PIC24FJ256GA702-I/SP - 256KB Flash 16-bit MCU | Microchip
Référence : PIC24FJ256GA702-I/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.68 | $46,80 |
| 100 | $4.15 | $415,00 |
| 500 | $3.75 | $1 875,00 |
| 1 000 | $3.35 | $3 350,00 |
PIC24FJ256GA702-I/SP Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals such as ADCs, timers, communication interfaces, and I/O ports. The PIC24F architecture is a 16-bit modified Harvard RISC core optimized for low-power embedded designs, sitting hierarchically between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts in Microchip's portfolio.
Key features include a wide 2.0V to 3.6V supply range, support for up to 14 analog input channels (depending on package), multiple serial interfaces (UART, SPI, I2C), a Real-Time Clock Calendar (RTCC), and eXtreme Low Power modes such as Deep Sleep, Sleep, and Idle that draw only microamp-level currents. The CTMU enables capacitive touch sensing without an external touch controller.
Architecturally, the device combines a 16-bit RISC core with a 24-bit instruction word, supporting 16 MIPS operation from a 32 MHz oscillator. ECC Flash provides single-bit error correction for enhanced reliability in safety-sensitive applications. The 12-bit ADC delivers up to 200 ksps and supports automatic scanning across multiple analog inputs, offloading the CPU for sensor-array applications.
Typical applications include low-power IoT sensor nodes, capacitive touch human-machine interfaces, industrial control and metering, medical portable devices, consumer electronics with USB or display connectivity, and automotive body modules where the -I (industrial) temperature grade of -40C to +85C is acceptable.
When designing with this device, ensure that VDD decoupling follows Microchip's reference layout: a 100 nF ceramic on each VDD/VDDCORE pin and a bulk 10 uF on the main rail. For touch applications, dedicate clean ground flooding beneath the CTMU-driven pads and add a guard ring to suppress moisture-induced false triggers.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical PCB/design notes that complement, not duplicate, the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24FJ256GA702-I/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GA702-I/SP (même facteur de forme et même empreinte) — différant par ADC, CTMU, Comparators, DMA, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ256GA702T-I/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ256GA702-E/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ256GA702-I/SP Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit RISC |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 256 KB with ECC |
| RAM | 16 KB |
| Boîtier | 28-pin SPDIP |
| Type de montage | Through-Hole |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 200 ksps |
| Analog Inputs (max) | Up to 14 channels (package-dependent) |
| Comparators | 3 |
| CTMU | Yes (touch/measurement) |
| DMA | Yes |
| RTCC | Yes (Real-Time Clock Calendar) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ256GA702-I/SP
| Broche 1 | MCLR — Master Clear (reset) input, active-low |
| Broche 2 | RA0 — I/O port A bit 0 / analog input AN0 |
| Broche 3 | RA1 — I/O port A bit 1 / analog input AN1 |
| Broche 4 | RB0 — I/O port B bit 0 / analog input AN2 / PGED1 |
| Broche 5 | RB1 — I/O port B bit 1 / analog input AN3 / PGEC1 |
| Broche 6 | RB2 — I/O port B bit 2 / analog input AN4 |
| Broche 7 | RB3 — I/O port B bit 3 / analog input AN5 |
| Broche 8 | VSS — Ground reference |
| Broche 9 | RA2 — I/O port A bit 2 / analog input AN6 / VREF- |
| Broche 10 | RA3 — I/O port A bit 3 / analog input AN7 / VREF+ |
| Broche 11 | RB4 — I/O port B bit 4 / analog input AN8 |
| Broche 12 | RB5 — I/O port B bit 5 / analog input AN9 |
| Broche 13 | RB6 — I/O port B bit 6 / analog input AN10 |
| Broche 14 | RB7 — I/O port B bit 7 / analog input AN11 |
| Broche 15 | VSS — Ground reference (second) |
| Broche 16 | VDD — Positive supply voltage |
| Broche 17 | RA4 — I/O port A bit 4 / analog input AN12 |
| Broche 18 | RA5 — I/O port A bit 5 / analog input AN13 |
| Broche 19 | RA6 — I/O port A bit 6 / OSC1 |
| Broche 20 | RA7 — I/O port A bit 7 / OSC2 |
| Broche 21 | RC0 — I/O port C bit 0 |
| Broche 22 | RC1 — I/O port C bit 1 |
| Broche 23 | RC2 — I/O port C bit 2 |
| Broche 24 | RC3 — I/O port C bit 3 |
| Broche 25 | RC4 — I/O port C bit 4 |
| Broche 26 | RC5 — I/O port C bit 5 |
| Broche 27 | RC6 — I/O port C bit 6 |
| Broche 28 | RC7 — I/O port C bit 7 |
Applications typiques
PIC24FJ256GA702-I/SP convient pour 6 applications: Low-Power IoT Sensor Nodes, Capacitive Touch HMI, Industrial Control and Metering, Medical Portable Devices, Consumer Electronics with USB, Automotive Body Modules.
Low-Power IoT Sensor Nodes
The PIC24FJ256GA702-I/SP suits battery-powered IoT sensor nodes thanks to its eXtreme Low Power modes (Deep Sleep currents in microamps), 256 KB ECC Flash for OTA-friendly firmware, and 16 KB RAM for sensor fusion buffers. At 32 MHz it performs 16 MIPS, fast enough for filtering and protocol stacks. The 12-bit ADC at 200 ksps captures environmental sensors with ample headroom; the integrated DMA offloads sensor reads from the CPU, allowing longer sleep intervals. Designers typically pair this MCU with an SPI-connected radio and coin-cell or Li-SOCl2 primary battery for multi-year lifetimes in remote deployments.
Recommandé
Capacitive Touch HMI
The integrated CTMU enables robust capacitive touch sensing on the PIC24FJ256GA702-I/SP, supporting buttons, sliders, and proximity wake-up without an external touch controller. Combined with the 12-bit ADC and DMA-driven scanning, it can service up to 14 touch electrodes while keeping CPU utilization low. The eXtreme Low Power Sleep with CTMU-based wake allows a touch panel to idle in nanoamp-range currents between user interactions. Designers should allocate dedicated PCB guard rings and route analog-capable pins adjacent to the touch electrodes for noise immunity.
Recommandé
Industrial Control and Metering
In industrial meters (energy, flow, gas), the PIC24FJ256GA702-I/SP provides the computational headroom for IEC-standard metering algorithms while its industrial -40C to +85C operating range ensures factory-floor reliability. The 12-bit ADC at 200 ksps, combined with the 3 on-chip comparators, allows direct sensing of current shunts, voltage dividers, and zero-cross detectors without external analog front ends. ECC Flash prevents parameter corruption from cosmic-ray-induced soft errors. The RTCC provides timestamped metering logs compliant with utility billing-grade requirements.
Recommandé
Medical Portable Devices
For portable medical devices such as pulse oximeters, glucose meters, and handheld diagnostic tools, the PIC24FJ256GA702-I/SP balances low power with sufficient performance. Its 16 MIPS core runs lightweight DSP routines for SpO2 or ECG filtering, while the 12-bit ADC samples sensor signals at 200 ksps. The CTMU supports touch-based user interfaces on medical-grade front panels. ECC Flash and the industrial temperature range are key for medical IEC 60601 reliability expectations; battery operation is supported by multiple low-power modes including Deep Sleep with RTCC wake.
Recommandé
Consumer Electronics with USB
The PIC24FJ256GA702-I/SP integrates a full-speed USB 2.0 device controller with internal transceiver, making it a cost-effective choice for consumer USB peripherals such as HID input devices, CDC-class bridges, and small audio streaming endpoints. 256 KB Flash accommodates USB stack plus application code, while 16 KB RAM handles USB endpoint buffers and application scratch. Designers can leverage Microchip's MLA (Microchip Libraries for Applications) USB stack to reduce firmware development time. eXtreme Low Power Sleep with USB-attached suspend current compliance is supported.
Recommandé
Automotive Body Modules
For non-safety automotive body electronics (interior lighting, HVAC controls, seat modules, door controllers), the PIC24FJ256GA702-I/SP provides adequate GPIO, ADC, and PWM channels in a through-hole 28-SPDIP that's friendly for module prototypes and aftermarket repairs. Designers targeting AEC-Q100 Grade 1 should instead choose the PIC24FJ256GA702-E/SP (extended temperature) variant. The 12-bit ADC, multiple timers, and DMA controller support motor control loops, LED dimming via PWM, and LIN/CAN-stack-friendly serial interfaces via bit-banging or external transceivers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GA702-I/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ256GA702T-I/SP | PIC24FJ256GA702-E/SP |
|---|---|---|---|
| Package | 28-pin SPDIP | 28-pin SPDIP (tape & reel) | 28-pin SPDIP (extended temp) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB ECC | 256 KB ECC | 256 KB ECC |
| RAM | 16 KB | 16 KB | 16 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| ADC | 12-bit, 200 ksps | 12-bit, 200 ksps | 12-bit, 200 ksps |
| CTMU (Touch) | Yes | Yes | Yes |
Principaux différenciateurs
- Highest-density 28-SPDIP PIC24F MCU with ECC Flash (vs PIC24FJ128GA702-I/SS)
- Industrial temperature grade at the lowest cost tier (vs PIC24FJ256GA702-E/SP)
- Through-hole SPDIP enables easy prototyping and rework (vs PIC24FJ256GA702-I/SO)
Notes de conception
Power supply decoupling is critical for MCU stability. Place a 100 nF low-ESR ceramic capacitor on each VDD pin (the 28-SPDIP exposes VDD on pin 21 and VSS on pin 15), plus a bulk 10 uF tantalum or ceramic on the main supply rail. For battery-powered designs, the on-chip LDO and Deep Sleep mode allow quiescent currents in the microamp range; refer to the eXtreme Low Power section of the datasheet for the exact Sleep/Idle/Deep Sleep current values at your operating VDD.
Route the analog signal traces (AN0-AN13) as short and direct as possible, keeping them away from switching digital lines. Use a ground plane under the MCU and surround analog pins with a guard trace tied to analog ground for noise-sensitive ADC measurements. For CTMU capacitive touch applications, dedicate unbroken copper pours beneath touch electrodes as the sense capacitor reference and route the CTMU output pin directly to the electrode without crossing other traces.
Common pitfalls: (1) omitting the MCLR pull-up resistor (typically 10 kohm to VDD) causes unreliable resets; (2) leaving the PGD/PGC pins unconfigured for ICSP prevents in-circuit programming; (3) using a crystal without proper loading capacitors on OSC1/OSC2 can prevent oscillation startup; (4) ignoring the VDD-vs-FCY derating table can lead to flash programming failures at lower voltages - ensure VDD >= 2.0V for full-speed 32 MHz operation per datasheet spec.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC24FJ256GA702-E/SP for extended-temperature or look for an explicit automotive-qualified PIC24F variant for AEC-Q100 deployment.
