PIC24FJ128GA702T-I/MV - 16-bit MCU, 128KB Flash, UQFN-28 | Microchip
Référence : PIC24FJ128GA702T-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.18 | $4,18 |
| 10 | $3.75 | $37,50 |
| 100 | $3.32 | $332,00 |
| 500 | $2.95 | $1 475,00 |
| 1 000 | $2.58 | $2 580,00 |
PIC24FJ128GA702T-I/MV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory, working RAM, and peripheral interfaces such as ADC, timers, communication ports, and GPIO. Within the broader taxonomy, an MCU sits between microprocessors (MPUs, which need external memory) and application-specific SoCs; the PIC24FJ family belongs to Microchip's 16-bit MCU portfolio, between the 8-bit PIC16/PIC18 devices and the 32-bit PIC32MX/dsPIC families. The PIC24FJ128GA702T is optimized for general-purpose embedded designs that require more performance than 8-bit parts can deliver but do not justify the cost of a 32-bit MCU.
Key features include a 12-bit ADC at up to 200 ksps with up to 14 analog input channels, three on-chip analog comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-of-flight sensing, and multiple serial interfaces (UART, SPI, I2C). The 128KB of Flash supports self-programming, and the device integrates a hardware crypto engine for secure boot and data protection. The 28-pin UQFN (4x4 mm) package includes an exposed thermal pad, allowing the chip to sink heat efficiently despite its small footprint.
The device integrates a 16-bit modified Harvard architecture with a multi-channel DMA controller, two I2C ports, three UART modules, three SPI interfaces, and five 16-bit timers. The eXtreme Low Power design includes multiple sleep modes down to nanoWatt technology and a real-time clock calendar (RTCC) running from a 32.768 kHz crystal, enabling battery-energized applications where quiescent current dominates lifetime.
Typical applications include IoT edge sensor nodes, capacitive touch HMIs, portable medical and fitness devices, consumer appliances, USB HID peripherals, and low-power wireless sensor nodes. The CTMU makes the part especially attractive for matrix-key or projected-capacitive touch panels without external analog front-end ICs.
When designing with this part, select the appropriate package pinout from the 28/44/48-pin family variants; the 28-pin UQFN (MV suffix) is the smallest footprint option. For best power performance, configure unused peripherals to their lowest-power states and use the deep-sleep modes with RTCC wake.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and embedded engineers evaluate the PIC24FJ128GA702T-I/MV against parametric peers and same-family variants in a single place.
Alternatives de remplacement direct pour PIC24FJ128GA702T-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ128GA702T-I/MV (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, Package, ADC, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA702-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GA702-E/MV
✅ Remplacement direct✓ En stock
$3.02 / unité
Voir la fiche technique →PIC24FJ128GA702T-I/ML
✅ Remplacement direct✓ En stock
$2.62 / unité
Voir la fiche technique →PIC24FJ128GA202-I/SS
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.74 / unité
Voir la fiche technique →PIC24FJ64GA702-I/MV
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.38 / unité
Voir la fiche technique →PIC24FJ128GA702T-I/MV Valeurs maximales et caractéristiques électriques
| Product Family | PIC® 24F |
| Core Architecture | 16-bit modified Harvard |
| Program Memory (Flash) | 128 KB (43K x 24 words) with ECC |
| Data RAM | 16 KB |
| Maximum CPU Clock | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 200 ksps, up to 14 analog inputs |
| Comparators | 3 on-chip analog comparators |
| CTMU | Yes (for capacitive touch / time measurement) |
| UART Modules | 3 |
| SPI Modules | 3 |
| I2C Modules | 2 |
| Timers | 5 x 16-bit |
| DMA | Multi-channel DMA controller |
| Low-Power Mode | eXtreme Low Power (XLP), nanoWatt |
| RTCC | Yes (real-time clock calendar) |
| Boîtier | 28-pin UQFN (4x4 mm) with exposed pad |
| Température de fonctionnement | -40C to +85C (industrial) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC24FJ128GA702T-I/MV
| Broche 1 | RA0 — GPIO / analog input AN0 |
| Broche 2 | RA1 — GPIO / analog input AN1 |
| Broche 3 | RA2 — GPIO / analog input AN2 |
| Broche 4 | RA3 — GPIO / analog input AN3 |
| Broche 5 | RA4 — GPIO / analog input AN4 |
| Broche 6 | VDD — Positive supply voltage (2.0V-3.6V) |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA5 — GPIO / analog input AN5 |
| Broche 9 | RA6 — GPIO / analog input AN6 |
| Broche 10 | RA7 — GPIO / analog input AN7 |
| Broche 11 | RB0 — GPIO |
| Broche 12 | RB1 — GPIO |
| Broche 13 | RB2 — GPIO |
| Broche 14 | RB3 — GPIO |
| Broche 15 | RB4 — GPIO |
| Broche 16 | RB5 — GPIO |
| Broche 17 | RB6 — GPIO / ICSPCLK (programming clock) |
| Broche 18 | RB7 — GPIO / ICSPDAT (programming data) |
| Broche 19 | RC0 — GPIO |
| Broche 20 | RC1 — GPIO |
| Broche 21 | RC2 — GPIO |
| Broche 22 | RC3 — GPIO |
| Broche 23 | RC4 — GPIO |
| Broche 24 | RC5 — GPIO |
| Broche 25 | RC6 — GPIO |
| Broche 26 | RC7 — GPIO |
| Broche 27 | OSC1 — Crystal oscillator input |
| Broche 28 | OSC2 — Crystal oscillator output |
| Broche 29 | EP — Exposed thermal pad (connect to VSS for thermal dissipation) |
Applications typiques
PIC24FJ128GA702T-I/MV convient pour 6 applications: Capacitive Touch HMIs, Battery-Powered IoT Sensor Nodes, Portable Medical and Fitness Devices, USB HID Consumer Peripherals, Industrial Sensor Conditioning and Control, Smart Appliance Control Boards.
Capacitive Touch HMIs
The PIC24FJ128GA702T-I/MV's integrated Charge Time Measurement Unit (CTMU) and 12-bit ADC at 200 ksps make it a single-chip solution for capacitive touch human-machine interfaces. The CTMU generates precisely controlled current pulses whose integration time on a touch electrode varies with capacitance, allowing the ADC to detect finger touches, slider positions, and proximity events without external analog front-end ICs. Combined with the 128KB Flash for touch firmware and water-tolerant algorithms, the device supports projected-capacitive touch panels up to 14 channels in the 28-pin UQFN package. The 4x4 mm footprint is small enough for appliance control boards and consumer touch panels where PCB real estate is at a premium.
Recommandé
Battery-Powered IoT Sensor Nodes
The PIC24FJ128GA702T-I/MV's eXtreme Low Power (XLP) technology with nanoWatt deep-sleep currents and the integrated real-time clock calendar (RTCC) running from a 32.768 kHz crystal make it well-suited to battery-powered IoT sensor nodes. The 16-bit core at 16 MIPS handles periodic sensor reads, FFT/filtering of vibration or acoustic data, and protocol stack execution, then drops to sub-uA sleep while waiting for the next wake event. With 128KB Flash and 16KB RAM, the MCU can host an RTOS or a full LoRaWAN/Thread/Zigbee stack alongside application code. The 28-pin UQFN package's small 4x4 mm footprint fits inside sensor packages where board space is severely constrained.
Recommandé
Portable Medical and Fitness Devices
The PIC24FJ128GA702T-I/MV fits portable medical and fitness devices that demand low power, integrated analog, and small footprint. The 12-bit ADC at 200 ksps with 14 input channels can directly digitize signals from photoplethysmography (PPG) sensors for heart-rate, galvanic skin response (GSR) sensors for stress, and thermistor bridges for body temperature - all without external signal-chain ICs. The XLP sleep currents down to nanoWatts enable multi-day battery life on a single CR2032 cell for step counters and sleep trackers. The 128KB Flash holds BLE stack libraries plus custom firmware, while the 28-pin UQFN (4x4 mm) package fits inside wrist-worn enclosures. AEC-Q100 is not required for these consumer medical devices, making the industrial-grade -I variant cost-optimal.
Recommandé
USB HID Consumer Peripherals
The PIC24FJ128GA702T-I/MV is a strong fit for USB Human Interface Devices such as keyboards, mice, game controllers, and presentation remotes. The 16-bit core handles USB protocol stack, HID report processing, and button/scroll debouncing at low CPU load, while the three UART, three SPI, and two I2C peripherals connect to BLE modules, NFC readers, or sensor add-ons. The 128KB Flash accommodates full USB stacks, HID class drivers, and customizable firmware for OEM branding. The 16KB RAM handles USB endpoint buffers plus HID report queues without dropping packets. The 28-pin UQFN package keeps the PCB small enough to fit inside slim consumer peripherals.
Recommandé
Industrial Sensor Conditioning and Control
The PIC24FJ128GA702T-I/MV is well-suited to industrial sensor conditioning and control loops. The 12-bit ADC at 200 ksps digitizes signals from bridge sensors, RTDs, and 4-20 mA current loops after external protection and amplification, while the three on-chip analog comparators implement fast over-current or over-voltage trip protection without ADC latency. The 16 MIPS CPU runs PID control loops at 10-50 kHz update rates for motor speed, valve positioning, or heater control. Multi-channel DMA offloads ADC scanning from the CPU, leaving headroom for communication stacks (Modbus RTU, CAN, Ethernet). The -I grade operating temperature (-40C to +85C) covers most factory-floor enclosures.
Recommandé
Smart Appliance Control Boards
The PIC24FJ128GA702T-I/MV integrates all the peripherals needed for smart appliance control boards: capacitive touch sensing via CTMU for glass-front control panels, ADC for temperature and current sensing, PWM timers for motor or heater control, and UART/SPI/I2C for wireless module connectivity. The 128KB Flash stores appliance control firmware plus optional BLE/Wi-Fi co-processor host drivers, while the 16KB RAM handles display buffers and communication queues. The 32 MHz CPU clock executes control loops fast enough to regulate compressor speed, induction heating, or BLDC motors in real time. The 28-pin UQFN (4x4 mm) package fits inside sealed appliance enclosures where condensation resistance and small PCB size matter.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ128GA702T-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA702-I/MV | PIC24FJ128GA702-E/MV | PIC24FJ128GA702T-I/ML | PIC24FJ128GA202-I/SS | PIC24FJ64GA702-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin UQFN (4x4 mm) | 28-pin UQFN (4x4 mm) - same | 28-pin UQFN (4x4 mm) - same | 28-pin QFN (6x6 mm) - larger | 28-pin SSOP - different | 28-pin UQFN (4x4 mm) - same |
| Program Memory (Flash) | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB |
| Maximum CPU Clock | 32 MHz (16 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | No | Yes |
| Packaging Format | Tape & Reel | Tray | Tray | Tape & Reel | Tube | Tray |
| Unit Price (qty-1, USD) | 4.18 | 4.18 | 4.95 | 4.30 | 3.95 | 3.45 |
Principaux différenciateurs
- Lowest-cost 128KB Flash variant in PIC24FJ128GA702 family (vs PIC24FJ256GA702 family)
- Smallest package footprint in family (vs PIC24FJ128GA702T-I/ML)
- CTMU + 12-bit ADC integration eliminates external touch front-end (vs PIC24FJ128GA202-I/SS)
Notes de conception
Estimated: At 32 MHz active current draw of approximately 8 mA (typical for PIC24FJ at 3.3V) versus 60 nA deep-sleep current, a duty-cycled application running 1% of the time averages ~140 uA. With a 220 mAh CR2032 coin cell, theoretical battery life is approximately 60 days at this duty cycle; real-world life is typically 40-50 days after accounting for self-discharge. Source: Microchip PIC24FJ128GA702 datasheet power section.
The 28-pin UQFN (4x4 mm) package has a center exposed thermal pad on pin 29 that must be soldered to a PCB land connected to VSS. This provides both ground reference and thermal dissipation (theta_JA approximately 30 C/W on a standard 4-layer JEDEC test board). A minimum of 9 thermal vias in the EP land is recommended for designs dissipating >0.5 W. Source: Microchip PIC24FJ128GA702 packaging specifications.
Do not leave the AVDD/AVSS pins unconnected even if the ADC is unused - the reference pins must be tied to the same potential as VDD/VSS through ferrite beads or 0-ohm resistors per datasheet recommendations. Unbonded analog supply pins can cause ADC offset errors and excessive current draw. Also configure unused GPIO pins as outputs driven low to minimize current leakage through floating inputs. Source: Microchip PIC24FJ128GA702 datasheet Section 4 (Power-Saving Features).
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C) is not AEC-Q100 qualified; this part is intended for industrial and consumer applications, not automotive safety-critical designs.
