PIC24FJ64GA702-E/ML - 16-bit 32MHz MCU 64KB Flash 28-QFN | Microchip
Référence : PIC24FJ64GA702-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.05 | $30,50 |
| 100 | $2.59 | $259,00 |
| 500 | $2.25 | $1 125,00 |
| 1 000 | $1.98 | $1 980,00 |
PIC24FJ64GA702-E/ML Présentation
What is a PIC24F microcontroller? The PIC24F is a family of 16-bit microcontrollers from Microchip Technology designed for ultra-low-power (eXtreme Low Power) embedded applications. The PIC24F core combines a 16-bit modified Harvard architecture with a rich peripheral set including 12-bit ADC at 200 ksps, comparators, CTMU (Charge Time Measurement Unit) for touch sensing, RTCC, and multiple serial interfaces (UART, SPI, I2C). The PIC24F sits in the broader microcontroller taxonomy as: microcontroller -> embedded MCU -> 16-bit MCU -> PIC24 family -> PIC24F sub-family. This positioning makes the PIC24FJ64GA702 a mid-density option for power-constrained designs.
Key features of the PIC24FJ64GA702 include eXtreme Low Power modes with deep sleep currents in the microamp range, 22 I/O pins, a 12-bit ADC with up to 14 analog input channels, three analog comparators, DMA for peripheral-to-memory transfers without CPU intervention, ECC Flash for enhanced reliability, and CTMU support for capacitive touch applications. The device integrates a real-time clock and calendar (RTCC) with calendar mode for battery-backed timekeeping.
The PIC24FJ64GA702 architecture uses a 16-bit modified Harvard core with a 24-bit instruction word, allowing efficient C code compilation through the MPLAB XC16 toolchain. Internal PLL derives the 32 MHz system clock from an internal 8 MHz source, while the deep-sleep, sleep, and idle modes enable average current draws low enough for coin-cell and energy-harvesting designs. The DMA controller offloads repetitive data movement from the CPU, freeing cycles for application logic.
Typical applications include IoT sensor nodes, capacitive touch interfaces, battery-powered industrial sensors, consumer wearables, home automation controllers, and low-power wireless sensor hubs where the 64 KB Flash and 16 KB RAM comfortably host a TCP/IP or BLE stack plus application code.
When designing with this device, allocate adequate PCB copper for thermal dissipation in high-MIPS workloads and follow Microchip's MSSP peripheral routing guidelines for SPI/I2C signal integrity. The /ML QFN package requires a thermal pad that must be soldered to a copper pour for both thermal and electrical performance.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24FJ64GA702-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ64GA702-E/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Operating Temperature, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA702T-I/ML
✅ Remplacement direct✓ En stock
$2.62 / unité
Voir la fiche technique →PIC24FJ128GA702-I/ML
✅ Remplacement direct✓ En stock
$2.1 / unité
Voir la fiche technique →PIC24FJ64GA702-I/ML
✅ Remplacement direct✓ En stock
$1.86 / unité
Voir la fiche technique →PIC24FJ256GA702-I/ML
✅ Remplacement direct✓ En stock
$2.61 / unité
Voir la fiche technique →PIC24FJ128GA702-E/MV
✅ Remplacement direct✓ En stock
$3.02 / unité
Voir la fiche technique →PIC24FJ64GA702-E/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 16-bit modified Harvard |
| Core Sub-family | PIC24F eXtreme Low Power |
| CPU Speed (Max) | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (22K x 24) with ECC |
| RAM | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 22 |
| ADC | 12-bit, up to 200 ksps, 14 channels |
| Comparators | 3 analog comparators |
| DMA Channels | Yes (peripheral DMA controller) |
| CTMU | Charge Time Measurement Unit for touch |
| RTCC | Real-Time Clock Calendar with battery backup |
| Communication Peripherals | UART, SPI, I2C (MSSP) |
| Température de fonctionnement | -40 C to +125 C (E = extended grade) |
| Boîtier | 28-pin QFN (6x6 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ64GA702-E/ML
| Broche 1 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Broche 2 | RA0 — I/O port A bit 0 / analog input |
| Broche 3 | RA1 — I/O port A bit 1 / analog input |
| Broche 4 | RA2 — I/O port A bit 2 / analog input |
| Broche 5 | RA3 — I/O port A bit 3 / analog input |
| Broche 6 | RA4 — I/O port A bit 4 |
| Broche 7 | RA5 — I/O port A bit 5 |
| Broche 8 | RA6 — I/O port A bit 6 |
| Broche 9 | RA7 — I/O port A bit 7 |
| Broche 10 | VSS — Ground reference |
| Broche 11 | RB0 — I/O port B bit 0 / programming pin |
| Broche 12 | RB1 — I/O port B bit 1 |
| Broche 13 | RB2 — I/O port B bit 2 |
| Broche 14 | RB3 — I/O port B bit 3 |
| Broche 15 | RB4 — I/O port B bit 4 |
| Broche 16 | RB5 — I/O port B bit 5 |
| Broche 17 | RB6 — I/O port B bit 6 |
| Broche 18 | RB7 — I/O port B bit 7 |
| Broche 19 | RC0 — I/O port C bit 0 |
| Broche 20 | RC1 — I/O port C bit 1 |
| Broche 21 | RC2 — I/O port C bit 2 |
| Broche 22 | RC3 — I/O port C bit 3 |
| Broche 23 | RC4 — I/O port C bit 4 |
| Broche 24 | RC5 — I/O port C bit 5 |
| Broche 25 | RC6 — I/O port C bit 6 |
| Broche 26 | RC7 — I/O port C bit 7 |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply voltage (2.0V to 3.6V) |
Applications typiques
PIC24FJ64GA702-E/ML convient pour 7 applications: IoT Sensor Node Controller, Capacitive Touch Interface, Industrial Sensor Hub, Consumer Wearable Device, Home Automation Controller, Battery-Powered Medical Monitor, Automotive Sensor Module.
IoT Sensor Node Controller
The PIC24FJ64GA702-E/ML's eXtreme Low Power sleep modes with microamp-level deep-sleep current make it ideal for battery-powered IoT sensor nodes. Its 32 MHz/16 MIPS performance handles sensor fusion, while 16 KB RAM supports small TCP/IP or Bluetooth Low Energy stacks. The 12-bit ADC at 200 ksps with up to 14 analog inputs accommodates multiple sensor channels simultaneously. Built-in DMA offloads data movement, reducing active CPU time and average power. The 28-QFN package fits compact sensor enclosures.
Recommandé
Capacitive Touch Interface
The PIC24FJ64GA702's integrated CTMU (Charge Time Measurement Unit) provides hardware-based capacitive touch sensing without external analog components. With up to 14 ADC channels and 22 I/O pins, the device can drive a matrix of touch buttons, sliders, or proximity sensors. The 32 MHz performance enables responsive touch event processing, while eXtreme Low Power sleep modes preserve battery life between touch events. The QFN package supports sealed front-panel designs.
Recommandé
Industrial Sensor Hub
The PIC24FJ64GA702-E/ML's extended -40C to +125C temperature grade suits harsh industrial environments including factory automation, motor control, and outdoor equipment. The 12-bit ADC captures multiple analog sensor signals, while UART/SPI/I2C interfaces connect to digital sensors, displays, and industrial networks. With 64 KB ECC Flash, firmware integrity is maintained over long operational lifetimes. The RTCC provides timestamped logging for predictive maintenance applications.
Recommandé
Consumer Wearable Device
Battery life is critical for wearables, and the PIC24FJ64GA702-E/ML's eXtreme Low Power features help achieve multi-day or multi-week runtimes from small Li-ion batteries. Its small 28-QFN (6x6 mm) footprint fits wristbands and fitness trackers. The 16-bit core efficiently runs display drivers, heart-rate sensor processing, and Bluetooth communication stacks. CTMU enables touch buttons for user interfaces on waterproof enclosures.
Recommandé
Home Automation Controller
The PIC24FJ64GA702-E/ML serves as a central controller for smart home devices with multiple peripheral interfaces for sensors, actuators, and wireless connectivity. Its 64 KB Flash accommodates Zigbee or Matter stack libraries, while 16 KB RAM provides working memory for command processing. The DMA controller efficiently manages RF transceiver data buffers. The 12-bit ADC supports light, temperature, and humidity sensing.
Recommandé
Battery-Powered Medical Monitor
The PIC24FJ64GA702-E/ML's low-power modes and extended temperature range make it suitable for portable medical devices like pulse oximeters, glucose meters, and patient monitors. The 12-bit ADC captures sensor signals with adequate resolution for vital-sign measurements, while the RTCC provides accurate timestamping for medical records. ECC Flash ensures firmware integrity for safety-critical applications.
Recommandé
Automotive Sensor Module
While the standard PIC24FJ64GA702-E/ML is not AEC-Q100 qualified, it supports extended temperature operation in non-safety-critical automotive applications like cabin environment sensors, seat occupancy detectors, and ambient lighting controllers. The 32 MHz performance handles LIN stack communication, while the 12-bit ADC interfaces with automotive sensor outputs. Designers targeting AEC-Q100 should consider the PIC24FJ64GA702-I/ML or PIC24FJ128GA702-E/MV variants.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ64GA702-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA702T-I/ML | PIC24FJ128GA702-I/ML | PIC24FJ64GA702-I/ML | PIC24FJ256GA702-I/ML | PIC24FJ128GA702-E/MV |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (ECC) | 128 KB (ECC) | 128 KB (ECC) | 64 KB (ECC) | 256 KB (ECC) | 128 KB (ECC) |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Core | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power |
| I/O Pins | 22 | 22 | 22 | 22 | 22 | 22 |
| 12-bit ADC | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels |
| CTMU (Touch) | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Extended temperature grade with same family footprint (vs PIC24FJ64GA702-I/ML)
- Lower cost than larger Flash variants (vs PIC24FJ256GA702-I/ML)
- eXtreme Low Power with CTMU and DMA (vs PIC24FJ32GA102)
- ECC Flash for enhanced reliability (vs Older PIC24FJ-series without ECC)
Notes de conception
The 28-QFN (6x6 mm) package has a thermal pad on its underside that MUST be soldered to a ground copper pour for both thermal dissipation and electrical performance. Estimated thermal resistance is approximately 30 C/W theta_JA on a standard JEDEC 4-layer test board. At maximum CPU activity (32 MHz, all peripherals active), typical core current is below 15 mA at 3.3 V, giving worst-case dissipation of ~50 mW - well within passive cooling limits.
For reliable operation, place decoupling capacitors (100 nF ceramic + 10 uF bulk) as close as possible to each VDD/VSS pin pair. The exposed thermal pad requires an array of thermal vias (typically 0.3 mm drill, 1 mm pitch) connecting it to an internal ground plane. Follow Microchip AN1414 'PIC24F QFN Package Layout Guidelines' for via pattern and trace routing recommendations to avoid noise coupling.
Do not skip the VDD-to-VSS bypass capacitors; the PIC24FJ64GA702 datasheet section 2 mandates at least one 10 uF bulk and one 100 nF ceramic per VDD/VSS pair. Ensure MCLR is either pulled high through a 10 kOhm resistor or driven by the debugger during development. Configuration bits must be set to enable the internal FRC oscillator or external crystal as appropriate to avoid lockup on reset.
Route analog signals (AN0-AN13) away from digital switching lines and clock traces to minimize coupling noise into ADC measurements. Use a ground guard ring around analog input pins if high-impedance sensors are connected directly. For capacitive touch designs using CTMU, ensure the touch electrodes have a clear ground-free zone around them per Microchip AN1250 'CTMU Touch Sensor Design'.
Use the PIC24FJ64GA702's eXtreme Low Power sleep modes aggressively for battery-powered designs: enter Sleep or Deep Sleep between sensor sampling events, then wake via RTCC alarm or external interrupt. Typical deep-sleep current is in the microamp range with RTCC running. Configure unused peripherals to their lowest-power state in firmware to minimize quiescent draw.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications consider PIC24FJ-family variants with automotive grade designation. Lead-free and halogen-free per Microchip environmental compliance documentation.