Microchip Technology

PIC18LF26K83-I/ML - 64KB Flash 8-bit MCU w/ CAN | Microchip

MPN: PIC18LF26K83-I/ML ✓ Active
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1.8 V to 5.5 V Vdss 28-pin QFN (6x6 mm), designated /ML Package 64 MHz maximum (16 MIPS) Speed 64 KB (32K x 16) Memory
From $1.92 USD / Unit
MOQ: 1 |
Price updated: 2026-09-28
Volume Pricing
Qty Unit Price Extended
1 $3.4 $3.40
10 $2.98 $29.80
100 $2.55 $255.00
500 $2.18 $1,090.00
1,000 $1.92 $1,920.00
ℹ️ All prices are in USD

PIC18LF26K83-I/ML Overview

The Microchip Technology PIC18LF26K83-I/ML is an 8-bit PIC18 XLP microcontroller delivering 64 MHz CPU performance with 64 KB Flash, 4 KB SRAM and 1 KB EEPROM in a 28-pin QFN (6x6 mm) package. The device integrates CAN 2.0B, dual I2C, dual SPI and EUSART interfaces, plus a 12-bit ADC with Computation (ADC2) that automates Capacitive Voltage Divider (CVD) for advanced touch sensing.

What is a PIC18 XLP microcontroller? The PIC18 family is Microchip's high-performance 8-bit microcontroller line based on an enhanced RISC architecture, while the XLP (eXtreme Low Power) designation indicates sub-uA sleep current and nanoWatt technology for battery-friendly designs. Within the broader hierarchy, PIC18 sits below 16-bit PIC24/dsPIC and 32-bit PIC32 families, but above baseline PIC10/12/16 parts in both performance and peripheral integration.

Key features include a 64 MHz internal oscillator, 7 timers, 2 analog comparators with FVR, a 2-channel DMA controller, and 25-channel 12-bit ADC2. The device supports core independent peripherals (CIPs) such as the Hardware Limit Timer, CLC, NCO, PWM and Complementary Waveform Generator, enabling complex functions without CPU intervention.

The PIC18LF26K83 family architecture separates the CAN module from the ADC2 and DMA subsystems via independent interrupt vectors, allowing deterministic real-time response. It is built on an enhanced Harvard architecture with a 16-bit instruction word and 8-bit data path, supporting hardware multiply and a vectored interrupt controller with prioritized interrupts for deterministic latency.

Typical applications include automotive body and chassis ECUs, industrial CAN nodes, sensor transducers with touch interfaces, building automation, low-power remote sensing, and medical devices where its XLP standby current extends battery life. The wide 1.8V to 5.5V supply range suits both 3.3V and 5V system designs.

When designing with this device, place decoupling capacitors within 2 mm of each VDD/VSS pair, route the CAN bus with 120 ohm characteristic impedance, and reserve an unused GPIO for firmware-driven PCB identification or test-point access during qualification.

This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, including a same-package upgrade path to PIC18F26K83 (5V FuSa variant) and the lower-pin-count PIC18LF25K83 sibling.

Drop-in alternatives for PIC18LF26K83-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC18LF26K83-I/ML (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), Family, I/O Pins.

Microchip Technology
ADC: 12-bit with Computation (ADC2), up to 24 channels
Package: 28-QFN (6x6 mm) with exposed pad
Program Memory (Flash): 64 KB (32K x 16 words)
Microchip Technology
ADC: 12-bit ADC2 with Computation (CVD)
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
Program Memory (Flash): 32 KB (16K x 16)
Microchip Technology
ADC: 12-bit with Computation
Package: 28-pin QFN (6x6 mm) with EP
Family: PIC® XLP™ 18K (K42)
Microchip Technology
ADC: 10-bit, up to 350 ksps with computation
Package: 28-QFN (6x6 mm) with exposed pad
Program Memory (Flash): 128 KB
Microchip Technology
ADC: 10-bit, 17 channels
Package: 44-pin QFN (8x8 mm) with exposed pad
Program Memory (Flash): 8 KB (4K x 16 words)
Microchip Technology
ADC: 10-bit, up to 30 channels
Package: 44-QFN (8x8 mm) with exposed pad
Program Memory (Flash): 8 KB (4K x 16)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC18F26K83-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC18F26K83 (PIC XLP 18K) · 8-bit PIC18, modified Harvard · 64 KB (32K x 16 words) · 4 KB · 1 KB · 64 MHz · 2.3 V to 5.5 V · 24

✓ In Stock

$2.19 / Unit

View Datasheet →

PIC18LF26K83-E/ML

✅ Drop-In
📦 28-QFN (6x6 mm)
same 28-QFN footprint, extended -40C to +125C temperature grade

📋 Reference alternative (not in catalog)

PIC18LF25K83-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC18 8-bit enhanced mid-range · PIC18 (L)F25/26K83 · 32 KB (16K x 16) · 2 KB · 1 KB · 64 MHz (16 MIPS) · 1.8 V to 3.6 V · 12-bit ADC2 with Computation (CVD)

✓ In Stock

$1.86 / Unit

View Datasheet →

PIC18LF26K83-I/MX

✅ Drop-In
📦 28-QFN (6x6 mm)
same 28-QFN footprint, alternative temperature variant in same package

📋 Reference alternative (not in catalog)

PIC18LF26K42-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC18 8-bit RISC · PIC® XLP™ 18K (K42) · 64 KB (32K x 16) · 4 KB · 1 KB · 64 MHz · 1.8 V to 3.6 V (LF variant) · 24

✓ In Stock

$2.62 / Unit

View Datasheet →

PIC18LF26K83-I/ML Maximum Ratings & Electrical Characteristics

Core Architecture PIC18 (8-bit enhanced RISC, Harvard)
CPU Speed 64 MHz maximum (16 MIPS)
Program Memory (Flash) 64 KB (32K x 16)
SRAM 4 KB
EEPROM 1 KB
Supply Voltage (VDD) 1.8 V to 5.5 V
Operating Temperature -40C to +85C (Industrial, -I suffix)
Package 28-pin QFN (6x6 mm), designated /ML
Mounting Type Surface Mount (QFN)
ADC 12-bit ADC2, up to 25 channels with Computation (CVD, averaging, filtering, oversampling)
Communication Interfaces 1x CAN 2.0B, 2x I2C, 2x SPI, 1x EUSART (LIN-capable)
Timers 7 (Timer0-5, Timer6)
Comparators 2 with FVR (Fixed Voltage Reference)
DMA Channels 2
Core Independent Peripherals CLC, NCO, PWM, Complementary Waveform Generator, Hardware Limit Timer
MSL Level 3 (per JEDEC J-STD-020)
RoHS Status Compliant

PIC18LF26K83-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 VDD — Positive supply voltage (1.8V to 5.5V)
Pin 2 RA5 — Port A bit 5 / GPIO
Pin 3 RA4 — Port A bit 4 / GPIO
Pin 4 RA3 — Port A bit 3 / GPIO
Pin 5 RC5 — Port C bit 5 / GPIO
Pin 6 RC4 — Port C bit 4 / GPIO
Pin 7 RC3 — Port C bit 3 / GPIO / SCL
Pin 8 RC2 — Port C bit 2 / GPIO
Pin 9 RC1 — Port C bit 1 / GPIO
Pin 10 RC0 — Port C bit 0 / GPIO
Pin 11 VSS — Ground reference
Pin 12 RA2 — Port A bit 2 / GPIO
Pin 13 RA1 — Port A bit 1 / GPIO / ICSPCLK
Pin 14 RA0 — Port A bit 0 / GPIO / ICSPDAT
Pin 15 RB7 — Port B bit 7 / GPIO
Pin 16 RB6 — Port B bit 6 / GPIO / ICSP
Pin 17 RB5 — Port B bit 5 / GPIO
Pin 18 RB4 — Port B bit 4 / GPIO
Pin 19 RB3 — Port B bit 3 / GPIO
Pin 20 RB2 — Port B bit 2 / GPIO
Pin 21 RB1 — Port B bit 1 / GPIO
Pin 22 RB0 — Port B bit 0 / GPIO / INT0
Pin 23 VSS — Ground reference (additional)
Pin 24 VDD — Positive supply (additional)
Pin 25 RC7 — Port C bit 7 / GPIO / CANRX
Pin 26 RC6 — Port C bit 6 / GPIO / CANTX
Pin 27 RA7 — Port A bit 7 / GPIO / OSC1
Pin 28 RA6 — Port A bit 6 / GPIO / OSC2
Pin 29 EP — Exposed thermal pad - connect to VSS (ground)

Typical Applications

PIC18LF26K83-I/ML is suitable for 6 applications: Automotive CAN Body Control Module, Industrial Sensor Transducer, Capacitive Touch User Interface, Building Automation HVAC Controller, Battery-Powered Remote Sensor Node, Medical Device Interface Board.

🚗

Automotive CAN Body Control Module

The PIC18LF26K83-I/ML is well matched to automotive body CAN nodes because it integrates a hardware CAN 2.0B controller, 64 KB Flash and 12-bit ADC2 in a single 28-QFN. The 1.8-5.5V supply range allows direct connection to 5V CAN transceivers such as the MCP2551 without level shifting. At 64 MHz the device finishes CAN frame processing ahead of the 1 Mbit/s bit time, leaving headroom for diagnostic UDS handlers. AEC-Q100 equivalent parts in the same family support under-hood and chassis control where vibration and temperature extremes apply.

🏭

Industrial Sensor Transducer

The PIC18LF26K83-I/ML fits industrial sensor designs where a microcontroller must digitize multiple analog channels while running Modbus or CANopen on the bus. Its 12-bit ADC2 with computation engines (averaging, oversampling, burst mode) automates signal conditioning without CPU load, while the 2-channel DMA offloads ADC buffers and UART FIFOs. The wide 1.8-5.5V range tolerates 24V industrial bus rails after a buck regulator. XLP nanoWatt sleep currents below 1 uA enable battery or harvested-power transducer nodes that sleep most of the time.

📱

Capacitive Touch User Interface

The PIC18LF26K83-I/ML is ideal for capacitive touch panels because the ADC2 hardware engine automates CVD scanning across up to 25 channels with averaging and oversampling, freeing the CPU from interrupt-driven scanning. The CLC and NCO peripherals can synthesize guard-ring signals without software intervention, reducing BOM cost. With the mTouch library a 12-button keypad plus slider runs in under 30 percent Flash, leaving room for application UI logic. Industrial -40C to +85C operation handles outdoor kiosks and appliance HMIs.

🏭

Building Automation HVAC Controller

HVAC and building automation controllers benefit from the PIC18LF26K83-I/ML combination of CAN bus connectivity, multiple communication peripherals and ADC2 for analog sensor inputs. Its core independent peripherals - CLC, PWM and Hardware Limit Timer - allow valve and damper control loops to run without CPU load. EUSART with LIN support lets the same device talk to damper actuators, while I2C connects local temperature/humidity sensors. The 28-QFN package fits behind wall plates and inside equipment housings where board space is constrained.

🔋

Battery-Powered Remote Sensor Node

The PIC18LF26K83-I/ML supports battery-powered sensor nodes because of its XLP nanoWatt technology with sub-uA sleep current and <100 nA RTCC retention. In sleep mode with RTCC running the part draws less than the battery self-discharge, enabling multi-year coin-cell operation. Wake on interrupt from Timer1, INT pins or ADC2 threshold detection allows scheduled measurement and event-driven responses. The 1.8V minimum supply matches primary LiSOCl2 and LiMnO2 chemistries without boost conversion, improving overall efficiency.

💊

Medical Device Interface Board

The PIC18LF26K83-I/ML is well suited for medical interface boards requiring multiple serial channels, accurate ADC and CAN connectivity. Its 12-bit ADC2 with oversampling achieves effective resolution above 14 bits when digitizing ECG, SpO2 and temperature sensor outputs. Dual I2C allows simultaneous use of a display and a sensor front-end while the CAN bus connects to the host monitoring system. IEC 60730 Class B diagnostic libraries are available from Microchip to support functional safety requirements for medical and household appliances.

Recommended Products Summary

MCP2551 5V CAN transceiver companion Used in: Automotive CAN Body Control Module, Building Automation HVAC Controller, Medical Device Interface Board PIC18F26K83-I/ML Microchip Technology Used in: Automotive CAN Body Control Module, Capacitive Touch User Interface, Medical Device Interface Board MCP2515 External CAN controller for legacy designs Used in: Automotive CAN Body Control Module, Industrial Sensor Transducer MCP1700 Low-Iq LDO for sensor power rail Used in: Industrial Sensor Transducer, Battery-Powered Remote Sensor Node PIC18LF25K83-I/ML Microchip Technology Used in: Industrial Sensor Transducer, Building Automation HVAC Controller, Battery-Powered Remote Sensor Node PIC18LF26K42-I/ML Microchip Technology Used in: Capacitive Touch User Interface MCP6L02 Op-amp for guard-ring driver if needed Used in: Capacitive Touch User Interface MCP9808 High-accuracy temperature sensor over I2C Used in: Building Automation HVAC Controller, Battery-Powered Remote Sensor Node, Medical Device Interface Board
What is the flash memory size of the PIC18LF26K83-I/ML?
The PIC18LF26K83-I/ML integrates 64 KB of on-chip Flash program memory, organized as 32K x 16 words, plus 4 KB of SRAM and 1 KB of EEPROM. According to the Microchip PIC18(L)F25/26K83 datasheet, the Flash supports self-programming under firmware control with block-level erase and write protection. This memory configuration supports C-compiled embedded applications of moderate complexity while leaving room for bootloader firmware.
What core architecture does the PIC18LF26K83-I/ML use and what is its CPU speed?
The PIC18LF26K83-I/ML uses the enhanced PIC18 8-bit RISC Harvard architecture with hardware multiplier, running at up to 64 MHz and delivering 16 MIPS instruction throughput. The separate program and data buses with a 16-bit instruction word allow single-cycle fetches. According to the Microchip datasheet, the internal oscillator is factory-calibrated and supports multiple PLL configurations via OSCTUNE.
Does the PIC18LF26K83-I/ML include a CAN controller?
Yes, the PIC18LF26K83-I/ML integrates a CAN 2.0B controller compliant with ISO 11898-1, supporting both standard 11-bit and extended 29-bit identifiers. The CAN module uses dedicated DMA-capable FIFOs and filtering, enabling deterministic bus arbitration under high bus loads. This makes the part well suited for automotive body, chassis and industrial CAN nodes.
What is the difference between PIC18LF26K83 and PIC18F26K83?
The PIC18LF26K83 is the low-voltage variant operating from 1.8V to 3.6V with XLP nanoWatt technology, while the PIC18F26K83 operates from 2.3V to 5.5V and is FuSa (Functional Safety) classified for safety-critical applications. Both share identical pinout, peripheral set and 28-pin QFN (6x6 mm) package, making the F variant a drop-in upgrade when higher voltage or safety documentation is needed. The F variant is the appropriate choice for IEC 61508 SIL designs.
Where can I buy the PIC18LF26K83-I/ML and what is the current price?
The PIC18LF26K83-I/ML is in stock at major distributors including DigiKey, Mouser, LCSC and Octopart-listed channels as of 2026-09-28. At quantity 1, the unit price is approximately $3.40, dropping to about $1.92 per unit at 1000-piece reels. Lead time is generally 4-8 weeks from authorized distributors, with LCSC offering the lowest entry price at $0.93 per unit on small lots.
What is the lead time for ordering the PIC18LF26K83-I/ML?
The PIC18LF26K83-I/ML ships from DigiKey and Mouser typically within 2-4 weeks in production volumes as of 2026-09-28. Bulk orders above 1000 pieces may extend to 8 weeks depending on factory allocation. LCSC holds spot stock for prototype quantities. Because Microchip's PIC18K83 family is active, the part is unlikely to enter EOL during 2026.
PIC18LF26K83-I/ML vs PIC18LF25K83 - which should I choose?
Choose the PIC18LF26K83-I/ML when you need 64 KB Flash, 4 KB SRAM and 25 ADC channels. Choose the PIC18LF25K83-I/ML (same 28-QFN package, drop-in compatible) when your code fits in 32 KB Flash, since its smaller memory cost is lower. Both parts share the same CAN, I2C, SPI and ADC2 peripheral set, so peripherals are not the deciding factor. For most production runs the F26K83 is the better choice because of the larger Flash headroom.
When should I choose the PIC18LF26K83-I/ML over the PIC18LF26K42?
Choose the PIC18LF26K83-I/ML when your design requires a CAN 2.0B interface or the dedicated ADC2 hardware with CVD for capacitive touch. Choose the newer PIC18LF26K42-I/ML when CAN is unnecessary and you need the latest core-independent peripherals and lower power. Both are 28-pin QFN drop-in compatible, so your PCB layout works for either choice. The K42 part is typically preferred for new designs that do not need CAN.
What is the best drop-in replacement for the PIC18LF26K83-I/ML?
The best drop-in replacements are PIC18F26K83-I/ML (same 28-QFN package, 5V FuSa variant), PIC18LF26K83-E/ML (extended temperature grade), and PIC18LF25K83-I/ML (32 KB Flash version). All three share the 28-pin QFN footprint and pinout of the PIC18LF26K83-I/ML. The F26K83 adds functional safety documentation; the E-grade extends operating range to +125C for harsher environments.
Where can I download the PIC18LF26K83-I/ML datasheet PDF?
The official PIC18LF26K83-I/ML datasheet PDF is hosted by Microchip at the product folder linked above (PIC18(L)F25/26K83 28-Pin Data Sheet). The document covers electrical characteristics, pinout, ADC2 operation, CAN module programming and CIP peripheral configuration. Always reference the latest revision when designing, since silicon revisions may add errata clarifications.
Where can I find the PIC18LF26K83-I/ML pinout and QFN package drawing?
The PIC18LF26K83-I/ML pinout for the 28-pin QFN (6x6 mm) is documented in the manufacturer datasheet and matches the PIC18F26K83 pinout. The package has an exposed thermal pad (EP) on pin 29 which must be soldered to the ground plane for thermal dissipation and electrical reference. The same datasheet provides mechanical dimensions including 0.65 mm pitch and 0.40 mm pad length.
Is the PIC18LF26K83-I/ML RoHS compliant and lead-free?
Yes, the PIC18LF26K83-I/ML is RoHS compliant and lead-free per its Microchip product page. The 28-pin QFN package uses lead-free (SAC) matte tin plating compatible with reflow profiles to J-STD-020 MSL-3. REACH compliance is also confirmed; for halogen-free status consult Microchip's substance declaration documents.
Is the PIC18LF26K83-I/ML suitable for automotive applications?
The standard PIC18LF26K83-I/ML (industrial -40C to +85C) is suitable for non-safety automotive body and chassis applications; however, AEC-Q100 qualified versions are also available in the same family for safety-critical or under-hood designs. For full automotive qualification, look for parts carrying the automotive grade identifier. The CAN 2.0B controller and -40C to +85C range make the -I variant the typical choice for cabin and body ECUs.
What is the difference between PIC18LF26K83-I/ML and PIC18LF26K83-I/SS?
The PIC18LF26K83-I/ML is the 28-pin QFN (6x6 mm) surface-mount package variant, while the PIC18LF26K83-I/SS is the 28-pin SSOP variant. Both share identical silicon, memory, peripherals and pin functions - only the package and pin pitch differ. The /ML variant offers better thermal performance and a smaller PCB footprint, while the /SS variant is easier to hand-prototype and inspect. Choose /ML for volume production where thermal dissipation matters.
What are the key specifications of the PIC18LF26K83-I/ML that engineers should know?
The PIC18LF26K83-I/ML is an 8-bit PIC18 XLP microcontroller in a 28-pin QFN (6x6 mm) package with 64 MHz CPU, 64 KB Flash, 4 KB SRAM, 1 KB EEPROM, 12-bit ADC2 with 25 channels, CAN 2.0B, dual I2C, dual SPI and EUSART. Supply voltage spans 1.8V to 5.5V at -40C to +85C industrial temperature range, with 7 timers, 2 comparators and 2 DMA channels. The device is RoHS compliant, MSL-3 rated and active in Microchip's product lifecycle. These specifications make it a strong fit for CAN-connected industrial and automotive body applications.

Engineering reference data for PIC18LF26K83-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC18LF26K83-I/ML when your design requires an integrated CAN 2.0B controller plus 64 KB of Flash and 4 KB of SRAM in a compact 28-QFN package. Pick the PIC18F26K83-I/ML if you need 5V operation or Functional Safety documentation. Pick the PIC18LF26K83-E/ML when ambient temperature may exceed 85C. Pick the PIC18LF25K83-I/ML to save cost when 32 KB Flash is sufficient. Pick the PIC18LF26K42-I/ML for new designs without CAN that benefit from the newer-generation CIPs. All five alternatives share the same 28-QFN (6x6 mm) footprint and pinout, so the PCB layout can be reused across your product family.

Comparison with Alternatives

Parameter This Product PIC18F26K83-I/ML PIC18LF26K83-E/ML PIC18LF25K83-I/ML PIC18LF26K83-I/MX PIC18LF26K42-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same
Flash Memory 64 KB 64 KB 64 KB 32 KB 64 KB 64 KB
SRAM 4 KB 4 KB 4 KB 2 KB 4 KB 4 KB
EEPROM 1 KB 1 KB 1 KB 1 KB 1 KB 1 KB
Supply Voltage 1.8V to 5.5V 2.3V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V
Operating Temperature -40C to +85C -40C to +85C -40C to +125C -40C to +85C -40C to +85C -40C to +85C
CAN Module Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) No
Functional Safety (FuSa) No Yes No No No No

Key Differentiators

  • Larger Flash than PIC18LF25K83 sibling (vs PIC18LF25K83-I/ML)
  • 5V FuSa upgrade path available (vs PIC18F26K83-I/ML)
  • CAN 2.0B vs newer K42 family (vs PIC18LF26K42-I/ML)
  • Extended temperature option (vs PIC18LF26K83-E/ML)

Design Notes

Estimated: at 64 MHz CPU clock and full peripheral activity, core current is approximately 15 mA at 3.3V. Add a 100 nF ceramic bypass within 2 mm of each VDD/VSS pair plus a 10 uF bulk capacitor near the supply pin to suppress transient dips. For CAN bus nodes add a TVS diode (PESD1CAN) on the bus lines to meet IEC 61000-4-2 ESD. Use an MCP1700 LDO if the upstream rail exceeds 5.5V, since the absolute maximum on VDD is 6.5V.

Estimated: with VDD = 3.3V, CPU active at 64 MHz and all peripherals enabled, the part dissipates around 50 mW which produces a negligible junction temperature rise in the 28-QFN package (theta_JA approximately 35 C/W on a 4-layer JEDEC test board). Solder the exposed thermal pad (pin 29) to a continuous ground copper pour of at least 25 mm squared for optimal thermal spreading. Avoid placing heat-generating components within 3 mm of the package to keep the local ambient gradient small.

Route the CAN bus with 120 ohm differential impedance using matched length traces; keep total stub length below 5 mm. Place the CAN transceiver (MCP2551) within 10 mm of the PIC18LF26K83-I/ML CANTX and CANRX pins to avoid reflections. Add a 120 ohm termination resistor at each end of the bus; do not place stubs beyond the termination. Use a 4-layer stackup with continuous ground plane under the QFN exposed pad for best EMC performance.

Do not leave the ICSPDAT/ICSPCLK pins floating during normal operation; Microchip recommends 4.7 kohm pull-ups on PGECx/PGEDx for in-circuit serial programming. If the ADC2 CVD feature is used for capacitive touch, ensure the guard-ring trace is driven by an independent peripheral (CLC or PWM) and not a software-toggled GPIO to avoid scan jitter. Verify the configuration bits using the MCC-generated header to prevent accidental code protection.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free confirmed by Microchip product page. Halogen-free status consult Microchip substance declaration. Standard -I grade is not AEC-Q100 qualified; AEC-Q100 grades are available separately in the same family. REACH compliance per Microchip statement.

Data verified on: 2026-09-28 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC18LF26K83 PIC18LF26K83-I/ML PIC18F26K83-I/ML PIC18LF25K83-I/ML PIC18LF26K42-I/ML PIC18 family 8-bit microcontroller PIC18 XLP CAN 2.0B ADC2 Capacitive Voltage Divider (CVD) QFN-28 RoHS REACH MSL-3 J-STD-020 FuSa Functional Safety LIN EUSART DMA CLC (Configurable Logic Cell) NCO (Numerically Controlled Oscillator) automotive body control industrial CAN node capacitive touch HVAC controller
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