PIC24F04KL101-E/MQ - 16-Bit 4KB Flash MCU | Microchip
Référence : PIC24F04KL101-E/MQ ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.65 | $1,65 |
| 10 | $1.49 | $14,90 |
| 100 | $1.32 | $132,00 |
| 500 | $1.18 | $590,00 |
| 1 000 | $1.05 | $1 050,00 |
PIC24F04KL101-E/MQ Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, plus configurable peripherals. The PIC24F KL1 family targets cost-sensitive 8- to 16-bit migration with familiar PIC18 peripherals such as MSSP (I2C/SPI) and CCP, allowing designers to step up to 16-bit performance without abandoning the PIC18 toolchain. As part of the broader PIC24F family -> 16-bit MCU -> microcontroller -> embedded controller hierarchy, the KL1 sits in the cost-optimized branch.
Key features of the PIC24F04KL101-E/MQ include 4KB self-programmable flash with ECC, 512B SRAM, a 9-channel 10-bit ADC, two analog comparators, MSSP supporting I2C/SPI, one UART, two CCP modules, and a 32 kHz RTCC for real-time clock operation. The device supports 1.8V to 3.6V VDD with on-chip LDO, eliminating the need for external regulators.
Architecture details: the KL1 uses a 16-bit modified Harvard core with single-cycle multiply and divide, 16 working registers, and a deterministic 7-deep interrupt stack. XLP technology includes Sleep, Deep Sleep, and Retention modes with sub-uA quiescent current and fast wake-up, enabled by the on-chip RTCC and a hardware Windowed Watchdog Timer.
Typical applications include coin-cell and battery-powered sensor nodes, low-cost remote controls, energy-harvesting IoT endpoints, industrial sensor transmitters, and automotive accessory modules (a qualified variant exists in the same family). The -E extended temperature grade makes it suitable for under-hood and outdoor environments.
For designs, ensure VDD decoupling with at least one 100 nF + one 10 uF bulk capacitor placed close to the pins, route the ICSP clock/data lines cleanly, and observe the MCLR pull-up timing requirements for reliable in-circuit programming.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that complement the manufacturer datasheet with practical engineering guidance.
Alternatives de remplacement direct pour PIC24F04KL101-E/MQ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24F04KL101-E/MQ (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24F04KL101-I/MQ
✅ Remplacement direct✓ En stock
$0.098 / unité
Voir la fiche technique →PIC24F04KL101-E/MQ Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Program Memory (Flash) | 4 KB |
| Data Memory (SRAM) | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage (VDD) | 1.8 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (Extended, -E suffix) |
| ADC | 10-bit, 9 channels |
| Analog Comparators | 2 |
| MSSP (I2C/SPI) | 1 |
| UART | 1 |
| CCP Modules | 2 |
| RTCC (Real-Time Clock) | Yes (32 kHz domain) |
| Windowed Watchdog Timer | Yes |
| Boîtier | 20-pin VQFN (5x5 mm, MQ suffix) |
| Type de montage | Surface Mount |
| Niveau MSL | MSL3 |
| Statut RoHS | Compliant |
| ICSP / Programming | Yes (2-wire ICSP) |
Configuration des broches de PIC24F04KL101-E/MQ
| Broche 1 | RA0 — I/O / AN0 / CNP0 |
| Broche 2 | RA1 — I/O / AN1 / CNP1 |
| Broche 3 | RA2 — I/O / AN2 / CVREF / CNP2 |
| Broche 4 | RA3 — I/O / AN3 / CNP3 |
| Broche 5 | RA4 — I/O / AN4 / CNP4 |
| Broche 6 | RA5 — I/O / AN5 / CNP5 |
| Broche 7 | RA6 — I/O / OSC2 / CLKO |
| Broche 8 | RA7 — I/O / OSC1 / CLKI |
| Broche 9 | VDD — Positive supply voltage |
| Broche 10 | VSS — Ground reference |
| Broche 11 | RB0 — I/O / AN6 / SCL1 / CNP6 |
| Broche 12 | RB1 — I/O / AN7 / SDA1 / CNP7 |
| Broche 13 | RB2 — I/O / AN8 / CNP8 |
| Broche 14 | RB3 — I/O / AN9 / CNP9 |
| Broche 15 | RB4 — I/O / CNP10 |
| Broche 16 | RB5 — I/O / CNP11 |
| Broche 17 | RB6 — I/O / ICSPCLK / CNP12 |
| Broche 18 | RB7 — I/O / ICSPDAT / CNP13 |
| Broche 19 | MCLR — Master Clear (reset, active low) |
| Broche 20 | EP — Exposed thermal pad (connect to VSS) |
Applications typiques
PIC24F04KL101-E/MQ convient pour 6 applications: Coin-Cell Battery Sensor Endpoints, Low-Cost Remote Controls, Industrial Sensor Transmitters, Energy Harvesting IoT Nodes, Automotive Accessory Modules, Consumer Appliance User Interfaces.
Coin-Cell Battery Sensor Endpoints
The PIC24F04KL101-E/MQ's nanoWatt XLP Deep Sleep mode draws sub-microamps while retaining RAM, RTCC, and interrupt-on-pin capability, enabling multi-year coin-cell operation. The 4KB flash holds calibration tables, sleep/wake state machines, and BLE/Zigbee protocol stacks for periodic sensor uplinks.
Recommandé
Low-Cost Remote Controls
With 32 MHz / 16 MIPS throughput and integrated MSSP (I2C/SPI), the PIC24F04KL101-E/MQ handles RF encoder ICs and keypad matrix scanning without external logic. The 1.8V-3.6V VDD range accepts a single CR2032 cell directly, eliminating boost converters in handheld transmitters.
Recommandé
Industrial Sensor Transmitters
The -E Extended temperature grade (-40C to +125C) and 9-channel 10-bit ADC make the PIC24F04KL101-E/MQ suitable for factory-floor 4-20mA sensor bridges, RTD conditioning, and process monitoring. Hardware Windowed Watchdog prevents lockup in unattended industrial environments.
Recommandé
Energy Harvesting IoT Nodes
Sub-microamp Deep Sleep and fast wake-up from RTCC make the PIC24F04KL101-E/MQ a fit for solar or vibration energy harvesting circuits where average power is critical. The on-chip LDO accepts the variable output of harvesters without external regulation.
Recommandé
Automotive Accessory Modules
The -E Extended grade (-40C to +125C) and 32 MHz throughput suit cabin and under-hood accessory modules such as lighting controllers, seat heaters, and HVAC dampers. For safety-critical applications requiring AEC-Q100, Microchip offers -Q1 qualified variants of the KL1 family in identical footprints.
Recommandé
Consumer Appliance User Interfaces
Two CCP modules drive PWM for LED backlighting and buzzer feedback, while the MSSP interfaces with capacitive touch or segment LCD drivers. The 4KB flash holds state-machine UI logic and the 1.8V-3.6V VDD simplifies integration with battery or mains-derived supplies in white goods.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24F04KL101-E/MQ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24F04KL101-I/MQ | PIC24F04KL100T-I/ST | PIC24F04KL100-E/P |
|---|---|---|---|---|
| Package | 20-pin VQFN (5x5 mm, MQ) | 20-pin VQFN (5x5 mm, MQ) - same | TSSOP-14 (ST) - different | PDIP-20 (P) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 4 KB | 4 KB | 1 KB | 1 KB |
| SRAM | 512 B | 512 B | 256 B | 256 B |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ADC Channels | 9 (10-bit) | 9 (10-bit) | 7 (10-bit) | 7 (10-bit) |
| Pin-to-Pin Compatible | Yes (reference) | Yes (same VQFN-20) | No (TSSOP-14) | No (PDIP-20) |
Principaux différenciateurs
- Only VQFN-20 variant with Extended -40C to +125C temperature grade (vs PIC24F04KL101-I/MQ)
- Doubles flash memory vs the KL100 base part (vs PIC24F04KL100-I/P)
- Adds 2 ADC channels over the KL100 base part (vs PIC24F04KL100-E/P)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to the VDD pin (pin 9) with the ground return to VSS (pin 10). Add a bulk 10 uF capacitor on the same VDD rail. For battery-powered designs operating from Deep Sleep, the bulk capacitor supports the wake-up transient without causing VDD droop.
The exposed thermal pad (pin 20) MUST be soldered to a copper pad on the PCB connected to VSS for mechanical stability and thermal dissipation. Use multiple thermal vias under the EP to the ground plane to improve heat spreading. For VQFN packages, skipping the EP solder connection can cause reliability and thermal failures.
Do not float the MCLR pin (pin 19); always pull it up to VDD through a resistor (typically 10 kOhm). A floating MCLR can cause spurious resets or programming failures. For ICSP operation, ensure the ICSPDAT and ICSPCLK lines are not pulled low by external circuitry during programming.
Route the 32 kHz crystal traces (if used) symmetrically and keep them short with a ground guard ring to reduce EMI pickup. Place the crystal load capacitors close to the OSC1/OSC2 pins. For high-noise environments, use the internal oscillator instead to reduce BOM and EMI susceptibility.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -E/MQ variant carries Extended industrial temperature grade (-40C to +125C) but is NOT AEC-Q100 qualified; for AEC-Q100 qualified versions look for Microchip's automotive-grade -Q1 suffix variants in the same PIC24F04KL101 family.
