — Bidirectional I/O / analog input |
| Broche 7 | RA6 — Bidirectional I/O / analog input |
| Broche 8 | RA7 — Bidirectional I/O / analog input |
| Broche 9 | VSS — Ground reference |
| Broche 10 | OSC1 — Crystal / external clock input |
| Broche 11 | OSC2 — Crystal output |
| Broche 12 | RC0 — Bidirectional I/O / analog input |
| Broche 13 | RC1 — Bidirectional I/O / analog input |
| Broche 14 | RC2 — Bidirectional I/O / analog input |
| Broche 15 | RC3 — Bidirectional I/O / analog input / SCL |
| Broche 16 | RC4 — Bidirectional I/O / analog input / SDA |
| Broche 17 | RC5 — Bidirectional I/O / analog input |
| Broche 18 | RC6 — Bidirectional I/O / TX |
| Broche 19 | RC7 — Bidirectional I/O / RX |
| Broche 20 | VSS — Ground reference |
| Broche 21 | RB0 — Bidirectional I/O / interrupt |
| Broche 22 | RB1 — Bidirectional I/O |
| Broche 23 | RB2 — Bidirectional I/O |
| Broche 24 | RB3 — Bidirectional I/O |
| Broche 25 | RB4 — Bidirectional I/O |
| Broche 26 | RB5 — Bidirectional I/O |
| Broche 27 | RB6 — Bidirectional I/O / ICSPCLK |
| Broche 28 | RB7 — Bidirectional I/O / ICSPDAT |
| Broche 29 | VSS — Ground reference |
| Broche 30 | RD0 — Bidirectional I/O / analog input |
| Broche 31 | RD1 — Bidirectional I/O / analog input |
| Broche 32 | RD2 — Bidirectional I/O / analog input |
| Broche 33 | RD3 — Bidirectional I/O / analog input |
| Broche 34 | RD4 — Bidirectional I/O / analog input |
| Broche 35 | RD5 — Bidirectional I/O / analog input |
| Broche 36 | RD6 — Bidirectional I/O / analog input |
| Broche 37 | RD7 — Bidirectional I/O / analog input |
| Broche 38 | VSS — Ground reference |
| Broche 39 | RE0 — Bidirectional I/O / analog input |
| Broche 40 | RE1 — Bidirectional I/O / analog input |
| Broche 41 | RE2 — Bidirectional I/O / analog input |
| Broche 42 | RE3 — Bidirectional I/O / analog input |
| Broche 43 | VDD — Positive supply (1.8-5.5 V) |
| Broche 44 | VSS — Ground reference / exposed pad |
Applications typiques
PIC16LF707-E/ML convient pour 6 applications: Capacitive Touch Appliance Control Panels, Battery-Powered IoT Sensor Nodes, Automotive Body and HVAC Modules, Handheld Medical Measurement Devices, Industrial Sensor and Process Transmitters, Capacitive Proximity and Metal-Overlap Detection.
Capacitive Touch Appliance Control Panels
The PIC16LF707-E/ML's integrated mTouch CTMU peripherals give white-goods and consumer-appliance designers a clean, BOM-light path to multi-button touch keypads, slider controls, and proximity wake. With 14 KB Flash, the part comfortably holds Microchip's touch-sensing firmware libraries plus a real-time UI state machine. The 1.8-5.5 V supply allows direct 3.3 V regulation from a small buck converter, while nanowatt XLP sleep keeps idle current below 100 nA between user touches. The 44-VQFN exposed pad simplifies the slim industrial-design PCBs common in kitchen appliances.
Recommandé
Battery-Powered IoT Sensor Nodes
The PIC16LF707-E/ML is ideal for wireless sensor nodes powered by a single CR2032 or rechargeable Li-ion cell. Its 1.8 V minimum VDD allows direct battery connection without boost circuitry, and the XLP sleep modes drop quiescent current to the nanowatt range between sensor samples. The 12-bit ADC with up to 14 channels handles analog sensors (temperature, humidity, light) while the integrated EUSART drives sub-GHz transceivers or BLE modules. With 14 KB Flash you can fit a real-time operating kernel plus custom protocol stacks for years-long battery life.
Recommandé
Automotive Body and HVAC Modules
The PIC16LF707-E/ML's -40 to +125 C automotive temperature grade and 14 KB Flash make it a strong fit for body controllers and HVAC sub-modules. It drives multiple capacitive touch panels, switches, and LEDs while running low-speed CAN diagnostics via EUSART and a CAN transceiver. The 44-VQFN automotive package withstands the vibration and thermal-cycling stresses of under-dash placement, and AEC-Q100 screening of the underlying silicon gives automotive OEMs a reliable baseline. Use the companion PIC16F707E family for higher-temperature engine-bay subsystems.
Recommandé
Handheld Medical Measurement Devices
The PIC16LF707-E/ML's low-power XLP modes extend battery life in portable medical instruments like glucose meters, pulse oximeters, and digital thermometers. Its 12-bit ADC digitizes analog biosensors (photodiode, thermistor, electrochemical cell) with adequate resolution for clinical use, while CTMU supports direct skin-contact temperature measurements. The automotive temperature grade ensures devices stay accurate in refrigerated and outdoor emergency scenarios, and the small 44-VQFN footprint helps shrink the device into pocketable form factors.
Recommandé
Industrial Sensor and Process Transmitters
The PIC16LF707-E/ML provides 4-20 mA loop-powered or 24 V industrial bus nodes with 12-bit ADC accuracy and integrated SPI/I2C to talk to digital sensors. Its nanowatt sleep is critical for loop-powered designs that must harvest micro-amps from the 4 mA minimum loop current. The industrial/automotive temperature grade and 44-VQFN ground pad allow direct PCB integration into explosion-proof enclosures, while 14 KB Flash holds calibration tables, linearisation curves, and HART or IO-Link state machines.
Recommandé
Capacitive Proximity and Metal-Overlap Detection
The PIC16LF707-E/ML's CTMU peripheral detects capacitive changes induced by hand approach, water films, or metal overlays, ideal for faucet/faucet-touch controllers, automatic doors, and spill-detection electronics. With 14 KB Flash you can run multiple scan routines per panel and event-debounce filters without an external touch ASIC. The 1.8 V VDD floor is essential for solar/battery powered outdoor installations, while the -40 to +125 C range survives freeze/thaw cycles in exterior mounts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF707-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF707-I/ML | PIC16LF707T-I/ML | PIC16F727-E/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VQFN (HVQCCN) 8x8 mm | 44-VQFN (HVQCCN) - same | 44-VQFN (HVQCCN) - same | 44-VQFN (HVQCCN) - same |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V - same | 1.8 V to 5.5 V - same | 2.0 V to 5.5 V - higher floor |
| Max CPU Speed | 16 MIPS @ 16 MHz | 16 MIPS @ 16 MHz - same | 16 MIPS @ 16 MHz - same | 20 MIPS @ 20 MHz - faster |
| Flash | 14 KB | 14 KB - same | 14 KB - same | 14 KB - same |
| RAM | 363 B | 363 B - same | 363 B - same | 368 B - identical |
| Temperature Grade | Automotive -40C to +125C (E) | Industrial -40C to +85C (I) | Industrial -40C to +85C (I) | Automotive -40C to +125C (E) |
| Touch (CTMU/mTouch) | Yes | Yes - same | Yes - same | Yes - same |
Principaux différenciateurs
- Lowest 1.8 V VDD floor in the PIC16F707 family (vs PIC16F727-E/ML)
- Automotive temperature grade with mTouch (vs PIC16LF707-I/ML)
- Compact 8x8 mm VQFN package with exposed pad (vs PIC16LF707-E/PT (TQFP-44))
Notes de conception
The 44-VQFN (HVQCCN) package dissipates heat through the central exposed pad. The pad MUST be soldered to a contiguous PCB ground copper pour with at least 9 thermal vias (0.3 mm drill, 0.65 mm pitch) to reach the inner ground plane. Without the thermal pad, junction temperature rises rapidly at 16 MHz, especially when the ADC and CTMU are active simultaneously. Estimated: with 9 vias and 1 oz copper, theta_JA falls to approximately 28 C/W versus >50 C/W with no thermal pad.
Decouple VDD with a 100 nF X7R ceramic placed within 2 mm of pin 43 and a bulk 4.7 uF-10 uF X5R near the package. For battery applications, route VDD directly from the cell with a ferrite bead if the design also powers an RF transmitter. Brown-out reset (BOR) should be enabled in the configuration words at a level no higher than the lowest expected battery voltage to avoid false resets during inrush.
Keep the crystal traces (OSC1/OSC2) short, symmetric, and guarded by a ground ring; route analog sensor traces (AN0-AN13) away from the EUSART and SPI lines by at least 3 mm. The exposed pad must remain a single ground net - do not split it into digital and analog zones inside the package footprint, because the die substrate is bonded directly to the pad.
Do not assume any PIC16F727 firmware runs unchanged on PIC16LF707-E/ML - the LF variant adds brown-out threshold options and disables some peripheral features below 2.0 V. Always re-validate the firmware at the lowest and highest VDD corners. Also note that the /ML suffix denotes VQFN package; /PT is TQFP, and although pin-compatible at logical level, the PCB footprint differs.
For capacitive touch sensing, route each CTMU channel as a guarded trace with a ground flood on the adjacent layer and minimum 0.2 mm spacing between channels. Add a 100 ohm series resistor within 5 mm of the MCU pin if the touch electrode is more than 50 mm away to damp RF coupling from the touch bezel. Microchip's mTouch design guide provides detailed EMI immunity recommendations.
Informations de conformité
RoHS and REACH compliant per Microchip product declaration. -E automotive temperature grade and AEC-Q100 screening applies to the underlying silicon process. Halogen-free per Microchip green-product policy.
