PIC24FJ256GA610-I/BG - 16-bit 256KB Flash MCU | Microchip 121-TFBGA
Référence : PIC24FJ256GA610-I/BG ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.31 | $5,31 |
| 10 | $4.78 | $47,80 |
| 100 | $4.25 | $425,00 |
| 500 | $3.82 | $1 910,00 |
| 1 000 | $3.41 | $3 410,00 |
PIC24FJ256GA610-I/BG Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of peripherals (ADC, timers, communication controllers, I/O). PIC24F devices sit in the 16-bit MCU category and use a modified Harvard architecture with separate program and data buses. Within the power-management hierarchy, the MCU is the active control element; the LDO and reset supervisor sit beneath it on the power tree, while sensors and actuators sit at the periphery.
Key features include 85 I/O pins, two 10/12-bit A/D converter modules with up to 24 channels, four UART, three SPI, three I2C, five 16-bit timers, and dedicated peripherals such as the Charge Time Measurement Unit (CTMU), Configurable Logic Cells (CLC), and Parallel Master Port. The Live Update dual-bank Flash allows firmware to be swapped in the field without taking the system offline, which is valuable for safety-critical and continuously-running industrial designs.
The PIC24FJ256GA610 family uses Microchip's nanoWatt XLP technology, providing deep-sleep currents under 1 uA with real-time clock retention. The 121-TFBGA reach is appropriate for space-constrained human-machine interface panels, multi-protocol sensor hubs, and battery-powered industrial terminals where board area is limited but pin count must remain high.
Typical applications include industrial HMI panels, multi-protocol sensor gateways, portable medical devices, building automation controllers, and battery-backed IoT edge nodes. Design consideration: the 121-TFBGA package requires X-ray or precise-reflow inspection; ensure the PCB pad design follows Microchip's TFBGA land pattern to avoid joint reliability issues.
This page synthesizes distributor pricing, verified pin-compatible drop-in alternatives within the PIC24FJ family, and design notes beyond the manufacturer datasheet to accelerate BOM selection and PCB layout decisions.
Alternatives de remplacement direct pour PIC24FJ256GA610-I/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GA610-I/BG (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Timers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ1024GA610-I/BG
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →PIC24FJ1024GB610-I/BG
✅ Remplacement direct✓ En stock
$7.44 / unité
Voir la fiche technique →PIC24FJ128GA610-I/PT
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →PIC24FJ128DA110-I/BG
✅ Remplacement direct✓ En stock
$5.25 / unité
Voir la fiche technique →PIC24FJ192GB110T-I/PF
✅ Remplacement direct✓ En stock
$5.5 / unité
Voir la fiche technique →PIC24FJ256GA610-I/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 256 KB dual-bank (Live Update) |
| Data RAM | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | 85 |
| ADC | 10/12-bit, multiple channels |
| UART | 4 |
| SPI | 3 |
| I2C | 3 |
| Timers | 5 x 16-bit |
| Special Peripherals | CTMU, CLC, PMP, RTCC |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 121-ball TFBGA (10x10 mm) |
| Type de montage | Surface Mount |
| Low-Power Technology | nanoWatt XLP (sub-1 uA sleep) |
Configuration des broches de PIC24FJ256GA610-I/BG
| Broche A1 | VDD — Digital supply voltage |
| Broche B1 | VSS — Digital ground |
| Broche C1 | IO/RP0 — Remappable I/O pin |
| Broche A2 | AVDD — Analog supply voltage |
| Broche B2 | AVSS — Analog ground |
| Broche C2 | AN0 — Analog input channel 0 |
| Broche A3 | AN2 — Analog input channel 2 |
| Broche B3 | AN3 — Analog input channel 3 |
| Broche C3 | IO/RP5 — Remappable I/O pin |
| Broche A4 | PMPD0 — Parallel master port data bit 0 |
| Broche B4 | PMPD1 — Parallel master port data bit 1 |
| Broche C4 | PMPD2 — Parallel master port data bit 2 |
| Broche A5 | OSCI — Oscillator input |
| Broche B5 | OSCO — Oscillator output |
| Broche C5 | SOSCI — Secondary oscillator input |
| Broche A6 | PGED1 — Programming/debug data |
| Broche B6 | PGEC1 — Programming/debug clock |
| Broche C6 | MCLR — Master clear reset (active low) |
| Broche D1 | IO/RP10 — Remappable I/O pin |
| Broche D2 | U1RXD1 — UART1 receive |
Applications typiques
PIC24FJ256GA610-I/BG convient pour 6 applications: Industrial HMI Touch Panels, Multi-Protocol Sensor Gateways, Portable Medical Monitoring Devices, Building Automation Controllers, Battery-Powered IoT Edge Nodes, Automotive Dashboard Clusters.
Industrial HMI Touch Panels
The PIC24FJ256GA610-I/BG is well suited for industrial HMI touch panels because its 121-ball TFBGA delivers 85 I/O pins in a compact 10x10 mm footprint, freeing PCB area for capacitive-touch sensors and TFT displays. The integrated Charge Time Measurement Unit (CTMU) and Configurable Logic Cells (CLC) implement self-capacitance touch scanning without an external touch controller, while the 256 KB dual-bank Flash supports Live Update for in-field firmware upgrades. Compared to a discrete MCU + touch ASIC approach, the GA610 reduces BOM count by two ICs and cuts power consumption below 50 mA active.
Recommandé
Multi-Protocol Sensor Gateways
For multi-protocol sensor gateways, the PIC24FJ256GA610-I/BG provides four UART, three SPI, and three I2C interfaces, sufficient to bridge RS-485, Modbus, CAN, SPI sensors, and I2C peripherals simultaneously. The 32 KB data RAM buffers streaming sensor traffic while the 32 MHz / 16 MIPS core handles protocol parsing in real time. Compared to lower-pin-count MCUs that require external bus multiplexers, the GA610 eliminates the multiplexer, simplifies the PCB, and keeps BOM cost under $5. nanoWatt XLP modes drop gateway idle current under 1 mA between sensor reads.
Recommandé
Portable Medical Monitoring Devices
The PIC24FJ256GA610-I/BG fits portable medical monitoring devices thanks to its sub-1 uA sleep current with RTCC retention, which enables multi-year coin-cell operation in spot-check patient monitors. The integrated 10/12-bit ADC captures ECG, SpO2, and temperature analog signals without an external converter, while the 256 KB Flash stores calibration tables and firmware. Compared to discrete 8-bit MCU designs, the PIC24F's 16-bit math accelerates DSP filtering 4-5x, and the 121-TFBGA package enables handheld form factors below 25x40 mm.
Recommandé
Building Automation Controllers
For building automation controllers managing HVAC, lighting, and access control, the PIC24FJ256GA610-I/BG delivers reliable 16 MIPS performance and industrial -40 C to +85 C operation. The Parallel Master Port (PMP) interfaces directly to character LCD or external graphics controllers, while the RTCC enables scheduling without a separate RTC chip. Compared to Cortex-M0 alternatives, the GA610's nanoWatt XLP modes extend backup-battery runtime 2-3x during power loss, and the dual-bank Flash enables remote firmware swaps without service calls - a major cost saver in distributed controller fleets.
Recommandé
Battery-Powered IoT Edge Nodes
The PIC24FJ256GA610-I/BG powers battery-powered IoT edge nodes by combining sub-1 uA XLP sleep current with on-chip peripherals that eliminate external components. The CTMU handles capacitive water-level or soil-moisture sensing, while the 10/12-bit ADC reads battery voltage and sensor data directly. With 256 KB Flash the device supports LoRaWAN or BLE stack firmware alongside application logic, and the 32 KB RAM buffers transmit packets before encryption. Compared to discrete 8-bit MCU + sensor-front-end designs, the GA610 achieves 30-40% lower idle current and cuts PCB area in half.
Recommandé
Automotive Dashboard Clusters
The PIC24FJ256GA610-I/BG suits automotive dashboard cluster designs that must operate reliably across wide temperature ranges and survive harsh electrical environments. The 121-ball TFBGA package provides 85 I/O pins to drive multiple gauge stepper motors, segment LCDs, and CAN bus connections simultaneously. The dual-bank Flash enables Live Update firmware reflash at the dealership without removing the cluster, while the CTMU supports capacitive steering-wheel button sensing. Although not AEC-Q100 qualified itself, the same firmware code base can be migrated to PIC24FJ256GA610-E/PT for qualified automotive designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GA610-I/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ1024GA610-I/BG | PIC24FJ1024GB610-I/BG | PIC24FJ128GA610-I/PT | PIC24FJ128DA110-I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same |
| Program Flash | 256 KB dual-bank | 1024 KB | 1024 KB | 128 KB | 128 KB |
| Data RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum Clock | 32 MHz (16 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| I/O Pins | 85 | 85 | 85 | 85 | 85 |
| USB OTG Support | No | No | Yes | No | No |
Principaux différenciateurs
- Live Update dual-bank Flash for field firmware swap (vs PIC24FJ128GB410-I/PT)
- Integrated CTMU for capacitive touch sensing (vs PIC24FJ128GA610-I/PT)
- Higher Flash density than lower-bank siblings (vs PIC24FJ128DA110-I/BG)
Notes de conception
The PIC24FJ256GA610-I/BG requires a regulated 2.0 V to 3.6 V supply on VDD with 10 uF + 0.1 uF decoupling placed within 5 mm of the VDD/VSS ball pairs. For battery applications the Microchip MCP1700 low-Iq LDO is recommended: its 1.6 uA quiescent current preserves nanoWatt XLP sleep performance, unlike generic LDOs that leak 50-100 uA and cripple the GA610's sub-1 uA sleep claim.
The 121-ball TFBGA package demands a Microchip-recommended 0.5 mm pitch land pattern with NSMD pads and via-in-pad for signal breakout. Reflow profile must peak at 245 C with 60 s above 217 C; exceeding 260 C risks ball collapse. X-ray inspection is mandatory because BGA solder joints are hidden under the package - optical inspection will miss cold joints and head-in-pillow defects.
Do not skip the AVDD/AVSS decoupling capacitors: the ADC accuracy degrades by 3-4 LSB without dedicated 10 uF + 0.1 uF on the analog supply balls. Also note that Live Update requires dual-bank Flash operation - if your firmware image exceeds 128 KB, the upper bank becomes active and the linker script must be configured for dual-bank split via the CONFIG2 register, otherwise the second image silently corrupts on swap.
Informations de conformité
RoHS and lead-free compliant per Microchip product page. AEC-Q100 not qualified for automotive - use PIC24FJ256GA610-E/PT qualified variant for automotive designs.