PIC18LF25K83-I/ML - 32KB Flash, CAN, 28-QFN 8-bit MCU | Microchip
Référence : PIC18LF25K83-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.21 | $3,21 |
| 10 | $2.85 | $28,50 |
| 100 | $2.41 | $241,00 |
| 500 | $2.12 | $1 060,00 |
| 1 000 | $1.86 | $1 860,00 |
PIC18LF25K83-I/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), and a set of on-chip peripherals such as timers, ADCs, communication interfaces and I/O ports. The PIC18LF25K83 belongs to the 8-bit MCU category, sitting hierarchically below 16-bit and 32-bit MCUs in raw compute throughput but offering very low power, deterministic interrupt response, and a small footprint — ideal for cost- and energy-constrained edge nodes. The LF prefix indicates the low-voltage variant of the K83 family, with the F-version supporting a wider 2.3 V to 5.5 V supply.
Key features include 32 KB self-programmable Flash, 1 KB EEPROM, 2 KB SRAM, a 12-bit ADC2 with automated Capacitive Voltage Divider (CVD) for touch sensing, multiple communication peripherals (CAN 2.0B, UART, SPI, I2C), Core Independent Peripherals (CIPs), and the eXtreme Low-Power (XLP) nanoWatt technology. The device integrates up to 25 I/O pins with individual interrupt-on-change capability, multiple PWM outputs, and configurable logic cells that allow designers to offload tasks from the CPU.
The K83 family is built around Microchip's enhanced mid-range PIC18 core, featuring a hardware multiplier, a 31-level stack, and a vectored interrupt controller. The 12-bit ADC2 with computation automates averaging, oversampling and threshold comparison, significantly reducing firmware overhead for sensor and touch-sensing applications. The integrated CAN 2.0B module with filtering and masking enables robust industrial and automotive networking without an external transceiver controller.
Typical applications include automotive body and comfort modules, industrial CAN nodes, capacitive touch user interfaces, low-power sensor hubs, building automation, and battery-powered IoT edge devices. The combination of CAN connectivity, ADC2 with touch support and nanoWatt XLP sleep makes it especially well suited to always-on systems that spend most of their time in deep sleep and only wake on a sensor event or CAN frame.
When designing with this MCU, ensure the exposed pad (EP) of the QFN-28 is soldered to a sufficiently large copper pour to meet the package's thermal and electrical ground requirements. Use MPLAB X IDE with XC8 compiler and MPLAB Code Configurator (MCC) for rapid peripheral setup, and consider the PIC18F25K83 variant if 5 V tolerance or higher Vdd operation is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single source to compare the PIC18LF25K83-I/ML against same-package alternatives and select the right MCU for low-power CAN-enabled designs.
Alternatives de remplacement direct pour PIC18LF25K83-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF25K83-I/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Timers, I/O Pins, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F25K83-I/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC18F26K83-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.19 / unité
Voir la fiche technique →PIC18F27K83-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC18F25K83T-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18LF26K83-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.92 / unité
Voir la fiche technique →PIC18LF27K83-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC18LF25K83-I/ML Valeurs maximales et caractéristiques électriques
| Core | PIC18 8-bit enhanced mid-range |
| Family | PIC18 (L)F25/26K83 |
| Program Memory (Flash) | 32 KB (16K x 16) |
| RAM | 2 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| ADC | 12-bit ADC2 with Computation (CVD) |
| Communication Peripherals | 1x CAN 2.0B, UART, SPI, I2C |
| I/O Pins | Up to 25 |
| Boîtier | 28-pin QFN (ML) 6x6 mm with exposed pad |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Low-Power Technology | nanoWatt XLP |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC18LF25K83-I/ML
| Broche 1 | RA0 — Port A bit 0 (analog/digital I/O, ADC input) |
| Broche 2 | RA1 — Port A bit 1 (analog/digital I/O, ADC input) |
| Broche 3 | RA2 — Port A bit 2 (analog/digital I/O, ADC input) |
| Broche 4 | RA3 — Port A bit 3 (analog/digital I/O, VREF+ input) |
| Broche 5 | RA4 — Port A bit 4 (digital I/O) |
| Broche 6 | RA5 — Port A bit 5 (digital I/O) |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7 — Port A bit 7 (digital I/O, OSC1) |
| Broche 9 | RA6 — Port A bit 6 (digital I/O, OSC2) |
| Broche 10 | RC0 — Port C bit 0 (digital I/O, SOSCO) |
| Broche 11 | RC1 — Port C bit 1 (digital I/O, SOSCI) |
| Broche 12 | RC2 — Port C bit 2 (digital I/O) |
| Broche 13 | RC3 — Port C bit 3 (digital I/O, SCL) |
| Broche 14 | RC4 — Port C bit 4 (digital I/O, SDA) |
| Broche 15 | RC5 — Port C bit 5 (digital I/O) |
| Broche 16 | RC6 — Port C bit 6 (digital I/O, TX) |
| Broche 17 | RC7 — Port C bit 7 (digital I/O, RX) |
| Broche 18 | RB0 — Port B bit 0 (interrupt-on-change, digital I/O) |
| Broche 19 | RB1 — Port B bit 1 (interrupt-on-change, digital I/O) |
| Broche 20 | RB2 — Port B bit 2 (interrupt-on-change, digital I/O) |
| Broche 21 | RB3 — Port B bit 3 (interrupt-on-change, digital I/O) |
| Broche 22 | RB4 — Port B bit 4 (interrupt-on-change, digital I/O) |
| Broche 23 | RB5 — Port B bit 5 (interrupt-on-change, digital I/O) |
| Broche 24 | RB6 — Port B bit 6 (interrupt-on-change, ICSCLK) |
| Broche 25 | RB7 — Port B bit 7 (interrupt-on-change, ICSDAT) |
| Broche 26 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Broche 27 | AVDD — Analog positive supply |
| Broche 28 | AVSS — Analog ground reference |
Applications typiques
PIC18LF25K83-I/ML convient pour 7 applications: Automotive Body and Comfort CAN Node, Industrial CAN Sensor Hub, Capacitive Touch User Interface Panel, Low-Power IoT Edge Sensor Node, Building Automation HVAC Controller, Medical Point-of-Care Diagnostic Device, Battery-Management Slave Monitor.
Automotive Body and Comfort CAN Node
The PIC18LF25K83-I/ML is an excellent fit for automotive body and comfort ECUs such as mirror controllers, seat position modules, and interior-lighting slaves because it integrates a hardware CAN 2.0B controller plus a 12-bit ADC2 with Computation, all in a compact 28-QFN 6x6 mm footprint. With 32 KB of Flash and 2 KB of RAM, it can run CANopen or J1939 lightweight stacks while leaving room for sensor processing, while nanoWatt XLP sleep currents under 1 uA allow always-on wake-on-CAN behaviour that preserves battery life on parked vehicles. Pairing the MCU with an external MCP2561 CAN transceiver gives a complete two-node bus segment. The 1.8-3.6 V supply range matches modern 3.3 V automotive rails derived from the battery via a buck converter, simplifying power-tree design and reducing thermal dissipation in always-powered modules.
Recommandé
Industrial CAN Sensor Hub
For industrial sensor hubs that aggregate analog and digital inputs on a CAN backbone, the PIC18LF25K83-I/ML delivers 32 KB of Flash for protocol stacks such as CANopen or Modbus-over-CAN, plus a 12-bit ADC2 capable of oversampling to 16 bits effective resolution for accurate transducer reading. The 28-QFN package keeps the PCB footprint under 36 mm^2, which is critical when multiple sensor boards must fit inside a small IP65 enclosure. Hardware CIPs (Configurable Logic Cells, CWG, NCO) allow event-driven response to sensor thresholds without waking the CPU, while nanoWatt XLP sleep reduces standby current to single-digit microamps for battery- or energy-harvest-powered nodes. The LF's 1.8 V minimum Vdd also enables direct connection to supercapacitor-buffered backup supplies common in industrial gateways.
Recommandé
Capacitive Touch User Interface Panel
The PIC18LF25K83-I/ML's ADC2 with Capacitive Voltage Divider (CVD) hardware automates touch-button and slider scanning on glass or plastic overlays, offloading the scanning algorithm from firmware and dramatically reducing development time. With 32 KB of Flash, designers can implement a 12-button keypad plus haptic and LED feedback drivers without external logic, while the 28-QFN keeps the controller PCB compact enough to sit behind a touch panel. The MCU's low-power sleep modes are ideal for battery-powered remote controls and proximity wake-up panels where the touch interface must remain responsive while consuming only microamps in standby. Combined with an I2C-driven LED driver, a complete touch UI solution fits on a single 4-layer board less than 25x25 mm.
Recommandé
Low-Power IoT Edge Sensor Node
Battery-powered IoT edge nodes benefit from the PIC18LF25K83-I/ML's nanoWatt XLP technology, which delivers deep-sleep currents in the tens of nanoamps while retaining RAM and interrupt-on-change wake capability. The integrated 12-bit ADC2 with computation performs autonomous threshold comparisons and wakes the CPU only when an actual sensor event occurs, extending battery life to years on a single CR2032 coin cell for periodic environmental monitoring. The 32 KB Flash accommodates TLS-lite or LoRaWAN stacks when paired with a SPI-attached SX1276 transceiver, and the 28-QFN package drops onto standard 0.65 mm-pitch footprints shared with other PIC18 K-series devices. The 1.8 V minimum supply directly supports single-cell alkaline or lithium primary cells without a boost converter.
Recommandé
Building Automation HVAC Controller
In HVAC and building automation sub-controllers, the PIC18LF25K83-I/ML combines CAN connectivity for backbone networking, a 12-bit ADC2 for temperature and humidity sensing, and PWM outputs for valve or damper actuator control in a single chip. The 32 KB Flash supports BACnet MS/TP or Modbus RTU firmware for branch controllers, while the 28-QFN 6x6 mm package allows the controller to be embedded directly inside the actuator housing. nanoWatt XLP sleep modes reduce idle consumption below 100 uA, helping buildings meet stringent energy codes such as ASHRAE 90.1 and IECC. Hardware CIPs enable autonomous fan-speed control loops that continue running even when the MCU is sleeping, with the CPU only waking on setpoint change interrupts.
Recommandé
Medical Point-of-Care Diagnostic Device
Portable point-of-care diagnostic instruments such as glucometers, INR meters, and pulse-oximeter secondary displays use the PIC18LF25K83-I/ML to combine low-power operation, accurate analog measurement and CAN connectivity to the host analyzer. The 12-bit ADC2 with hardware oversampling delivers the linearity needed for photometric and electrochemical sensor readout, while 32 KB of Flash is ample for measurement algorithms, calibration tables and an IEC 62366-compliant UI state machine. The LF variant's 1.8 V minimum supply lets designers run directly from a single 3 V coin cell or two AAA batteries, and nanoWatt XLP sleep drops the standby current low enough to meet shelf-life requirements for home-use medical devices. The 28-QFN package is suitable for hand-held form factors where PCB area is at a premium.
Recommandé
Battery-Management Slave Monitor
As a slave cell-monitor in distributed battery-management systems for e-bikes, light EVs and energy storage, the PIC18LF25K83-I/ML offers integrated CAN for daisy-chaining modules, a 12-bit ADC2 to digitize cell voltages and thermistor readings, and nanoWatt XLP sleep to minimize quiescent draw on the stack. The 28-QFN 6x6 mm footprint is small enough to mount on a flexible PCB or in the cell holder itself, while the 32 KB Flash accommodates proprietary balancing algorithms and CAN-based diagnostics. The LF's 1.8 V minimum Vdd is well matched to direct connection to cell stacks via a small isolated supply. Designers can scale memory up within the same package using the PIC18F26K83 or PIC18F27K83 without changing the PCB layout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF25K83-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F25K83-I/ML | PIC18F26K83-I/ML | PIC18F27K83-I/ML | PIC18F25K83T-I/ML | PIC18LF26K83-I/ML | PIC18LF27K83-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB - same | 64 KB | 128 KB | 32 KB - same | 64 KB | 128 KB |
| RAM | 2 KB | 2 KB - same | 4 KB | 8 KB | 2 KB - same | 4 KB | 8 KB |
| Vdd Range | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same |
| CAN 2.0B | Yes (integrated) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| ADC2 (12-bit + Computation) | Yes | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Core / Max Frequency | PIC18 / 64 MHz (16 MIPS) | PIC18 / 64 MHz - same | PIC18 / 64 MHz - same | PIC18 / 64 MHz - same | PIC18 / 64 MHz - same | PIC18 / 64 MHz - same | PIC18 / 64 MHz - same |
| Operating Temperature | -40C to +85C | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| Approx. Unit Price (USD, as of 2026-09-28) | $3.21 | $3.21 - same | $3.65 | $4.10 | $3.21 - same | $3.65 | $4.10 |
Principaux différenciateurs
- Higher-density Flash scaling on the same 28-QFN footprint (vs PIC18F26K83-I/ML (64 KB Flash) and PIC18F27K83-I/ML (128 KB Flash))
- Lower minimum supply voltage than F-variant siblings (vs PIC18F25K83-I/ML)
- Integrated CAN 2.0B with hardware filtering (vs PIC18F25K22 (no on-chip CAN, requires external MCP2515))
- ADC2 with Capacitive Voltage Divider (CVD) hardware (vs PIC18F25K22 (basic 10-bit ADC, no CVD))
Notes de conception
The 28-QFN (ML) package exposes a central thermal pad on the underside that must be soldered to a top-layer copper pour of at least 0.5 in^2 to meet electrical and thermal specifications. Per Microchip's QFN PCB layout application note, stitch the exposed pad to the internal ground plane with at least four thermal vias (0.3 mm drill, 0.65 mm pitch) to provide low-impedance ground and adequate heat spreading. Failure to solder the EP correctly can cause erratic ADC readings and reduced CAN bus reliability.
Place a 100 nF decoupling capacitor within 2 mm of each VDD/AVDD pin pair, plus a bulk 10 uF ceramic close to the MCU. The PIC18LF25K83's analog supply (AVDD) should be tied to VDD through a ferrite bead or 10 ohm resistor with its own 100 nF + 10 uF decoupling to keep ADC reference noise below 1 LSB at 12 bits. Estimated: at 64 MHz active current ~12 mA, with 1.8 V Vdd, the decoupling network should keep rail ripple under 30 mV peak-peak to avoid ADC2 conversion errors.
For reliable CAN bus operation, the CANTX and CANRX traces should be routed as a differential pair with 120 ohm characteristic impedance and matched length within 2 mm. Keep CAN traces away from switching nodes and from the QFN exposed pad stitching vias. Place the MCP2561 transceiver within 20 mm of the MCU's CANTX/CANRX pins, and use a common-mode choke on the bus lines if the design must pass automotive transient tests such as ISO 7637-2 pulse 1 and 2.
Do not enable the PLL on the internal HFINTOSC without first confirming the ACTIVE_TUNING register setting; an out-of-tune HFINTOSC can push the 64 MHz system clock outside the 1.8 V Vdd's minimum Vdd spec and cause brown-out resets. Always read the oscillator calibration constants from CONFIG words at startup and write them to OSCTUNE. Also remember that PIC18LF (1.8-3.6 V) parts cannot be programmed by any debugger configured for >4.0 V Vpp on MCLR — set your MPLAB ICD 4 or PICkit 4 to LF range.
At maximum 64 MHz active operation with 3.6 V Vdd, the PIC18LF25K83-I/ML dissipates approximately 43 mW internally. The 28-QFN's theta_JA of approximately 40 C/W on a 4-layer JEDEC test board yields a junction-temperature rise of less than 2 C above ambient, so no heatsink is required for typical industrial environments. For sealed enclosures above 70 C ambient, verify with a thermal probe that the exposed-pad copper pour keeps Tj below the 125 C maximum.
Informations de conformité
RoHS and REACH compliance per Microchip product environmental compliance page. Industrial-grade temperature range -40C to +85C. AEC-Q100 not qualified on this part number; choose PIC18F25K83 Functional Safety (FuSa) variants for automotive safety applications.
