PIC24FJ256GA610-I/BG - 16-bit 256KB Flash MCU | Microchip 121-TFBGA
Teilenummer: PIC24FJ256GA610-I/BG ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.31 | $5,31 |
| 10 | $4.78 | $47,80 |
| 100 | $4.25 | $425,00 |
| 500 | $3.82 | $1.910,00 |
| 1.000 | $3.41 | $3.410,00 |
PIC24FJ256GA610-I/BG Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of peripherals (ADC, timers, communication controllers, I/O). PIC24F devices sit in the 16-bit MCU category and use a modified Harvard architecture with separate program and data buses. Within the power-management hierarchy, the MCU is the active control element; the LDO and reset supervisor sit beneath it on the power tree, while sensors and actuators sit at the periphery.
Key features include 85 I/O pins, two 10/12-bit A/D converter modules with up to 24 channels, four UART, three SPI, three I2C, five 16-bit timers, and dedicated peripherals such as the Charge Time Measurement Unit (CTMU), Configurable Logic Cells (CLC), and Parallel Master Port. The Live Update dual-bank Flash allows firmware to be swapped in the field without taking the system offline, which is valuable for safety-critical and continuously-running industrial designs.
The PIC24FJ256GA610 family uses Microchip's nanoWatt XLP technology, providing deep-sleep currents under 1 uA with real-time clock retention. The 121-TFBGA reach is appropriate for space-constrained human-machine interface panels, multi-protocol sensor hubs, and battery-powered industrial terminals where board area is limited but pin count must remain high.
Typical applications include industrial HMI panels, multi-protocol sensor gateways, portable medical devices, building automation controllers, and battery-backed IoT edge nodes. Design consideration: the 121-TFBGA package requires X-ray or precise-reflow inspection; ensure the PCB pad design follows Microchip's TFBGA land pattern to avoid joint reliability issues.
This page synthesizes distributor pricing, verified pin-compatible drop-in alternatives within the PIC24FJ family, and design notes beyond the manufacturer datasheet to accelerate BOM selection and PCB layout decisions.
Drop-in-Alternativen für PIC24FJ256GA610-I/BG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ256GA610-I/BG (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Timers, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ1024GA610-I/BG
✅ Drop-In✓ Auf Lager
$8.2 / Stück
Datenblatt ansehen →PIC24FJ1024GB610-I/BG
✅ Drop-In✓ Auf Lager
$7.44 / Stück
Datenblatt ansehen →PIC24FJ128GA610-I/PT
✅ Drop-In✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →PIC24FJ128DA110-I/BG
✅ Drop-In✓ Auf Lager
$5.25 / Stück
Datenblatt ansehen →PIC24FJ192GB110T-I/PF
✅ Drop-In✓ Auf Lager
$5.5 / Stück
Datenblatt ansehen →PIC24FJ256GA610-I/BG Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 256 KB dual-bank (Live Update) |
| Data RAM | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | 85 |
| ADC | 10/12-bit, multiple channels |
| UART | 4 |
| SPI | 3 |
| I2C | 3 |
| Timers | 5 x 16-bit |
| Special Peripherals | CTMU, CLC, PMP, RTCC |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 121-ball TFBGA (10x10 mm) |
| Montageart | Surface Mount |
| Low-Power Technology | nanoWatt XLP (sub-1 uA sleep) |
PIC24FJ256GA610-I/BG Pin-Konfiguration
| Pin A1 | VDD — Digital supply voltage |
| Pin B1 | VSS — Digital ground |
| Pin C1 | IO/RP0 — Remappable I/O pin |
| Pin A2 | AVDD — Analog supply voltage |
| Pin B2 | AVSS — Analog ground |
| Pin C2 | AN0 — Analog input channel 0 |
| Pin A3 | AN2 — Analog input channel 2 |
| Pin B3 | AN3 — Analog input channel 3 |
| Pin C3 | IO/RP5 — Remappable I/O pin |
| Pin A4 | PMPD0 — Parallel master port data bit 0 |
| Pin B4 | PMPD1 — Parallel master port data bit 1 |
| Pin C4 | PMPD2 — Parallel master port data bit 2 |
| Pin A5 | OSCI — Oscillator input |
| Pin B5 | OSCO — Oscillator output |
| Pin C5 | SOSCI — Secondary oscillator input |
| Pin A6 | PGED1 — Programming/debug data |
| Pin B6 | PGEC1 — Programming/debug clock |
| Pin C6 | MCLR — Master clear reset (active low) |
| Pin D1 | IO/RP10 — Remappable I/O pin |
| Pin D2 | U1RXD1 — UART1 receive |
Typische Anwendungen
PIC24FJ256GA610-I/BG ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, Multi-Protocol Sensor Gateways, Portable Medical Monitoring Devices, Building Automation Controllers, Battery-Powered IoT Edge Nodes, Automotive Dashboard Clusters.
Industrial HMI Touch Panels
The PIC24FJ256GA610-I/BG is well suited for industrial HMI touch panels because its 121-ball TFBGA delivers 85 I/O pins in a compact 10x10 mm footprint, freeing PCB area for capacitive-touch sensors and TFT displays. The integrated Charge Time Measurement Unit (CTMU) and Configurable Logic Cells (CLC) implement self-capacitance touch scanning without an external touch controller, while the 256 KB dual-bank Flash supports Live Update for in-field firmware upgrades. Compared to a discrete MCU + touch ASIC approach, the GA610 reduces BOM count by two ICs and cuts power consumption below 50 mA active.
Empfohlen
Multi-Protocol Sensor Gateways
For multi-protocol sensor gateways, the PIC24FJ256GA610-I/BG provides four UART, three SPI, and three I2C interfaces, sufficient to bridge RS-485, Modbus, CAN, SPI sensors, and I2C peripherals simultaneously. The 32 KB data RAM buffers streaming sensor traffic while the 32 MHz / 16 MIPS core handles protocol parsing in real time. Compared to lower-pin-count MCUs that require external bus multiplexers, the GA610 eliminates the multiplexer, simplifies the PCB, and keeps BOM cost under $5. nanoWatt XLP modes drop gateway idle current under 1 mA between sensor reads.
Empfohlen
Portable Medical Monitoring Devices
The PIC24FJ256GA610-I/BG fits portable medical monitoring devices thanks to its sub-1 uA sleep current with RTCC retention, which enables multi-year coin-cell operation in spot-check patient monitors. The integrated 10/12-bit ADC captures ECG, SpO2, and temperature analog signals without an external converter, while the 256 KB Flash stores calibration tables and firmware. Compared to discrete 8-bit MCU designs, the PIC24F's 16-bit math accelerates DSP filtering 4-5x, and the 121-TFBGA package enables handheld form factors below 25x40 mm.
Empfohlen
Building Automation Controllers
For building automation controllers managing HVAC, lighting, and access control, the PIC24FJ256GA610-I/BG delivers reliable 16 MIPS performance and industrial -40 C to +85 C operation. The Parallel Master Port (PMP) interfaces directly to character LCD or external graphics controllers, while the RTCC enables scheduling without a separate RTC chip. Compared to Cortex-M0 alternatives, the GA610's nanoWatt XLP modes extend backup-battery runtime 2-3x during power loss, and the dual-bank Flash enables remote firmware swaps without service calls - a major cost saver in distributed controller fleets.
Empfohlen
Battery-Powered IoT Edge Nodes
The PIC24FJ256GA610-I/BG powers battery-powered IoT edge nodes by combining sub-1 uA XLP sleep current with on-chip peripherals that eliminate external components. The CTMU handles capacitive water-level or soil-moisture sensing, while the 10/12-bit ADC reads battery voltage and sensor data directly. With 256 KB Flash the device supports LoRaWAN or BLE stack firmware alongside application logic, and the 32 KB RAM buffers transmit packets before encryption. Compared to discrete 8-bit MCU + sensor-front-end designs, the GA610 achieves 30-40% lower idle current and cuts PCB area in half.
Empfohlen
Automotive Dashboard Clusters
The PIC24FJ256GA610-I/BG suits automotive dashboard cluster designs that must operate reliably across wide temperature ranges and survive harsh electrical environments. The 121-ball TFBGA package provides 85 I/O pins to drive multiple gauge stepper motors, segment LCDs, and CAN bus connections simultaneously. The dual-bank Flash enables Live Update firmware reflash at the dealership without removing the cluster, while the CTMU supports capacitive steering-wheel button sensing. Although not AEC-Q100 qualified itself, the same firmware code base can be migrated to PIC24FJ256GA610-E/PT for qualified automotive designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ256GA610-I/BG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ1024GA610-I/BG | PIC24FJ1024GB610-I/BG | PIC24FJ128GA610-I/PT | PIC24FJ128DA110-I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same |
| Program Flash | 256 KB dual-bank | 1024 KB | 1024 KB | 128 KB | 128 KB |
| Data RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum Clock | 32 MHz (16 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| I/O Pins | 85 | 85 | 85 | 85 | 85 |
| USB OTG Support | No | No | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Live Update dual-bank Flash for field firmware swap (vs. PIC24FJ128GB410-I/PT)
- Integrated CTMU for capacitive touch sensing (vs. PIC24FJ128GA610-I/PT)
- Higher Flash density than lower-bank siblings (vs. PIC24FJ128DA110-I/BG)
Designhinweise
The PIC24FJ256GA610-I/BG requires a regulated 2.0 V to 3.6 V supply on VDD with 10 uF + 0.1 uF decoupling placed within 5 mm of the VDD/VSS ball pairs. For battery applications the Microchip MCP1700 low-Iq LDO is recommended: its 1.6 uA quiescent current preserves nanoWatt XLP sleep performance, unlike generic LDOs that leak 50-100 uA and cripple the GA610's sub-1 uA sleep claim.
The 121-ball TFBGA package demands a Microchip-recommended 0.5 mm pitch land pattern with NSMD pads and via-in-pad for signal breakout. Reflow profile must peak at 245 C with 60 s above 217 C; exceeding 260 C risks ball collapse. X-ray inspection is mandatory because BGA solder joints are hidden under the package - optical inspection will miss cold joints and head-in-pillow defects.
Do not skip the AVDD/AVSS decoupling capacitors: the ADC accuracy degrades by 3-4 LSB without dedicated 10 uF + 0.1 uF on the analog supply balls. Also note that Live Update requires dual-bank Flash operation - if your firmware image exceeds 128 KB, the upper bank becomes active and the linker script must be configured for dual-bank split via the CONFIG2 register, otherwise the second image silently corrupts on swap.
Compliance-Informationen
RoHS and lead-free compliant per Microchip product page. AEC-Q100 not qualified for automotive - use PIC24FJ256GA610-E/PT qualified variant for automotive designs.