PIC24EP512GP206-E/MR - 16-Bit 60 MIPS MCU 512KB Flash | Microchip
Référence : PIC24EP512GP206-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.95 | $69,50 |
| 100 | $6.18 | $618,00 |
| 500 | $5.62 | $2 810,00 |
| 1 000 | $4.97 | $4 970,00 |
PIC24EP512GP206-E/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals such as timers, ADC, communication interfaces, and GPIO into one package. In the taxonomy of embedded computing, the PIC24EP sits within the digital signal controller / 16-bit MCU category, bridging traditional 8-bit microcontrollers and more powerful 32-bit Cortex-M parts. Its modified Harvard architecture, separate program and data buses, and DSP-class instructions make it suitable for control loops and signal conditioning tasks that exceed the capabilities of simpler MCUs while retaining the deterministic interrupt response of a single-cycle instruction MCU.
Key features include 60 MIPS (70 MHz) core performance, two 12-bit ADC modules with up to 16 channels, four analog comparators with op-amp support, multiple UART/SPI/I2C peripherals, five 16-bit timers, a charge time measurement unit (CTMU) for capacitive touch and current measurement, and a Peripheral Trigger Generator that coordinates peripheral timing without CPU intervention. The 512 KB Flash supports self-programming and live updates for field-deployed products, while 24 KB SRAM accommodates protocol stacks, audio buffers, or sensor fusion state.
Typical applications include industrial motor control, multi-loop PID control systems, automotive body electronics and sensor fusion nodes, medical instrumentation signal chains, point-of-load converter digital controllers, and graphed HMI panels with capacitive touch. The wide operating temperature range (-40C to +125C) and AEC-Q100 grade designation make the part suitable for safety-conscious industrial and automotive designs.
When designing with this part, allocate sufficient decoupling (100 nF ceramic + 10 uF bulk near each VDD/AVDD pair), respect the 64-VQFN thermal pad soldering profile (peak reflow 260C per JEDEC J-STD-020), and use Microchip's MPLAB X IDE with the XC16 compiler for code development. Production programming should use ICSP or the JTAG boundary-scan interface documented in the device datasheet family guide.
Alternatives de remplacement direct pour PIC24EP512GP206-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP512GP206-E/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Core Architecture, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP512GP206T-E/MR
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC24EP512GP806-E/MR
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC24EP512MC206-E/MR
✅ Remplacement direct✓ En stock
$6.18 / unité
Voir la fiche technique →PIC24EP256GP206-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP256MC206-I/MR
✅ Remplacement direct✓ En stock
$6.39 / unité
Voir la fiche technique →PIC24EP512GP206-E/MR Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Product Family | PIC24EP |
| Core | PIC 16-bit MCU |
| Maximum CPU Speed | 60 MIPS (70 MHz) |
| Program Memory (Flash) | 512 KB (170K x 24) |
| Data Memory (SRAM) | 24 KB (12K x 16) |
| Operating Voltage Range | 3.0 V to 3.6 V |
| I/O Pins | 53 |
| Boîtier | 64-VQFN (9x9 mm) with exposed pad |
| Température de fonctionnement | -40C to +125C (extended, -E suffix) |
| AEC-Q100 Qualified | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24EP512GP206-E/MR
| Broche 1 | OSCI — Oscillator crystal input (or external clock) |
| Broche 2 | OSCO — Oscillator crystal output |
| Broche 3 | VSS — Digital ground |
| Broche 4 | PGEC1 — ICSP programming clock 1 |
| Broche 5 | PGED1 — ICSP programming data 1 |
| Broche 6 | VDD — Digital supply 3.3V |
| Broche 7 | RB0 — GPIO/AN0/PGED2 |
| Broche 8 | RB1 — GPIO/AN1/PGEC2 |
| Broche 9 | RB2 — GPIO/AN2 |
| Broche 10 | RB3 — GPIO/AN3 |
| Broche 11 | RB4 — GPIO/AN4 |
| Broche 12 | RB5 — GPIO/AN5 |
| Broche 13 | RB6 — GPIO/AN6/PGC3 |
| Broche 14 | RB7 — GPIO/AN7/PGD3 |
| Broche 15 | RB8 — GPIO/AN8 |
| Broche 16 | RB9 — GPIO/AN9 |
| Broche 17 | RB10 — GPIO/AN10 |
| Broche 18 | RB11 — GPIO/AN11 |
| Broche 19 | RB12 — GPIO/AN12 |
| Broche 20 | RB13 — GPIO/AN13 |
| Broche 21 | RB14 — GPIO/AN14 |
| Broche 22 | RB15 — GPIO/AN15 |
| Broche 23 | VSS — Digital ground |
| Broche 24 | VDD — Digital supply 3.3V |
| Broche 25 | RC1 — GPIO/T1CK |
| Broche 26 | RC2 — GPIO/AN17 |
| Broche 27 | RC3 — GPIO/AN18 |
| Broche 28 | RC4 — GPIO/AN19 |
| Broche 29 | AVDD — Analog supply 3.3V |
| Broche 30 | AVSS — Analog ground |
| Broche 31 | RC5 — GPIO/AN20 |
| Broche 32 | RC6 — GPIO/AN21 |
| Broche 33 | RC7 — GPIO/AN22 |
| Broche 34 | RC8 — GPIO/AN23 |
| Broche 35 | RC9 — GPIO |
| Broche 36 | RC10 — GPIO |
| Broche 37 | RC11 — GPIO |
| Broche 38 | RC12 — GPIO |
| Broche 39 | RC13 — GPIO |
| Broche 40 | RC14 — GPIO |
| Broche 41 | RC15 — GPIO |
| Broche 42 | RD0 — GPIO |
| Broche 43 | RD1 — GPIO |
| Broche 44 | RD2 — GPIO |
| Broche 45 | RD3 — GPIO |
| Broche 46 | RD4 — GPIO |
| Broche 47 | RD5 — GPIO |
| Broche 48 | RD6 — GPIO |
| Broche 49 | RD7 — GPIO |
| Broche 50 | RD8 — GPIO |
| Broche 51 | RD9 — GPIO |
| Broche 52 | RD10 — GPIO |
| Broche 53 | RD11 — GPIO |
| Broche 54 | RD12 — GPIO |
| Broche 55 | RD13 — GPIO |
| Broche 56 | RD14 — GPIO |
| Broche 57 | RD15 — GPIO |
| Broche 58 | VSS — Digital ground |
| Broche 59 | RF0 — GPIO |
| Broche 60 | RF1 — GPIO |
| Broche 61 | RF3 — GPIO |
| Broche 62 | RF4 — GPIO |
| Broche 63 | RF5 — GPIO |
| Broche 64 | VDD — Digital supply 3.3V |
Applications typiques
PIC24EP512GP206-E/MR convient pour 6 applications: Industrial Motor Control, Automotive Body Electronics, Medical Instrumentation Signal Chain, Industrial Sensor Fusion Hubs, Digital Power Converter Control, HMI Panels with Capacitive Touch.
Industrial Motor Control
The PIC24EP512GP206-E/MR is purpose-built for industrial motor control loops, where its 60 MIPS DSP-class core executes FOC (field-oriented control) and PID routines at sub-100 microsecond loop times. With five 16-bit timers, multiple PWM channels, op amps for current sensing, and 12-bit ADC, the part directly samples phase currents and commutates three-phase BLDC or PMSM motors. The 512 KB Flash stores commutation tables and field-weakening profiles, while the 24 KB SRAM buffers real-time telemetry. AEC-Q100 qualification plus -40C to +125C range suit industrial drive cabinets.
Recommandé
Automotive Body Electronics
In automotive body ECUs (door modules, lighting controllers, climate control), the PIC24EP512GP206-E/MR combines AEC-Q100 qualification, -40C to +125C extended temperature range, and high immunity to automotive electrical noise. The 53 GPIO pins multiplex body-domain loads (lamp drivers, mirror actuators, switch inputs), while the CTMU handles capacitive touch keys. CAN-FD or LIN connectivity is supported via dedicated peripherals, and the 512 KB Flash allows over-the-air firmware updates with rollback safety. Compared to discrete logic, integrating control on one MCU shrinks the PCB and BOM.
Recommandé
Medical Instrumentation Signal Chain
Patient monitoring devices such as pulse oximeters, blood-pressure monitors, and infusion pumps benefit from the PIC24EP512GP206-E/MR's combination of DSP instructions, 12-bit ADC, op amps, and accurate timers. The 60 MIPS core performs real-time digital filtering (FIR/IIR) on biosignals without offloading to a separate DSP. The 24 KB SRAM holds moving-average buffers and waveform templates, while the 512 KB Flash stores patient logs. The extended temperature grade supports battery-warmed enclosures during cold-weather operation in portable diagnostic kits.
Recommandé
Industrial Sensor Fusion Hubs
Industrial sensor fusion nodes aggregate data from accelerometers, gyros, pressure sensors, and temperature probes; the PIC24EP512GP206-E/MR's 60 MIPS core and DSP extensions execute complementary filters, Kalman filters, and time-of-flight calculations. The CTMU measures capacitance for proximity sensing, and the 53 I/O pins interface multiple SPI/I2C sensors. The 24 KB SRAM holds a state vector for multi-sensor fusion, while 512 KB Flash stores sensor calibration tables. -40C to +125C operation supports outdoor industrial and automotive environments.
Recommandé
Digital Power Converter Control
Point-of-load converters, digital controllers for solar inverters, and telecom rectifiers benefit from the PIC24EP512GP206-E/MR's high-resolution PWM and fast ADC. The 60 MIPS DSP core implements voltage-mode and current-mode control loops with sub-microsecond resolution. Op amps inside the MCU condition current-sense signals directly, eliminating external amplifiers. The 512 KB Flash stores firmware for multiple converter topologies, and the 24 KB SRAM holds real-time telemetry. AEC-Q100 qualification supports rugged industrial and telecom environments.
Recommandé
HMI Panels with Capacitive Touch
Industrial and appliance HMI panels with graphical displays and capacitive touch use the PIC24EP512GP206-E/MR for integrated control plus touch sensing. The CTMU measures capacitive touch button matrices, the Peripheral Trigger Generator (PTG) coordinates display refresh and touch sampling without CPU load, and the 53 GPIO pins drive character LCD or small TFT displays. The 512 KB Flash stores multilingual UI assets, and the 24 KB SRAM holds touch filtering state. Extended temperature grade suits appliance front-panel applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP512GP206-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP512GP206T-E/MR | PIC24EP512GP806-E/MR | PIC24EP512MC206-E/MR | PIC24EP256GP206-I/MR | PIC24EP256MC206-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 24 KB | 24 KB | 24 KB | 24 KB | 24 KB | 24 KB |
| CPU Speed | 60 MIPS / 70 MHz | 60 MIPS / 70 MHz | 60 MIPS / 70 MHz | 60 MIPS / 70 MHz | 60 MIPS / 70 MHz | 60 MIPS / 70 MHz |
| Operating Temperature | -40C to +125C (extended, -E) | -40C to +125C (extended) | -40C to +125C (extended) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Motor-Control Peripherals | Standard GP peripherals | Standard GP peripherals | Standard + CAN-FD | Enhanced PWM + PTG for motor control | Standard GP peripherals | Enhanced PWM + PTG for motor control |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Highest-density 512 KB Flash in the PIC24EP /MR 64-VQFN family (vs PIC24EP256GP206-I/MR)
- Extended -40C to +125C automotive grade with AEC-Q100 qualification (vs PIC24EP256MC206-I/MR)
- DSP-class core with built-in op amps and CTMU (vs PIC24EP512GP806-E/MR)
Notes de conception
Estimated: at 60 MHz core frequency and 3.3V supply, the typical active current for the PIC24EP512GP206 is roughly 40-50 mA. Place a 100 nF X7R ceramic decoupling capacitor within 5 mm of every VDD pin, plus a 10 uF bulk capacitor near the package supply entry. Add a ferrite bead or pi-filter on AVDD to isolate analog supply noise from digital switching transients, achieving ADC SNR near the datasheet floor.
The 64-VQFN (9x9 mm) exposed thermal pad MUST be soldered to a continuous ground pour for heat dissipation and electrical grounding. Microchip recommends at least 16 thermal vias in a 4x4 array connecting the pad to internal ground planes. Without proper thermal pad soldering, junction temperature can climb 30-40C above ambient, potentially triggering thermal shutdown at high ambient temperatures near +125C.
Route the crystal traces (OSCI/OSCO) as short as possible, ideally under 10 mm, and guard them with a ground ring to minimize EMI pickup. Place the 33 pF loading capacitors (typical for 20 MHz crystal) within 2 mm of the MCU pins. For high-speed analog signals, isolate the analog ground island (AVSS) and stitch it to digital ground at a single point under the MCU to avoid ground-loop noise coupling into ADC inputs.
The configuration bits (FOSC, FWDT, FICD) MUST be programmed before the first firmware execution, or the MCU may remain in an undefined state with no code execution. Use MPLAB X IDE's Configuration Bits window or the #pragma config directives in the XC16 compiler source files. Also, remember to set the JTAG TMS/TCK pin remapping via the JTAGEN configuration bit if JTAG boundary-scan is not used, otherwise JTAG pins remain locked from GPIO access.
Informations de conformité
AEC-Q100 qualified per Onlinecomponents product description. RoHS compliant and lead-free per Microchip product page. Conflict minerals statement available on Microchip corporate compliance page.
