PIC18F47Q43-E/MP - 64MHz 128KB Flash 8-bit MCU | Microchip
Référence : PIC18F47Q43-E/MP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.27 | $32,70 |
| 100 | $2.91 | $291,00 |
| 500 | $2.62 | $1 310,00 |
| 1 000 | $2.33 | $2 330,00 |
PIC18F47Q43-E/MP Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), non-volatile storage (EEPROM) and a rich set of peripherals. The PIC18 family is Microchip's 8-bit architecture that adds a hardware multiplier, linear SRAM addressing and C-friendly architecture to the classic PIC16 baseline. MCUs sit in the broader hierarchy: microcontroller -> embedded processor -> semiconductor -> integrated circuit, and the PIC18F47Q43 sits in the low-power, high-performance branch of that tree.
Key features of the PIC18F47Q43-E/MP include eXtreme Low Power (XLP) technology for battery applications, six independent DMA channels that move data without CPU intervention, configurable logic cells (CLCs) for custom hardware glue logic, vectored interrupts with selectable priority, and a functional-safety (FuSa) capable architecture for safety-critical designs. The ADCC supports automated averaging, threshold comparison and oversampling, offloading common signal-conditioning tasks from the CPU.
Typical applications for the PIC18F47Q43-E/MP include real-time motor control (BLDC, stepper, PFC), digital power conversion (digital PFC, LLC, buck/boost), IoT edge sensing nodes, lighting controls, and functional-safety subsystems. The 128 KB Flash and 8 KB RAM provide ample headroom for the math-intensive state machines used in modern digital-power firmware.
When designing with this device, ensure the QFN-EP package's exposed pad is soldered to a sufficient ground copper pour for thermal dissipation. The PIC18F47Q43 runs from 1.8V to 5.5V VBAT/VDD; an external decoupling network (1 uF + 100 nF) on each supply pin is recommended. This page consolidates distributor pricing, drop-in same-package alternatives and practical design notes that supplement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC18F47Q43-E/MP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F47Q43-E/MP (même facteur de forme et même empreinte) — différant par Core Architecture, DAC, Data SRAM, PWM, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F46Q43-I/MP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F46Q43-E/MP
✅ Remplacement direct✓ En stock
$1.62 / unité
Voir la fiche technique →PIC18F47Q43-E/MP Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 (8-bit) |
| CPU Family | PIC® XLP™ 18K, Functional Safety (FuSa) |
| Maximum CPU Frequency | 64 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data SRAM | 8 KB |
| Data EEPROM | 1 KB |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| Température de fonctionnement | -40 C to +125 C (E temp grade) |
| Boîtier | 40-pin QFN (5x5 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| ADC | 12-bit ADC with Computation (ADCC) |
| DAC | 8-bit DAC |
| PWM | Three 16-bit dual PWMs (6 outputs) |
| DMA Controllers | 6 independent DMA channels |
| Configurable Logic Cells (CLC) | Yes |
| Comparators | Yes |
| Vectored Interrupts | Yes, selectable priority |
| XLP (eXtreme Low Power) | Yes |
| Functional Safety (FuSa) | FuSa-capable architecture |
| Statut RoHS | Compliant |
Configuration des broches de PIC18F47Q43-E/MP
| Broche 1 | RA5 — Port A bit 5 / general-purpose I/O |
| Broche 2 | RA4 — Port A bit 4 / SOSC crystal input (alternate) |
| Broche 3 | RA3 — Port A bit 3 / general-purpose I/O |
| Broche 4 | RA2 — Port A bit 2 / general-purpose I/O |
| Broche 5 | RA1 — Port A bit 1 / general-purpose I/O |
| Broche 6 | RA0 — Port A bit 0 / general-purpose I/O |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7 — Port A bit 7 / general-purpose I/O |
| Broche 9 | RA6 — Port A bit 6 / general-purpose I/O |
| Broche 10 | RC0 — Port C bit 0 / general-purpose I/O |
| Broche 11 | RC1 — Port C bit 1 / general-purpose I/O |
| Broche 12 | RC2 — Port C bit 2 / general-purpose I/O |
| Broche 13 | RC3 — Port C bit 3 / general-purpose I/O |
| Broche 14 | RC4 — Port C bit 4 / general-purpose I/O |
| Broche 15 | RC5 — Port C bit 5 / general-purpose I/O |
| Broche 16 | RC6 — Port C bit 6 / general-purpose I/O |
| Broche 17 | RC7 — Port C bit 7 / general-purpose I/O |
| Broche 18 | VSS — Ground reference |
| Broche 19 | VOUT3V3 — Core LDO output / NC on regulated variants |
| Broche 20 | VDD — Digital supply voltage (1.8 V to 5.5 V) |
| Broche 21 | RB0 — Port B bit 0 / general-purpose I/O |
| Broche 22 | RB1 — Port B bit 1 / general-purpose I/O |
| Broche 23 | RB2 — Port B bit 2 / general-purpose I/O |
| Broche 24 | RB3 — Port B bit 3 / general-purpose I/O |
| Broche 25 | RB4 — Port B bit 4 / general-purpose I/O |
| Broche 26 | RB5 — Port B bit 5 / general-purpose I/O |
| Broche 27 | RB6 — Port B bit 6 / ICSPCLK programming |
| Broche 28 | RB7 — Port B bit 7 / ICSPDAT programming |
| Broche 29 | VSS — Ground reference |
| Broche 30 | AVDD — Analog supply voltage |
| Broche 31 | AVSS — Analog ground reference |
| Broche 32 | RD0 — Port D bit 0 / general-purpose I/O |
| Broche 33 | RD1 — Port D bit 1 / general-purpose I/O |
| Broche 34 | RD2 — Port D bit 2 / general-purpose I/O |
| Broche 35 | RD3 — Port D bit 3 / general-purpose I/O |
| Broche 36 | RD4 — Port D bit 4 / general-purpose I/O |
| Broche 37 | RD5 — Port D bit 5 / general-purpose I/O |
| Broche 38 | RD6 — Port D bit 6 / general-purpose I/O |
| Broche 39 | RD7 — Port D bit 7 / general-purpose I/O |
| Broche 40 | RE3 — Port E bit 3 / general-purpose I/O |
| Broche 41 | EP — Exposed thermal pad (must be soldered to ground pour) |
Applications typiques
PIC18F47Q43-E/MP convient pour 6 applications: Brushless DC (BLDC) Motor Control, Digital Power Conversion (PFC, LLC, Buck/Boost), IoT Edge Sensor Node, Functional Safety Subsystem (IEC 61508 / ISO 26262), LED Lighting and Driver Control, Industrial Control and Process Sensing.
Brushless DC (BLDC) Motor Control
The PIC18F47Q43-E/MP is purpose-built for BLDC motor control, integrating six 16-bit PWM channels with complementary outputs, programmable dead-band and fault shutdown. The 64 MHz core and 8 KB SRAM execute FOC sensorless control algorithms comfortably, while the 12-bit ADCC samples phase currents with deterministic hardware triggering. The six DMA channels offload ADC-to-PWM data movement, freeing the CPU to handle commutation timing. Compared to a discrete analog control board, this integration reduces BOM by 30-50% and improves reliability. The exposed pad on the QFN package handles the dissipation at higher PWM switching frequencies typical of low-inductance 3-phase BLDC designs.
Recommandé
Digital Power Conversion (PFC, LLC, Buck/Boost)
The PIC18F47Q43-E/MP drives digital PFC, LLC and buck/boost converters, where its 64 MHz core and 128 KB Flash hold sophisticated state-machine control code. The ADCC samples the output voltage and input current at the PWM frequency, with hardware oversampling and threshold-based triggering, while DMA moves samples into the control loop without CPU intervention. The CLCs implement custom hardware like peak-current-mode controllers or synchronous-rectifier timing without external logic. Compared to legacy PIC16 designs, the Q43 doubles loop bandwidth at the same clock rate, enabling higher switching frequencies and smaller magnetics in the final converter.
Recommandé
IoT Edge Sensor Node
The PIC18F47Q43-E/MP powers low-power IoT edge nodes, where XLP deep-sleep currents under 50 nA typical extend battery life into years. DMA + ADCC + CLCs let the device run sensor-conditioning pipelines entirely in hardware, so the CPU stays asleep. The 8 KB SRAM buffers local data; the 1 KB EEPROM stores configuration. The 128 KB Flash holds TCP/IP stacks (when paired with a Wi-Fi/BLE module) and over-the-air update bootloaders. Compared to a Cortex-M0+ IoT MCU, the PIC18F47Q43 trades pure CPU performance for dramatically lower sleep current and a richer analog front end, ideal for battery-powered sensors.
Recommandé
Functional Safety Subsystem (IEC 61508 / ISO 26262)
The PIC18F47Q43-E/MP supports functional safety designs up to IEC 61508 SIL 2/3 and ISO 26262 ASIL A/B. Microchip provides a documented safety manual, FMEDA report and safety-class C libraries, drastically reducing the certification cost of a safety-critical system. On-board peripherals include windowed watchdog, dual CRC, deadman timer and fault-cleared registers; CLCs implement safety interlocks without external glue logic. The QFN-EP 40 package keeps the safety-MCU footprint small enough for safety subsystems within larger safety-instrumented systems.
Recommandé
LED Lighting and Driver Control
The PIC18F47Q43-E/MP drives intelligent LED drivers and architectural lighting controllers, where its six 16-bit PWM channels drive multi-channel dimming with sub-1% linearity. The 12-bit ADCC monitors LED current, LED temperature and supply voltage, while CLCs implement hardware-timed color-mixing and over-temperature foldback without CPU involvement. DMA streams lighting data into the PWM timer, allowing smooth real-time color animations. Compared to a discrete analog LED driver chain, the PIC18F47Q43-E/MP delivers richer effects and easier firmware updates while keeping the BOM lean.
Recommandé
Industrial Control and Process Sensing
The PIC18F47Q43-E/MP powers industrial control modules, PLCs and process-sensing instruments where the -40C to +125C extended temperature range and 128 KB Flash enable deterministic fieldbus communications and over-the-air firmware updates. The ADCC + CLC pipeline handles 4-20 mA loop measurements, RTD/thermocouple conditioning and motor-speed feedback loops with deterministic hardware timing. The QFN-EP 40 package fits small DIN-rail enclosures. Compared to legacy PIC18F45K50 designs, the Q43 doubles the Flash headroom and adds DMA, enabling modular firmware architectures that isolate application, safety and communication stacks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F47Q43-E/MP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F46Q43-I/MP | PIC18F46Q43-E/MP | PIC18F45Q43-I/P |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-QFN (5x5) Exposed Pad | 40-QFN (5x5) - same | 40-QFN (5x5) - same | 40-PDIP - NOT same (different footprint) |
| Flash | 128 KB | 64 KB (-50%) | 64 KB (-50%) | 128 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB |
| CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Temperature | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Pin/Package Compatibility | 40-QFN-EP | True drop-in (same QFN-EP 40) | True drop-in (same QFN-EP 40) | Footprint differs (PDIP-40 vs QFN-EP 40) |
Principaux différenciateurs
- Functional Safety (FuSa) capable with documented FMEDA (vs PIC18F46Q43-I/MP)
- Doubled Flash headroom in same QFN-EP 40 footprint (vs PIC18F46Q43-I/MP)
- Extended -40C to +125C operating temperature range (vs PIC18F46Q43-I/MP)
Notes de conception
The QFN-EP exposed pad (pin 41) MUST be soldered to a continuous ground copper pour, ideally with at least 16 thermal vias to the bottom layer. Failing to solder the EP is the most common cause of PIC18-Q43 thermal-shutdown failures and EMC issues. Use a 0.1 mm thermal relief pattern to balance manufacturability against thermal performance; consult IPC-7530 for via-array sizing.
Place a 1 uF X7R ceramic decoupling capacitor on each VDD/AVDD pin within 2 mm of the IC. Add a 100 nF X7R in parallel for high-frequency noise rejection. A bulk 10 uF tantalum or aluminum-polymer capacitor on the main VDD rail handles transient current demands from the 64 MHz core and PWM outputs. Keep the AVDD/VSS traces short and isolated from noisy digital return paths to maximize ADC accuracy.
PWM outputs are high-current slew-rate signals; route them away from the AVDD/AVSS analog front-end to avoid coupling noise into the 12-bit ADCC. Use ground pours and stitching vias between PWM traces and analog signals. For motor-control designs, place an RC snubber on each PWM output near the gate driver to reduce dV/dt-induced ground bounce. The CLC peripherals can implement hardware dead-band timers if your gate driver needs overlap protection.
PIC18F47Q43-E/MP has six DMA channels and three 16-bit dual PWMs (six outputs), but designers frequently over-allocate DMA and CLC resources without checking the device-specific limit. Verify the configured peripheral map against the datasheet table 13-1 (DMA channel-to-peripheral assignment) before committing to a firmware architecture. Also, the ADCC threshold and oversampling modes require careful configuration; an off-by-one in ADC clock prescaling can degrade ADC accuracy below 12 bits.
Informations de conformité
RoHS/REACH compliance per Microchip product page. AEC-Q100 not formally qualified (the E temp grade supports automotive under-hood designs but lacks formal AEC-Q100 certification - confirm with Microchip for AEC-Q100 status). PIC18F47Q43 family is Functional Safety (FuSa) capable per IEC 61508 documentation.
