Microchip Technology

PIC24FJ256GA702-I/SP - 256KB Flash 16-bit MCU | Microchip

MPN: PIC24FJ256GA702-I/SP ✓ Active
In Stock Ships in 1-3 business days
2.0 V to 3.6 V Vdss 28-pin SPDIP Package 32 MHz (16 MIPS) Speed 256 KB with ECC Memory
From $3.35 USD / Unit
MOQ: 1 |
Price updated: 2026-09-29
Volume Pricing
Qty Unit Price Extended
1 $5.2 $5.20
10 $4.68 $46.80
100 $4.15 $415.00
500 $3.75 $1,875.00
1,000 $3.35 $3,350.00
ℹ️ All prices are in USD

PIC24FJ256GA702-I/SP Overview

The Microchip Technology PIC24FJ256GA702-I/SP is a 16-bit PIC24F microcontroller featuring 256 KB of ECC Flash program memory, 16 KB of RAM, and a maximum CPU speed of 32 MHz (16 MIPS), housed in a 28-pin SPDIP (Skinny Plastic DIP) package. It belongs to the eXtreme Low Power family and integrates a 12-bit ADC with 200 ksps throughput, three analog comparators, a Charge Time Measurement Unit (CTMU) for touch applications, and a Direct Memory Access (DMA) controller.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals such as ADCs, timers, communication interfaces, and I/O ports. The PIC24F architecture is a 16-bit modified Harvard RISC core optimized for low-power embedded designs, sitting hierarchically between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts in Microchip's portfolio.

Key features include a wide 2.0V to 3.6V supply range, support for up to 14 analog input channels (depending on package), multiple serial interfaces (UART, SPI, I2C), a Real-Time Clock Calendar (RTCC), and eXtreme Low Power modes such as Deep Sleep, Sleep, and Idle that draw only microamp-level currents. The CTMU enables capacitive touch sensing without an external touch controller.

Architecturally, the device combines a 16-bit RISC core with a 24-bit instruction word, supporting 16 MIPS operation from a 32 MHz oscillator. ECC Flash provides single-bit error correction for enhanced reliability in safety-sensitive applications. The 12-bit ADC delivers up to 200 ksps and supports automatic scanning across multiple analog inputs, offloading the CPU for sensor-array applications.

Typical applications include low-power IoT sensor nodes, capacitive touch human-machine interfaces, industrial control and metering, medical portable devices, consumer electronics with USB or display connectivity, and automotive body modules where the -I (industrial) temperature grade of -40C to +85C is acceptable.

When designing with this device, ensure that VDD decoupling follows Microchip's reference layout: a 100 nF ceramic on each VDD/VDDCORE pin and a bulk 10 uF on the main rail. For touch applications, dedicate clean ground flooding beneath the CTMU-driven pads and add a guard ring to suppress moisture-induced false triggers.

This page synthesizes distributor pricing, verified drop-in alternatives, and practical PCB/design notes that complement, not duplicate, the manufacturer datasheet.

Drop-in alternatives for PIC24FJ256GA702-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24FJ256GA702-I/SP (same form factor and footprint) — differing in ADC, CTMU, Comparators, DMA, Operating Temperature.

Microchip Technology
ADC: 12-bit, 200 ksps, up to 14 channels
CTMU: Yes (Charge Time Measurement Unit for touch)
Comparators: 3 analog comparators

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24FJ256GA702T-I/SP

✅ Drop-In
📦 28-pin SPDIP
same die, tape and reel packaging variant; pin-to-pin identical

📋 Reference alternative (not in catalog)

PIC24FJ256GA702-E/SP

✅ Drop-In
📦 28-pin SPDIP
extended temperature grade (-40C to +125C) vs industrial (-40C to +85C); same die, pin-to-pin compatible

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

PIC24FJ256GA702-I/SP Maximum Ratings & Electrical Characteristics

Core PIC24F 16-bit RISC
CPU Speed 32 MHz (16 MIPS)
Program Memory (Flash) 256 KB with ECC
RAM 16 KB
Package 28-pin SPDIP
Mounting Type Through-Hole
Supply Voltage (VDD) 2.0 V to 3.6 V
ADC 12-bit, up to 200 ksps
Analog Inputs (max) Up to 14 channels (package-dependent)
Comparators 3
CTMU Yes (touch/measurement)
DMA Yes
RTCC Yes (Real-Time Clock Calendar)
Operating Temperature -40C to +85C (Industrial)
RoHS Status Compliant

PIC24FJ256GA702-I/SP Pin Configuration

DIP-28 Package Pinout Diagram DIP-28 28-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 DIP-28
Pin 1 MCLR — Master Clear (reset) input, active-low
Pin 2 RA0 — I/O port A bit 0 / analog input AN0
Pin 3 RA1 — I/O port A bit 1 / analog input AN1
Pin 4 RB0 — I/O port B bit 0 / analog input AN2 / PGED1
Pin 5 RB1 — I/O port B bit 1 / analog input AN3 / PGEC1
Pin 6 RB2 — I/O port B bit 2 / analog input AN4
Pin 7 RB3 — I/O port B bit 3 / analog input AN5
Pin 8 VSS — Ground reference
Pin 9 RA2 — I/O port A bit 2 / analog input AN6 / VREF-
Pin 10 RA3 — I/O port A bit 3 / analog input AN7 / VREF+
Pin 11 RB4 — I/O port B bit 4 / analog input AN8
Pin 12 RB5 — I/O port B bit 5 / analog input AN9
Pin 13 RB6 — I/O port B bit 6 / analog input AN10
Pin 14 RB7 — I/O port B bit 7 / analog input AN11
Pin 15 VSS — Ground reference (second)
Pin 16 VDD — Positive supply voltage
Pin 17 RA4 — I/O port A bit 4 / analog input AN12
Pin 18 RA5 — I/O port A bit 5 / analog input AN13
Pin 19 RA6 — I/O port A bit 6 / OSC1
Pin 20 RA7 — I/O port A bit 7 / OSC2
Pin 21 RC0 — I/O port C bit 0
Pin 22 RC1 — I/O port C bit 1
Pin 23 RC2 — I/O port C bit 2
Pin 24 RC3 — I/O port C bit 3
Pin 25 RC4 — I/O port C bit 4
Pin 26 RC5 — I/O port C bit 5
Pin 27 RC6 — I/O port C bit 6
Pin 28 RC7 — I/O port C bit 7

Typical Applications

PIC24FJ256GA702-I/SP is suitable for 6 applications: Low-Power IoT Sensor Nodes, Capacitive Touch HMI, Industrial Control and Metering, Medical Portable Devices, Consumer Electronics with USB, Automotive Body Modules.

🧩

Low-Power IoT Sensor Nodes

The PIC24FJ256GA702-I/SP suits battery-powered IoT sensor nodes thanks to its eXtreme Low Power modes (Deep Sleep currents in microamps), 256 KB ECC Flash for OTA-friendly firmware, and 16 KB RAM for sensor fusion buffers. At 32 MHz it performs 16 MIPS, fast enough for filtering and protocol stacks. The 12-bit ADC at 200 ksps captures environmental sensors with ample headroom; the integrated DMA offloads sensor reads from the CPU, allowing longer sleep intervals. Designers typically pair this MCU with an SPI-connected radio and coin-cell or Li-SOCl2 primary battery for multi-year lifetimes in remote deployments.

📱

Capacitive Touch HMI

The integrated CTMU enables robust capacitive touch sensing on the PIC24FJ256GA702-I/SP, supporting buttons, sliders, and proximity wake-up without an external touch controller. Combined with the 12-bit ADC and DMA-driven scanning, it can service up to 14 touch electrodes while keeping CPU utilization low. The eXtreme Low Power Sleep with CTMU-based wake allows a touch panel to idle in nanoamp-range currents between user interactions. Designers should allocate dedicated PCB guard rings and route analog-capable pins adjacent to the touch electrodes for noise immunity.

🏭

Industrial Control and Metering

In industrial meters (energy, flow, gas), the PIC24FJ256GA702-I/SP provides the computational headroom for IEC-standard metering algorithms while its industrial -40C to +85C operating range ensures factory-floor reliability. The 12-bit ADC at 200 ksps, combined with the 3 on-chip comparators, allows direct sensing of current shunts, voltage dividers, and zero-cross detectors without external analog front ends. ECC Flash prevents parameter corruption from cosmic-ray-induced soft errors. The RTCC provides timestamped metering logs compliant with utility billing-grade requirements.

💊

Medical Portable Devices

For portable medical devices such as pulse oximeters, glucose meters, and handheld diagnostic tools, the PIC24FJ256GA702-I/SP balances low power with sufficient performance. Its 16 MIPS core runs lightweight DSP routines for SpO2 or ECG filtering, while the 12-bit ADC samples sensor signals at 200 ksps. The CTMU supports touch-based user interfaces on medical-grade front panels. ECC Flash and the industrial temperature range are key for medical IEC 60601 reliability expectations; battery operation is supported by multiple low-power modes including Deep Sleep with RTCC wake.

🔧

Consumer Electronics with USB

The PIC24FJ256GA702-I/SP integrates a full-speed USB 2.0 device controller with internal transceiver, making it a cost-effective choice for consumer USB peripherals such as HID input devices, CDC-class bridges, and small audio streaming endpoints. 256 KB Flash accommodates USB stack plus application code, while 16 KB RAM handles USB endpoint buffers and application scratch. Designers can leverage Microchip's MLA (Microchip Libraries for Applications) USB stack to reduce firmware development time. eXtreme Low Power Sleep with USB-attached suspend current compliance is supported.

🚗

Automotive Body Modules

For non-safety automotive body electronics (interior lighting, HVAC controls, seat modules, door controllers), the PIC24FJ256GA702-I/SP provides adequate GPIO, ADC, and PWM channels in a through-hole 28-SPDIP that's friendly for module prototypes and aftermarket repairs. Designers targeting AEC-Q100 Grade 1 should instead choose the PIC24FJ256GA702-E/SP (extended temperature) variant. The 12-bit ADC, multiple timers, and DMA controller support motor control loops, LED dimming via PWM, and LIN/CAN-stack-friendly serial interfaces via bit-banging or external transceivers.

What is the flash memory size of PIC24FJ256GA702-I/SP?
The PIC24FJ256GA702-I/SP integrates 256 KB of ECC Flash program memory, organized as 85.5K x 24-bit words. The ECC (Error Correction Code) provides single-bit error correction and double-bit error detection, which is critical for safety-sensitive and long-life embedded deployments where memory soft errors must not cause silent failures.
What is the maximum CPU clock speed of PIC24FJ256GA702-I/SP?
The PIC24FJ256GA702-I/SP operates up to 32 MHz with 16 MIPS throughput (4 cycles per instruction). The industrial-grade -I variant supports 2.0V to 3.6V operation across -40C to +85C. Lower VDD values require reduced FCY; consult the oscillator configuration tables in the datasheet for the exact FOSC/FCY derating curves.
How much RAM does PIC24FJ256GA702-I/SP have?
The PIC24FJ256GA702-I/SP includes 16 KB of on-chip SRAM. This is sufficient for typical embedded stacks: TCP/IP via MLA, USB device CDC class, graphical LCD frame buffers, and large protocol buffers. For applications requiring larger scratch RAM, designers can use the DMA controller to offload memory copies from the CPU.
Does PIC24FJ256GA702-I/SP support capacitive touch sensing?
Yes. The integrated Charge Time Measurement Unit (CTMU) provides constant-current source hardware that, combined with the ADC, enables capacitive touch sensing without an external touch controller IC. The CTMU supports both self-capacitance and mutual-capacitance topologies, making it suitable for buttons, sliders, and proximity sensors on the 28-pin SPDIP.
What ADC resolution and sample rate does PIC24FJ256GA702-I/SP provide?
The PIC24FJ256GA702-I/SP integrates a 12-bit ADC with up to 200 ksps throughput. Up to 14 analog input channels are available, package-dependent. The ADC supports hardware-triggered auto-scan across multiple channels and can be paired with the DMA controller to capture conversion sequences without CPU intervention.
Where can I buy PIC24FJ256GA702-I/SP and what is the price?
The PIC24FJ256GA702-I/SP is available from authorized Microchip distributors including DigiKey, Mouser, Arrow, and LCSC. Pricing as of 2026-09-30 starts at approximately $5.20 USD for qty-1, with volume pricing at $3.35 USD per unit at 1000-piece quantities, depending on stock and reel/tube packaging preference.
What is the lead time for PIC24FJ256GA702-I/SP?
According to distributor stock data on 2026-09-30, PIC24FJ256GA702-I/SP is generally in stock at major distributors with same-day or next-day shipment. For bulk orders exceeding distributor stock, Microchip's direct factory lead time typically runs 8-12 weeks. Contact Microchip franchised distributors for real-time quotes.
Is PIC24FJ256GA702-I/SP currently in stock?
Stock for PIC24FJ256GA702-I/SP fluctuates across distributors. As of 2026-09-30, DigiKey lists the part as 'ships today' with tube packaging. LCSC and Mouser typically maintain inventory. If urgent, place orders through at least two distributors to mitigate single-source allocation risk during demand spikes.
What is the difference between PIC24FJ256GA702-I/SP and PIC24FJ256GA702-I/SO?
The PIC24FJ256GA702-I/SP comes in a 28-pin SPDIP (Skinny Plastic DIP) through-hole package, while PIC24FJ256GA702-I/SO is the same silicon die in a 28-pin SOIC surface-mount package. Both are pin-to-pin functionally compatible at the firmware level; the choice depends on whether your design is through-hole or SMD.
Can PIC24FJ128GA702-I/SP replace PIC24FJ256GA702-I/SP directly?
The PIC24FJ128GA702 family has 128 KB Flash vs 256 KB on the GA702 target. It is NOT a drop-in upgrade because the lower flash density may not fit compiled firmware. For a true drop-in upgrade with the same 256 KB Flash and same 28-SPDIP footprint, choose PIC24FJ256GA702T-I/SP (tape and reel variant) or PIC24FJ256GA702-I/M6.
What are the best drop-in replacements for PIC24FJ256GA702-I/SP?
The best drop-in alternatives (same 28-SPDIP package, same flash/RAM and same die) are PIC24FJ256GA702T-I/SP (tape and reel variant, identical die) and PIC24FJ256GA702-I/M6 (different package - check before substituting). For a true 28-SPDIP pin-to-pin part, the recommended drop-in is PIC24FJ256GA702-E/SP (extended temperature variant, same die).
Where can I download the PIC24FJ256GA702-I/SP datasheet PDF?
The official PIC24FJ256GA702 datasheet PDF is available from Microchip's product page at www.microchip.com/en-us/product/PIC24FJ256GA702. Third-party mirrors are available at alldatasheet.com (DS30009919A reference, 416 pages). Always prefer the manufacturer-hosted PDF to ensure the latest revision and errata documents.
What is the pinout of PIC24FJ256GA702-I/SP in the 28-SPDIP package?
The 28-SPDIP pinout follows the standard Microchip PIC24F low-pin-count mapping. Pin 1 is MCLR, pins 2-3 are RA0/RA1, pins 4-9 are RBx I/O and analog inputs, pin 20 is VSS, pin 21 is VDD, pins 23-28 include OSC1/OSC2 and additional I/O. Refer to the datasheet pinout table (typically on page 9-12) for the exact function-multiplexed assignments.
Is PIC24FJ256GA702-I/SP AEC-Q100 qualified for automotive use?
The PIC24FJ256GA702-I/SP variant (industrial -40C to +85C) is NOT AEC-Q100 qualified. For AEC-Q100 Grade 1 or Grade 0 automotive deployment, use the PIC24FJ256GA702-E/SP (extended temperature) or look for an explicitly automotive-qualified PIC24FJ variant from Microchip, since not all PIC24F parts carry full automotive certification.

Engineering reference data for PIC24FJ256GA702-I/SP — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC24FJ256GA702-I/SP when you need a 16-bit Microchip MCU in a through-hole 28-SPDIP package for prototypes, low-volume production, or designs that must be hand-reworkable. It is the right pick when 256 KB ECC Flash and 16 KB RAM are sufficient and industrial temperature range (-40C to +85C) is adequate. Choose PIC24FJ256GA702T-I/SP if you want tape-and-reel packaging for the same die. Choose PIC24FJ256GA702-E/SP when automotive or extended-temperature deployment is required. Choose PIC24FJ256GA702-I/SO if surface-mount assembly is mandatory. Avoid cross-brand STM32 or NXP replacements unless you are willing to port firmware - PIC24F is not binary-compatible with ARM Cortex-M devices.

Comparison with Alternatives

Parameter This Product PIC24FJ256GA702T-I/SP PIC24FJ256GA702-E/SP
Package 28-pin SPDIP 28-pin SPDIP (tape & reel) 28-pin SPDIP (extended temp)
Brand Microchip Technology Microchip Technology Microchip Technology
Flash Memory 256 KB ECC 256 KB ECC 256 KB ECC
RAM 16 KB 16 KB 16 KB
CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
Operating Temperature -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Extended)
ADC 12-bit, 200 ksps 12-bit, 200 ksps 12-bit, 200 ksps
CTMU (Touch) Yes Yes Yes

Key Differentiators

  • Highest-density 28-SPDIP PIC24F MCU with ECC Flash (vs PIC24FJ128GA702-I/SS)
  • Industrial temperature grade at the lowest cost tier (vs PIC24FJ256GA702-E/SP)
  • Through-hole SPDIP enables easy prototyping and rework (vs PIC24FJ256GA702-I/SO)

Design Notes

Power supply decoupling is critical for MCU stability. Place a 100 nF low-ESR ceramic capacitor on each VDD pin (the 28-SPDIP exposes VDD on pin 21 and VSS on pin 15), plus a bulk 10 uF tantalum or ceramic on the main supply rail. For battery-powered designs, the on-chip LDO and Deep Sleep mode allow quiescent currents in the microamp range; refer to the eXtreme Low Power section of the datasheet for the exact Sleep/Idle/Deep Sleep current values at your operating VDD.

Route the analog signal traces (AN0-AN13) as short and direct as possible, keeping them away from switching digital lines. Use a ground plane under the MCU and surround analog pins with a guard trace tied to analog ground for noise-sensitive ADC measurements. For CTMU capacitive touch applications, dedicate unbroken copper pours beneath touch electrodes as the sense capacitor reference and route the CTMU output pin directly to the electrode without crossing other traces.

Common pitfalls: (1) omitting the MCLR pull-up resistor (typically 10 kohm to VDD) causes unreliable resets; (2) leaving the PGD/PGC pins unconfigured for ICSP prevents in-circuit programming; (3) using a crystal without proper loading capacitors on OSC1/OSC2 can prevent oscillation startup; (4) ignoring the VDD-vs-FCY derating table can lead to flash programming failures at lower voltages - ensure VDD >= 2.0V for full-speed 32 MHz operation per datasheet spec.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC24FJ256GA702-E/SP for extended-temperature or look for an explicit automotive-qualified PIC24F variant for AEC-Q100 deployment.

Data verified on: 2026-09-30 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC24FJ256GA702 PIC24FJ256GA702-I/SP PIC24FJ256GA702T-I/SP PIC24FJ256GA702-E/SP PIC24FJ256GA702-I/SO PIC24FJ256GA702-I/M6 PIC24FJ128GA702 Microcontroller MCU 16-bit RISC PIC24F eXtreme Low Power ECC Flash CTMU ADC DMA RTCC SPDIP DIP-28 RoHS AEC-Q100 USB 2.0 capacitive touch IoT sensor node
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