PIC18LF66K40-I/MR - 64KB Flash 8-Bit MCU 64MHz XLP | Microchip
Référence : PIC18LF66K40-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.4 | $4,40 |
| 10 | $3.96 | $39,60 |
| 100 | $3.52 | $352,00 |
| 500 | $3.17 | $1 585,00 |
| 1 000 | $2.81 | $2 810,00 |
PIC18LF66K40-I/MR Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that fetches, decodes, and executes instructions 8 bits at a time, optimized for deterministic real-time control with predictable interrupt latency. Within the broader taxonomy, the PIC18LF66K40 sits in the hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The LF prefix denotes the low-voltage process variant (1.8V to 3.6V) optimized for XLP operation, distinguishing it from the F variant (2.3V to 5.5V) which trades low-voltage flexibility for higher 5V tolerance.
Key features include 60 I/O pins with 25mA source/sink per pin, integrated ECAN bus controller supporting CAN 2.0B, Signal Measurement Timer (SMT), Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), and Data Signal Modulator (DSM). XLP technology delivers nanoWatt sleep modes with typical currents in the nanoamp range, dramatically extending battery life in power-constrained applications. The device also supports up to four 16-bit PWM outputs, multiple UART/SPI/I2C interfaces, and hardware CRC for memory integrity.
Architecturally, the PIC18LF66K40 uses an enhanced Harvard RISC core with a hardware multiplier, 31-level deep stack, and vectored interrupt controller. The integrated CIPs (Configurable Logic Cells, CWG, NCO, DSM) allow autonomous peripheral operation without CPU intervention, offloading tasks such as waveform generation, signal conditioning, and frequency synthesis to dedicated hardware. This frees the CPU for application-level processing and reduces firmware complexity.
Typical applications include industrial sensor nodes, IoT edge devices, battery-powered instrumentation, CAN bus nodes, HVAC controls, white goods, and small appliances. The wide peripheral set and XLP technology make it well-suited for any application requiring long battery life combined with rich connectivity.
When designing with this MCU, ensure the VQFN exposed pad is soldered to a sufficient copper pour for thermal dissipation and electrical grounding. For ECAN applications, a CAN transceiver IC (such as MCP2551 or MCP2562) is required between the MCU and the physical bus. Decoupling capacitors must be placed as close as possible to all VDD/VSS pairs, and unused I/O pins should be configured as outputs low to minimize leakage.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that supplement - but do not replace - the manufacturer datasheet.
Alternatives de remplacement direct pour PIC18LF66K40-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF66K40-I/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Program Memory (Flash), Core Architecture, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F66K40-I/MR
✅ Remplacement direct✓ En stock
$2.68 / unité
Voir la fiche technique →PIC18LF66K40-E/MR
✅ Remplacement direct✓ En stock
$2.65 / unité
Voir la fiche technique →PIC18LF67K40-I/MR
✅ Remplacement direct✓ En stock
$3.3 / unité
Voir la fiche technique →PIC18LF65K40-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F65K80-I/MR
✅ Remplacement direct✓ En stock
$3.12 / unité
Voir la fiche technique →PIC18LF66K40-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 8-bit RISC (Enhanced Harvard) |
| Program Memory (Flash) | 64 KB (32K x 16 words) |
| Data RAM | 3.56 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Clock | 64 MHz |
| Operating Voltage Range (LF) | 1.8 V to 3.6 V |
| Number of I/O Pins | 60 |
| ADC | 10-bit, up to 47 channels (ADC with Computation) |
| CAN | ECAN (CAN 2.0B active) |
| I/O Source/Sink Current | 25 mA per pin |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount (SMD/SMT) |
| Température de fonctionnement | -40C to +85C (Industrial, -I suffix) |
| XLP Sleep Current | nanoWatt range (see datasheet for exact figure) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
| Lead-Free | Yes |
| Core Independent Peripherals | CLC, CWG, NCO, DSM, SMT, CRC/SCAN |
| Communication Interfaces | UART, SPI, I2C, ECAN |
Configuration des broches de PIC18LF66K40-I/MR
| Broche 1 | RA0 — Bidirectional I/O, analog input |
| Broche 2 | RA1 — Bidirectional I/O, analog input |
| Broche 3 | RA2 — Bidirectional I/O, analog input |
| Broche 4 | RA3 — Bidirectional I/O, analog input |
| Broche 5 | RA4 — Bidirectional I/O, analog input |
| Broche 6 | RA5 — Bidirectional I/O, analog input |
| Broche 7 | RA6 — Bidirectional I/O, oscillator output |
| Broche 8 | RA7 — Bidirectional I/O, oscillator input |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VDD — Positive supply voltage |
| Broche 11 | RB0 — Bidirectional I/O, interrupt-on-change |
| Broche 12 | RB1 — Bidirectional I/O, interrupt-on-change |
| Broche 13 | RB2 — Bidirectional I/O, interrupt-on-change |
| Broche 14 | RB3 — Bidirectional I/O, interrupt-on-change |
| Broche 15 | RB4 — Bidirectional I/O, interrupt-on-change |
| Broche 16 | RB5 — Bidirectional I/O, interrupt-on-change |
| Broche 17 | RB6 — Bidirectional I/O, ICD clock |
| Broche 18 | RB7 — Bidirectional I/O, ICD data |
| Broche 19 | RC0 — Bidirectional I/O |
| Broche 20 | RC1 — Bidirectional I/O |
| Broche 21 | RC2 — Bidirectional I/O |
| Broche 22 | RC3 — Bidirectional I/O |
| Broche 23 | RC4 — Bidirectional I/O |
| Broche 24 | RC5 — Bidirectional I/O |
| Broche 25 | RC6 — Bidirectional I/O, UART TX |
| Broche 26 | RC7 — Bidirectional I/O, UART RX |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply voltage |
| Broche 29 | RD0 — Bidirectional I/O |
| Broche 30 | RD1 — Bidirectional I/O |
| Broche 31 | RD2 — Bidirectional I/O |
| Broche 32 | RD3 — Bidirectional I/O |
| Broche 33 | RD4 — Bidirectional I/O |
| Broche 34 | RD5 — Bidirectional I/O |
| Broche 35 | RD6 — Bidirectional I/O |
| Broche 36 | RD7 — Bidirectional I/O |
| Broche 37 | VSS — Ground reference |
| Broche 38 | VDD — Positive supply voltage |
| Broche 39 | RE0 — Bidirectional I/O |
| Broche 40 | RE1 — Bidirectional I/O |
| Broche 41 | RE2 — Bidirectional I/O |
| Broche 42 | RE3 — Bidirectional I/O |
| Broche 43 | RE4 — Bidirectional I/O |
| Broche 44 | RE5 — Bidirectional I/O |
| Broche 45 | RE6 — Bidirectional I/O |
| Broche 46 | RE7 — Bidirectional I/O |
| Broche 47 | RF0 — Bidirectional I/O |
| Broche 48 | RF1 — Bidirectional I/O |
| Broche 49 | RF2 — Bidirectional I/O |
| Broche 50 | RF3 — Bidirectional I/O |
| Broche 51 | RF4 — Bidirectional I/O |
| Broche 52 | RF5 — Bidirectional I/O |
| Broche 53 | RF6 — Bidirectional I/O |
| Broche 54 | RF7 — Bidirectional I/O |
| Broche 55 | RG0 — Bidirectional I/O |
| Broche 56 | RG1 — Bidirectional I/O |
| Broche 57 | RG2 — Bidirectional I/O |
| Broche 58 | RG3 — Bidirectional I/O |
| Broche 59 | RG4 — Bidirectional I/O |
| Broche 60 | MCLR — Master clear reset (active low) |
| Broche 61 | VSS — Ground reference |
| Broche 62 | VDD — Positive supply voltage |
| Broche 63 | OSC1 — Crystal/clock input |
| Broche 64 | OSC2 — Crystal/clock output |
Applications typiques
PIC18LF66K40-I/MR convient pour 6 applications: Industrial Sensor Nodes with CAN Bus, Battery-Powered IoT Edge Devices, HVAC and Building Automation Controllers, Automotive Body and Interior Modules, Portable Medical and Health Monitoring Devices, White Goods and Small Appliance Controls.
Industrial Sensor Nodes with CAN Bus
The PIC18LF66K40-I/MR is ideal for industrial sensor nodes communicating over CAN bus networks. Its integrated ECAN controller supporting CAN 2.0B active handles standard (11-bit) and extended (29-bit) identifiers at up to 1 Mbps, eliminating the need for an external CAN controller IC. The 64KB Flash stores sensor calibration tables and protocol stacks, while the 1.8V-3.6V operating range supports direct 3.3V operation from industrial 24V rails after regulation. Combined with XLP nanoWatt sleep modes, the device enables multi-year battery life for remote wireless sensor nodes that wake periodically to transmit CAN data via an attached transceiver like the MCP2562.
Recommandé
Battery-Powered IoT Edge Devices
The PIC18LF66K40-I/MR excels in battery-powered IoT edge devices where energy efficiency is paramount. The LF process variant operates down to 1.8V, enabling direct connection to single-cell lithium (Li-FeS2 or Li-MnO2) or 2x AA/AAA alkaline batteries without boost conversion, eliminating quiescent current loss from a switching regulator. XLP nanoWatt sleep modes reduce idle current to the nanoamp range, allowing the MCU to wake on timer, interrupt, or external event and process sensor data with the 10-bit ADC with computation. The integrated Core Independent Peripherals (CLC, CWG, NCO) handle waveform generation and signal conditioning without CPU intervention, further minimizing active time and extending battery life to multiple years on a single coin cell.
Recommandé
HVAC and Building Automation Controllers
The PIC18LF66K40-I/MR is well-suited for HVAC and building automation controllers that demand robust peripheral integration and CAN/LIN connectivity. The 60 I/O pins accommodate multiple sensor inputs (temperature, humidity, pressure via the 10-bit ADC), actuator outputs (PWM for fan/blower speed control), and communication interfaces (UART, SPI, I2C, ECAN) for building network integration. The 64KB Flash supports complex control algorithms including PID loops and scheduling firmware, while the hardware CRC/SCAN module ensures memory integrity in long-lifecycle installations. The 64-pin VQFN (9x9 mm) package with exposed thermal pad handles thermal dissipation in enclosed control boxes.
Recommandé
Automotive Body and Interior Modules
The PIC18LF66K40-I/MR (or its automotive-grade equivalent PIC18LF66K40-E/MR with -40C to +125C rating) fits automotive body and interior modules such as seat controllers, mirror adjusters, ambient lighting, and HVAC panels. The integrated ECAN connects to vehicle CAN buses for diagnostics and inter-module communication, while the 25mA I/O source/sink drives LEDs and small relays directly without external drivers. The 1.8V-3.6V LF range operates from typical automotive 3.3V rails; for 5V systems, the PIC18F66K40-I/MR variant is preferred. The 64KB Flash stores application firmware plus bootloader for OTA updates.
Recommandé
Portable Medical and Health Monitoring Devices
The PIC18LF66K40-I/MR supports portable medical and health monitoring devices where low power consumption, reliability, and analog precision are critical. The 10-bit ADC with computation performs on-chip averaging, oversampling, and threshold detection for biosensor signals (pulse oximetry, glucose, temperature) without CPU overhead. XLP sleep modes enable continuous monitoring with multi-day battery life on a single CR2032 coin cell. The integrated ECAN or UART interfaces connect to wireless modules (BLE, Sub-GHz) for transmitting data to mobile apps or hospital networks. The 64KB Flash accommodates firmware with security features and calibration data.
Recommandé
White Goods and Small Appliance Controls
The PIC18LF66K40-I/MR is ideal for white goods and small appliance controls such as washing machines, dishwashers, refrigerators, microwave ovens, and coffee machines. The 60 I/O pins drive user interfaces (LEDs, LCD segments, buttons, rotary encoders) and appliance actuators (PWM-controlled motors, solenoids, relays). The 64KB Flash supports feature-rich firmware with multiple cooking/wash cycles, while the hardware CRC and WWDT ensure reliability in noisy appliance environments. The integrated ECAN or UART enables connectivity to smart-home hubs and IoT platforms. The LF voltage range (1.8V-3.6V) suits battery-backed clock and memory retention modes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF66K40-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F66K40-I/MR | PIC18LF66K40-E/MR | PIC18LF67K40-I/MR | PIC18LF65K40-I/MR | PIC18F65K80-I/MR |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB | 32 KB | 32 KB |
| Operating Voltage | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| CAN Module | ECAN (CAN 2.0B) | ECAN (CAN 2.0B) | ECAN (CAN 2.0B) | ECAN (CAN 2.0B) | ECAN (CAN 2.0B) | ECAN (CAN 2.0B) |
| Generation / CIP Set | K40 family (CLC, CWG, NCO, DSM, SMT) | K40 family (same CIPs) | K40 family (same CIPs) | K40 family (same CIPs) | K40 family (same CIPs) | K80 family (older, fewer CIPs) |
| Approx. Price (qty 100) | $3.52 | $3.52 | $4.10 | $4.80 | $3.20 | $3.40 |
Principaux différenciateurs
- Lower voltage operation for direct battery connection (vs PIC18F66K40-I/MR)
- Larger flash memory within the same VQFN-64 footprint (vs PIC18LF65K40-I/MR)
- Modern K40 Core Independent Peripherals vs older K80 CIP set (vs PIC18F65K80-I/MR)
Notes de conception
Solder the VQFN exposed thermal pad (EP) to a continuous ground copper pour of at least 1 square inch on the top and bottom PCB layers, connected via multiple thermal vias (typically 9-16 vias of 0.3mm drill on a 1.0mm pitch). This provides both electrical grounding and thermal dissipation for the 64-pin VQFN (9x9 mm) package. Place all VDD/VSS pairs with 0.1uF ceramic decoupling capacitors as close as possible (within 2mm) to the respective pins.
For CAN bus applications, add a separate CAN transceiver IC (such as Microchip MCP2551, MCP2561, or MCP2562) between the PIC18LF66K40 ECAN pins (CANTX/CANRX) and the physical bus. The ECAN module is a protocol controller only and cannot drive the bus directly. Ensure the transceiver VDD matches the MCU VDD (3.3V for the LF variant). Add proper bus termination (120 ohm at each end of the bus) and common-mode chokes for EMI-sensitive installations.
Do not confuse the LF (low-voltage, 1.8V-3.6V) variant with the F (full-voltage, 2.3V-5.5V) variant. Connecting 5V to an LF device will damage it. Also, the MCLR pin requires proper handling - either tie to VDD through a 10k resistor for normal operation or use a momentary push-button for manual reset. For ICSP programming, ensure the PGC/PGD pins (RB6/RB7) are not loaded with heavy capacitance that prevents in-circuit programming.
Keep the crystal/oscillator traces (OSC1/OSC2) short and surrounded by a ground guard ring to minimize EMI coupling. If using an external crystal, place load capacitors (typically 15-33 pF) close to the MCU pins. For high-frequency 64 MHz operation, avoid routing signal traces under or near the crystal traces to prevent injection of clock harmonics into sensitive analog circuits such as the ADC inputs.
Estimated: at maximum CPU activity (64 MHz, all peripherals active) and 3.3V VDD, the PIC18LF66K40-I/MR typically draws approximately 15-20 mA, dissipating about 50-66 mW. With the VQFN-64 (9x9 mm) package thermal resistance of approximately 28 C/W (4-layer PCB with thermal vias), the junction-to-ambient temperature rise is roughly 1.4-1.9 C above ambient. Verify thermal performance with actual PCB layout using the Microchip thermal management application note.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Standard PIC18LF66K40-I/MR is not AEC-Q100 qualified - for automotive applications requiring AEC-Q100, contact Microchip for qualified part numbers. The -E suffix (extended temperature) is not equivalent to automotive qualification.
