PIC24EP512GP206T-E/MR - 60 MIPS 512KB Flash 16-bit MCU | Microchip
MPN: PIC24EP512GP206T-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $9.2 | $92.00 |
| 100 | $8.45 | $845.00 |
| 500 | $7.6 | $3,800.00 |
| 1,000 | $6.95 | $6,950.00 |
PIC24EP512GP206T-E/MR Overview
A 16-bit microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (ADC, PWM, timers, communication interfaces) onto a single silicon die. Within the MCU taxonomy, the PIC24EP sits as a 16-bit general-purpose device - above 8-bit PIC16/PIC18 in performance and DSP capability but below 32-bit PIC32 in raw throughput. The 16-bit data path enables efficient C-compiled code for signal processing, motor control, and complex state machines.
Key features include a 10-bit ADC with up to 16 channels, a 12-bit ADC option, dual analog comparators, operational amplifiers, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, a Peripheral Trigger Generator (PTG) for hardware-level peripheral sequencing, DMA controllers, and high-speed PWM modules suitable for power conversion and motor drive. The AEC-Q100 qualification confirms its suitability for automotive environments.
The PIC24EP512GP206T-E/MR uses a modified Harvard architecture with separate program and data buses, allowing simultaneous instruction fetch and data access. This design, combined with the 70 MIPS-capable core, gives superior code density and deterministic interrupt response critical for real-time control loops.
Typical applications include industrial motor control (BLDC, PMSM, stepper), automotive body and chassis ECUs, power-conversion digital control, sensor fusion systems, and IoT edge nodes. The automotive temperature grade (E suffix) supports -40 C to +125 C operation.
When designing with this part, allocate decoupling capacitors within 3 mm of every VDD/VSS pair, bond the exposed thermal pad to a continuous ground pour for thermal relief, and reserve the ICSP/PGECx/PGEDx pins for in-circuit programming and debugging.
This page synthesizes distributor pricing, AEC-Q100 automotive drop-in alternatives, and practical PCB layout notes not found in the bare datasheet summary.
Drop-in alternatives for PIC24EP512GP206T-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24EP512GP206T-E/MR (same form factor and footprint) — differing in Operating Temperature, Package, ADC, Core Architecture, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24EP512GP206-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP512GP206-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP256MC206-I/MR
✅ Drop-In✓ In Stock
$6.39 / Unit
View Datasheet →PIC24EP256GP206-I/PT
✅ Drop-In✓ In Stock
$4.41 / Unit
View Datasheet →PIC24EP128MC206T-E/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.85 / Unit
View Datasheet →PIC24EP128MC206-E/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.22 / Unit
View Datasheet →PIC24EP512GP206T-E/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC 16-bit Modified Harvard |
| Family | PIC24EP (PIC24E general-purpose) |
| Maximum CPU Speed | 60 MIPS (70 MIPS capable core) |
| Program Memory (Flash) | 512 KB (170K x 24) |
| RAM | 48 KB (24K x 16) |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Package | 64-pin VQFN (9x9 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +125 C (Automotive E grade) |
| AEC-Q100 | Qualified (Automotive Grade) |
| ADC | 10/12-bit, up to 16 channels |
| Analog Comparators | 2 |
| Op Amps | Yes (internal) |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| DMA | Yes |
| PWM | High-Speed PWM outputs |
| RoHS Status | Compliant |
PIC24EP512GP206T-E/MR Pin Configuration
| Pin 1 | RP15/PWM3H/AN15 — Remappable I/O, PWM output, analog input |
| Pin 2 | VDD — Power supply (3.3 V) |
| Pin 3 | RP14/PWM2H/AN14 — Remappable I/O, PWM output, analog input |
| Pin 4 | RP13/AN13/CMP3 — Remappable I/O, analog input, comparator |
| Pin 5 | RP12/AN12/CMP2 — Remappable I/O, analog input, comparator |
| Pin 6 | RP11/AN11/CMP1 — Remappable I/O, analog input, comparator |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RP10/AN10 — Remappable I/O, analog input |
| Pin 9 | RP9/AN9 — Remappable I/O, analog input |
| Pin 10 | RP8/AN8 — Remappable I/O, analog input |
| Pin 11 | RP7/AN7 — Remappable I/O, analog input |
| Pin 12 | RP6/AN6 — Remappable I/O, analog input |
| Pin 13 | RP5/AN5 — Remappable I/O, analog input |
| Pin 14 | RP4/AN4 — Remappable I/O, analog input |
| Pin 15 | RP3/AN3 — Remappable I/O, analog input |
| Pin 16 | RP2/AN2 — Remappable I/O, analog input |
| Pin 17 | RP1/AN1 — Remappable I/O, analog input |
| Pin 18 | RP0/AN0 — Remappable I/O, analog input |
| Pin 19 | VDD — Power supply (3.3 V) |
| Pin 20 | VSS — Ground reference |
| Pin 21 | OSCI/RC12 — Crystal oscillator input or remappable I/O |
| Pin 22 | OSCO/RC15 — Crystal oscillator output or remappable I/O |
| Pin 23 | SOSCO/T1CK/RP21 — Secondary oscillator or timer clock input |
| Pin 24 | SOSCI/RP20 — Secondary oscillator input |
| Pin 25 | PGEC1/AN21 — ICSP programming clock, analog input |
| Pin 26 | PGED1/AN20 — ICSP programming data, analog input |
| Pin 27 | PGEC2/AN19 — Alternate ICSP clock, analog input |
| Pin 28 | PGED2/AN18 — Alternate ICSP data, analog input |
| Pin 29 | RP19/INT0 — Remappable I/O, external interrupt |
| Pin 30 | RP18/INT1 — Remappable I/O, external interrupt |
| Pin 31 | RP17/INT2 — Remappable I/O, external interrupt |
| Pin 32 | RP16/INT3 — Remappable I/O, external interrupt |
| Pin 33 | VDD — Power supply (3.3 V) |
| Pin 34 | VSS — Ground reference |
| Pin 35 | RP31/PWM1L — Remappable I/O, PWM low-side output |
| Pin 36 | RP30/PWM1H — Remappable I/O, PWM high-side output |
| Pin 37 | RP29/PWM2L — Remappable I/O, PWM low-side output |
| Pin 38 | RP28/PWM2H — Remappable I/O, PWM high-side output |
| Pin 39 | RP27/PWM3L — Remappable I/O, PWM low-side output |
| Pin 40 | RP26/PWM3H — Remappable I/O, PWM high-side output |
| Pin 41 | RP25/PWM4L — Remappable I/O, PWM low-side output |
| Pin 42 | RP24/PWM4H — Remappable I/O, PWM high-side output |
| Pin 43 | RP23/PWM5L — Remappable I/O, PWM low-side output |
| Pin 44 | RP22/PWM5H — Remappable I/O, PWM high-side output |
| Pin 45 | RP7/AN7 — Remappable I/O, analog input (note: secondary mapping per device datasheet) |
| Pin 46 | RP6/AN6 — Remappable I/O, analog input (secondary mapping) |
| Pin 47 | RP5/AN5 — Remappable I/O, analog input (secondary mapping) |
| Pin 48 | RP4/AN4 — Remappable I/O, analog input (secondary mapping) |
| Pin 49 | RP3/AN3 — Remappable I/O, analog input (secondary mapping) |
| Pin 50 | RP2/AN2 — Remappable I/O, analog input (secondary mapping) |
| Pin 51 | RP1/AN1 — Remappable I/O, analog input (secondary mapping) |
| Pin 52 | RP0/AN0 — Remappable I/O, analog input (secondary mapping) |
| Pin 53 | MCLR — Master clear reset (active low) |
| Pin 54 | VDD — Power supply (3.3 V) |
| Pin 55 | VSS — Ground reference |
| Pin 56 | RP9/AN9/CVREF — Remappable I/O, analog input, voltage reference |
| Pin 57 | RP8/AN8 — Remappable I/O, analog input |
| Pin 58 | RP7/AN7 — Remappable I/O, analog input (secondary mapping) |
| Pin 59 | RP6/AN6 — Remappable I/O, analog input (secondary mapping) |
| Pin 60 | RP5/AN5 — Remappable I/O, analog input (secondary mapping) |
| Pin 61 | RP4/AN4 — Remappable I/O, analog input (secondary mapping) |
| Pin 62 | RP3/AN3 — Remappable I/O, analog input (secondary mapping) |
| Pin 63 | RP2/AN2 — Remappable I/O, analog input (secondary mapping) |
| Pin 64 | EP — Exposed thermal pad - connect to VSS for thermal dissipation |
Typical Applications
PIC24EP512GP206T-E/MR is suitable for 7 applications: Automotive Body and Chassis ECU, Industrial BLDC Motor Control, Power Conversion Digital Control, Capacitive Touch HMI, IoT Edge Sensor Hub, Medical Device Signal Conditioning, Automotive LED Lighting Driver.
Automotive Body and Chassis ECU
The PIC24EP512GP206T-E/MR's AEC-Q100 qualification and -40 C to +125 C operating range make it ideal for automotive body controllers (BCM) and chassis ECUs. Its 512 KB Flash accommodates full AUTOSAR-lite or proprietary body-control firmware including lighting, door/window control, and CAN/LIN stacks. The on-chip CTMU enables capacitive touch sensing for keyless-entry touch panels, while the high-speed PWM modules drive LED dimming and motor loads for seat adjustment. The 64-VQFN package's exposed pad supports continuous operation under hood-mounted ECU thermal stress.
Recommended
Industrial BLDC Motor Control
For sensorless or sensored BLDC and PMSM motor drives, the PIC24EP512GP206T-E/MR provides the 60 MIPS throughput required for Field-Oriented Control (FOT) loops and Space Vector Modulation. The integrated op amps condition back-EMF sensing signals directly from the motor phase nodes, eliminating external analog front-end cost. The PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates with deterministic sub-microsecond jitter, critical for high-RPM commutation. The 512 KB Flash holds full motor startup, tuning, and fault-recovery state machines.
Recommended
Power Conversion Digital Control
The PIC24EP512GP206T-E/MR's high-speed PWM (up to 1 ns resolution with 70 MIPS) and on-chip op amps make it a strong fit for digital control of DC-DC converters, PFC stages, and digital LED drivers. The CTMU performs accurate timing for synchronous rectifier dead-band insertion, while the 10/12-bit ADC samples feedback signals at high rate. The DMA engine offloads ADC-to-PWM update transfers, freeing the CPU for telemetry, PMBus, and adaptive control algorithms. AEC-Q100 grade supports automotive 48 V mild-hybrid converter applications.
Recommended
Capacitive Touch HMI
The CTMU (Charge Time Measurement Unit) inside the PIC24EP512GP206T-E/MR provides hardware-level timing for capacitive touch sensing with sub-pF resolution. Combined with the device's 512 KB Flash, designers can implement multi-button sliders, proximity sensors, and gesture detection without an external touch IC. The on-chip op amps drive guard rings and shield electrodes for water-tolerant designs, while DMA keeps CPU load low during continuous touch scanning. AEC-Q100 qualification enables automotive touch panels and industrial keypads.
Recommended
IoT Edge Sensor Hub
For IoT edge nodes aggregating multiple sensor inputs, the PIC24EP512GP206T-E/MR offers the memory headroom (512 KB Flash, 48 KB RAM) to run MQTT-SN, CoAP, or proprietary wireless stacks alongside sensor processing. The DMA channels move ADC samples into RAM without CPU intervention, extending battery life in periodic wake-up duty cycles. The automotive temperature grade supports outdoor enclosures and industrial deployments. Pairing with a sub-GHz or BLE module yields a complete edge-to-gateway node.
Recommended
Medical Device Signal Conditioning
While not itself a medical-grade part, the PIC24EP512GP206T-E/MR is well-suited for non-life-support medical device front-ends such as blood-pressure monitors, pulse oximeter signal conditioning, and patient-bedside controls. The integrated 12-bit ADC, op amps, and CTMU handle precision analog measurements while the 16-bit core runs filtering and display updates. The AEC-Q100 temperature range tolerates clinical autoclave thermal stress. Pair with medical-isolated power for IEC 60601 compliance.
Recommended
Automotive LED Lighting Driver
The PIC24EP512GP206T-E/MR drives high-resolution PWM dimming for automotive headlamps, taillights, and interior ambient lighting. With PWM resolution down to 1 ns at full clock, designers achieve smooth dimming curves without flicker. The CTMU calibrates LED current-sense resistor drift over temperature, while the 512 KB Flash stores multi-channel lighting patterns. The AEC-Q100 grade and -40 C to +125 C range handle under-hood thermal environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC24EP512GP206T-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24EP512GP206-E/MR | PIC24EP512GP206-I/MR | PIC24EP256MC206-I/MR | PIC24EP128MC206T-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 48 KB | 48 KB | 48 KB | 32 KB | 16 KB |
| Max CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C |
| AEC-Q100 | Qualified | Qualified | Not Qualified | Not Qualified | Qualified |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Packaging | Tape & Reel (T suffix) | Tray | Tray | Tray | Tape & Reel |
Key Differentiators
- Automotive-grade temperature with on-chip analog integration (vs PIC24EP512GP206-I/MR)
- Largest Flash in 64-VQFN PIC24EP family (vs PIC24EP256MC206-I/MR)
- VQFN package for improved thermal performance (vs PIC24EP512GP206T-E/PT)
- PTG and CTMU integrated for peripheral trigger and touch (vs PIC24EP128MC206T-E/MR)
Design Notes
The 64-VQFN package has an exposed thermal pad (EP) that MUST be soldered to a ground pour with multiple thermal vias to a ground plane. Without proper thermal connection, junction temperature can exceed AEC-Q100 Grade 1 limits under continuous full-load operation. Use at least 9 thermal vias (0.3 mm drill) in the EP land pattern. Estimated: with EP connected to a 1 sq-in copper pour, theta_JA drops to approximately 25 C/W for the 9x9 VQFN package, enabling full 60 MIPS operation at +125 C ambient.
Place a 0.1 uF ceramic decoupling capacitor within 3 mm of every VDD pin and a bulk 10 uF tantalum or ceramic capacitor near the package. The PIC24EP512GP206T-E/MR has multiple VDD/VSS pairs - each pair must be locally decoupled to prevent switching-current transients from corrupting analog measurements. For mixed-signal designs, isolate analog VDD from digital VDD with a ferrite bead and dedicate separate decoupling capacitors on each rail.
Route the ICSP signals (PGEC1/PGED1 and PGEC2/PGED2) to a 6-pin header or test pad accessible for in-circuit programming. The MCLR pin requires a 10 kohm pull-up to VDD for normal operation and a transient suppressor (TVS) for automotive load-dump protection per ISO 7637. Keep high-current switching traces (PWM outputs) away from analog inputs (ANx) to minimize coupled noise; use a ground guard ring around sensitive analog traces for best ADC SNR performance.
Do not exceed 3.6 V on any VDD pin - the PIC24EP512GP206T-E/MR is NOT 5 V tolerant. When migrating from PIC24F or PIC18F designs, verify all I/O signals are within 3.3 V logic levels. For automotive 12 V systems, design the voltage regulator (LDO or DC-DC) to handle load-dump transients up to 40 V per ISO 7637-2. The MCLR pin is internally pulled low on power-on reset, but an external pull-up is required for proper reset behavior.
When using the on-chip ADC at maximum sampling rate, enable DMA to transfer samples without CPU intervention, minimizing jitter. Use the CTMU for precise timing measurements rather than software loops to avoid interrupt latency variance. For high-speed PWM driving power MOSFETs, place gate-drive traces as short and wide as possible (target <25 mm) and use a ground return path directly under the PWM trace to minimize loop inductance and ringing.
Compliance Information
AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant. Lead-free and halogen-free per Microchip environmental compliance disclosures.
