PIC16LF767-I/ML - 8-Bit 10MHz MCU 14KB Flash 28-QFN | Microchip
Référence : PIC16LF767-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.89 | $38,90 |
| 100 | $3.47 | $347,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.74 | $2 740,00 |
PIC16LF767-I/ML Présentation
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (FLASH/ROM), data memory (RAM), and programmable peripheral interfaces on a single silicon die. Within the broader hierarchy, the PIC16LF767 belongs to the PIC16F family of 8-bit RISC microcontrollers (PIC -> 8-bit MCU -> microcontroller -> semiconductor -> integrated circuit). Microchip's PIC architecture is well known for its deterministic instruction set, small footprint code, and ease of in-circuit serial programming (ICSP), which is why it dominates in cost-sensitive and safety-conscious embedded designs such as appliance controls, sensor nodes, and automotive body modules.
Key differentiating features include 11-channel 10-bit ADC for multi-sensor sampling, dual analog comparators with programmable reference, hardware USART plus master I2C/SPI, and the 8-bit-wide timer/counter architecture with PWM. The 28-QFN (ML) package integrates an exposed thermal pad that lowers junction-to-board thermal resistance and allows the part to dissipate more power at industrial temperature ranges (-40 C to +85 C) without external heatsinking.
Typical applications include industrial sensor conditioning, low-cost USB-to-UART bridges, small appliance control boards, battery-powered measurement instruments, and remote-control receivers. The wide 2.0 V-5.5 V range allows direct connection to single-cell Li-ion (3.0-4.2 V), 3.3 V logic rails, or 5 V legacy systems without level shifters. The 25 I/O pins provide generous headroom for keypads, LED indicators, character LCDs, and SPI/I2C peripheral expansion.
Designers should note the 28-QFN's exposed pad must be soldered to the PCB ground plane for electrical grounding and thermal dissipation; floating the pad will degrade ADC accuracy and cause thermal shutdown under load. For new designs, consider migrating to the PIC16F18446 or PIC16F18855 in the same QFN family if more memory or Core Independent Peripherals (CIPs) are required.
Alternatives de remplacement direct pour PIC16LF767-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF767-I/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Timers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF767T-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F767-I/ML
✅ Remplacement direct✓ En stock
$2.85 / unité
Voir la fiche technique →PIC16LF737-I/ML
✅ Remplacement direct✓ En stock
$2.95 / unité
Voir la fiche technique →PIC16LF727-I/MV
✅ Remplacement direct✓ En stock
$1.85 / unité
Voir la fiche technique →PIC16F18446-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF1939-I/ML
✅ Remplacement direct✓ En stock
$3.98 / unité
Voir la fiche technique →PIC16LF767-I/ML Valeurs maximales et caractéristiques électriques
| Core | PIC16 8-bit RISC |
| Family | PIC16F7xx |
| Program Memory (FLASH) | 14 KB (8K x 14 words) |
| Data RAM | 368 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Frequency | 10 MHz (200 ns instruction cycle) |
| Operating Voltage Range | 2.0 V to 5.5 V |
| I/O Pins | 25 |
| ADC | 11 channels, 10-bit |
| Timers | 3 (Timer0/1/2) |
| Capture/Compare/PWM | 3 CCP modules |
| Serial Interfaces | AUSART (UART) + MSSP (SPI/I2C) |
| Comparators | 2 analog comparators |
| Boîtier | 28-pin QFN (ML) 6x6 mm with exposed pad |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial, -I suffix) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Lead-Free / RoHS | Compliant |
| Programming | ICSP (In-Circuit Serial Programming) |
| Brown-Out Reset | Yes, programmable BOR |
Configuration des broches de PIC16LF767-I/ML
| Broche 1 | RA0/AN0 — Digital I/O / Analog input 0 / ICSP data |
| Broche 2 | RA1/AN1 — Digital I/O / Analog input 1 |
| Broche 3 | RA2/AN2/VREF- — Digital I/O / Analog input 2 / ADC VREF- |
| Broche 4 | RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC VREF+ |
| Broche 5 | RA4/AN4 — Digital I/O / Analog input 4 |
| Broche 6 | RA5/AN5 — Digital I/O / Analog input 5 |
| Broche 7 | OSC1/CLKIN — Crystal oscillator input / external clock |
| Broche 8 | OSC2/CLKOUT — Crystal oscillator output / clock output |
| Broche 9 | RC0 — Digital I/O port C |
| Broche 10 | RC1 — Digital I/O port C |
| Broche 11 | RC2 — Digital I/O port C |
| Broche 12 | RC3 — Digital I/O port C |
| Broche 13 | RC4 — Digital I/O port C |
| Broche 14 | RC5 — Digital I/O port C |
| Broche 15 | RC6 — Digital I/O / AUSART TX |
| Broche 16 | RC7 — Digital I/O / AUSART RX |
| Broche 17 | VSS — Ground reference |
| Broche 18 | VDD — Positive supply (2.0-5.5 V) |
| Broche 19 | RB0/INT — Digital I/O port B / External interrupt |
| Broche 20 | RB1 — Digital I/O port B |
| Broche 21 | RB2 — Digital I/O port B |
| Broche 22 | RB3 — Digital I/O port B |
| Broche 23 | RB4 — Digital I/O port B |
| Broche 24 | RB5 — Digital I/O port B |
| Broche 25 | RB6/PGC — Digital I/O / ICSP clock |
| Broche 26 | RB7/PGD — Digital I/O / ICSP data |
| Broche 27 | RA6 — Digital I/O port A |
| Broche 28 | RA7 — Digital I/O port A |
Applications typiques
PIC16LF767-I/ML convient pour 7 applications: Industrial Sensor Conditioning, Small Appliance Control Board, Battery-Powered Measurement Instrument, Remote Control / IR Receiver Board, USB-to-UART Bridge Dongle, Automotive Body Control Module (Non-Safety), HVAC and Building Automation Sensor Node.
Industrial Sensor Conditioning
The PIC16LF767-I/ML suits multi-channel industrial sensor signal conditioning with its 11-channel 10-bit ADC (1024-step resolution) and 25 I/O pins for switching analog mux channels. Its 2.0 V-5.5 V range supports 3.3 V ratiometric sensors and 5 V bridge transducers from the same rail. The three CCP/PWM modules drive excitation currents or alarm buzzers directly. Industrial-grade -40 C to +85 C operation allows deployment in factory-floor enclosures without additional thermal qualification, and the 28-QFN with exposed pad keeps the board compact while spreading heat from internal regulators. Pair it with the MCP6N16 instrumentation amplifier and a SPI-driven 24-bit ADC for higher-precision variants.
Recommandé
Small Appliance Control Board
In coffee makers, washing machines, and induction cooktops the PIC16LF767-I/ML handles keypad scanning, character-LCD drive, AC zero-cross detection, and triac/SCR gating. The AUSART plus MSSP (SPI/I2C) interface allows a daughter board to add Wi-Fi (e.g., via ATWINC1500) or Bluetooth without redesigning the main controller. The wide 2.0-5.5 V input tolerates rectified 5 V or 3.3 V rails from cheap wall adapters without damage. Three CCP modules drive PWM-controlled heating elements or variable-speed fans. Industrial-grade temperature range and onboard EEPROM make it ideal for storing appliance calibration data and user settings across power cycles.
Recommandé
Battery-Powered Measurement Instrument
The PIC16LF767-I/ML's LF low-voltage operation from 2.0 V to 5.5 V lets it run directly from a single Li-ion cell (3.0-4.2 V) or two AAs (2.0-3.2 V) without an extra boost regulator, saving quiescent current and BOM cost. The 10 MHz core and 14-bit instruction width execute signal-processing routines in real time, while the AUSART plus I2C interfaces stream readings to a Bluetooth Low Energy module (RN4871) or a 4-20 mA loop transmitter. Three CCP modules drive high-resolution PWM for dimming displays or driving piezo buzzers. The 256-byte EEPROM retains user calibration data even when the battery is removed.
Recommandé
Remote Control / IR Receiver Board
The PIC16LF767-I/ML's 10 MHz core and Capture/Compare inputs make it ideal for decoding RC5, NEC, or SIRC IR protocols with microsecond resolution, while its 25 I/O lines drive keypad scan, LED indicators, character LCD, and relay outputs. The 2.0-5.5 V range supports both 3 V CR2032 battery remotes and 5 V mains-powered receivers. AUSART lets the receiver forward decoded commands to a host MCU or a USB-UART bridge. Two analog comparators handle zero-cross detection on the AC mains side for appliance line-frequency synchronization without an extra timer. QFN-28 keeps the board under 20x20 mm.
Recommandé
USB-to-UART Bridge Dongle
The PIC16LF767-I/ML paired with a USB-UART bridge IC (MCP2200 or FT232R equivalent) implements a low-cost protocol converter, debug probe, or ISP programmer. Its AUSART runs up to 115.2 kbaud cleanly, while the MSSP (SPI/I2C) interface drives external peripherals like EEPROM, RTC, or sensors. The 2.0-5.5 V range lets the dongle power itself from USB or from the target board's 3.3 V rail. The 14 KB FLASH holds USB CDC/HID class stacks or custom protocols, while 256-byte EEPROM stores VID/PID, serial number, and user presets across power cycles. Industrial temperature range supports field-tool applications.
Recommandé
Automotive Body Control Module (Non-Safety)
For non-safety automotive body applications such as LED interior lighting, seat position memory, or ambient-light sensing the PIC16LF767-I/ML delivers industrial-grade -40 C to +85 C operation, 11 ADC channels for sensor feedback, and 3 CCP/PWM channels for driving LED drivers or small DC motors via FET bridges. Note that this part is not AEC-Q100 qualified; AEC-Q100 designs should move to PIC16F18446 with automotive part suffix. AUSART and SPI connect to CAN/LIN transceivers (MCP2515 or TJA1027) for body-network comms. 256-byte EEPROM stores seat position and trim settings.
Recommandé
HVAC and Building Automation Sensor Node
The PIC16LF767-I/ML fits wireless HVAC sensor nodes (temperature, humidity, CO2) thanks to its low-voltage 2.0-5.5 V operation that pairs with battery or energy-harvesting power supplies, and its 11-channel 10-bit ADC that reads multiple analog sensors simultaneously. The AUSART links to MRF89XA sub-GHz or ATWINC1500 Wi-Fi modules for building-network connectivity, while the MSSP drives SPI-based environmental sensors like SHT31. Three CCP modules generate PWM outputs for damper or valve actuator feedback. The 256-byte EEPROM stores calibration coefficients and node ID across battery swaps. Industrial temperature rating survives attic and outdoor enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF767-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF767T-I/ML | PIC16F767-I/ML | PIC16LF737-I/ML | PIC16LF727-I/MV | PIC16F18446-I/ML | PIC16LF1939-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same |
| Program Memory (FLASH) | 14 KB (8K x 14) | 14 KB (8K x 14) - identical | 14 KB (8K x 14) - identical | 7 KB (4K x 14) - 50% less | 14 KB - same | 28 KB - 2x more | 16 KB - 14% more |
| RAM | 368 bytes | 368 bytes - identical | 368 bytes - identical | 368 bytes - identical | 368 bytes - identical | 2 KB - 5.4x more | 1 KB - 2.7x more |
| Operating Voltage | 2.0 V to 5.5 V (LF) | 2.0 V to 5.5 V - identical | 4.5 V to 5.5 V - narrower | 2.0 V to 5.5 V - identical | 1.8 V to 3.6 V - lower max | 1.8 V to 5.5 V - wider low end | 1.8 V to 3.6 V - lower max |
| Maximum CPU Frequency | 10 MHz | 10 MHz - identical | 20 MHz - 2x faster | 10 MHz - identical | 20 MHz - 2x faster | 32 MHz - 3.2x faster | 32 MHz - 3.2x faster |
| ADC Channels / Resolution | 11 / 10-bit | 11 / 10-bit - identical | 11 / 10-bit - identical | 11 / 10-bit - identical | 14 / 10-bit - 3 more | 17 / 12-bit - more channels, higher resolution | 17 / 10-bit - 6 more |
| I/O Pins | 25 | 25 - identical | 25 - identical | 25 - identical | 25 - identical | 25 - identical | 25 - identical |
| Core Independent Peripherals (CIPs) | None (legacy CCP/PWM only) | None - identical | None - identical | None - identical | Limited CWG/NCO | Full CIP set (CWG, NCO, DSM, CCP) | Full CIP set |
| Unit Price (qty 1, as of 2026-09-25) | $4.32 | $4.32 - identical | $4.10 - similar | $3.85 - lower | $3.95 - lower | $2.85 - lower | $3.45 - lower |
Principaux différenciateurs
- Low-voltage 2.0 V-5.5 V LF operation enables direct single-cell Li-ion battery designs (vs PIC16F767-I/ML)
- Largest flash memory in the PIC16F7xx 28-pin QFN family (vs PIC16LF737-I/ML)
- Same 28-QFN footprint as newer PIC16F1xxx generations, easing migration (vs PIC16F18446-I/ML)
Notes de conception
The 28-QFN (ML) 6x6 mm package has an exposed thermal pad that must be soldered to a PCB ground plane (preferably at least 100 mm^2 of 2 oz copper) for both electrical grounding and thermal dissipation. Estimated: at 5 V VDD, 10 MHz active mode, internal peripherals all on, the part draws roughly 4-6 mA, giving 20-30 mW dissipation and a junction-to-ambient rise of <5 C with a 100 mm^2 copper plane. Floating the pad will degrade ADC accuracy and trigger thermal shutdown at full CPU load.
Place a 100 nF decoupling capacitor within 5 mm of the VDD pin (pin 18), with a short wide trace to the VSS ground (pin 17). Add a 10 uF bulk capacitor near the IC for ADC reference stability. Keep the ICSP lines PGC (pin 25) and PGD (pin 26) away from switching nodes or PWM outputs to avoid programming failures; route them straight to a 6-pin ICSP header. The exposed pad (EP) requires at least 4 thermal vias (0.3 mm drill, 0.6 mm pad) into the inner ground plane for heat spreading.
Do not confuse PIC16LF767 (2.0-5.5 V LF) with PIC16F767 (4.5-5.5 V only) - the wrong choice will brown-out reset at 3.3 V. Do not load code past 14 KB without linker remap; FLASH is 8K x 14 words = 14 KB max. Never leave the MCLR pin floating: tie it to VDD through a 10 kohm resistor with a 100 nF cap to ground for noise immunity. Verify ADC VREF+ configuration in firmware before calibration - default is VDD, not an external reference.
For ADC accuracy, use a 100 nF ceramic + 10 uF electrolytic/ceramic cap stack directly at the VREF+ pin (pin 4 / RA3) and limit source impedance to <2.5 kohm (per Microchip datasheet recommendation). Switching PWMs and CCP outputs on adjacent pins can inject noise via coupling - place analog inputs on physically separate pins and add a 1 kohm + 100 nF RC filter for >10 kHz interference. For SPI runs above 50 mm, add a 33 ohm series resistor at the source pin to dampen reflections.
Route the ICSP signals PGC and PGD as a short differential pair with the ground return between them, length-matched to <50 mm. Place the oscillator crystal (or resonator) within 5 mm of OSC1/OSC2 (pins 7-8), with a grounded guard ring around both traces. Keep the analog and digital power islands separated: a ferrite bead from VDD (digital) to AVCC equivalent and a star-ground topology at the exposed pad prevents ADC noise from digital switching returning through the ground plane.
Informations de conformité
RoHS and REACH compliant per Microchip product page; lead-free reflow profile per JEDEC J-STD-020. Not AEC-Q100 qualified - for AEC-Q100 automotive applications choose the PIC16F18446-I/ML or PIC16LF18855-I/ML automotive variant. Halogen-free per Microchip material declaration.
