PIC24FJ256GA702-I/ML - 16-bit 256KB Flash MCU, 28-QFN | Microchip
MPN: PIC24FJ256GA702-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.52 | $4.52 |
| 10 | $4.07 | $40.70 |
| 100 | $3.62 | $362.00 |
| 500 | $3.26 | $1,630.00 |
| 1,000 | $2.9 | $2,900.00 |
| 3,000 | $2.61 | $7,830.00 |
PIC24FJ256GA702-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a configurable peripheral set. The PIC24F family sits in the broader taxonomy of microcontrollers -> embedded controllers -> semiconductors. The 'FJ' suffix indicates Flash program memory with enhanced features including Error-Correcting Code (ECC) for improved reliability in safety-sensitive applications, while the '256GA702' designator specifies 256 KB of Flash in the GA702 pin/package variant.
Key differentiating specifications include 256 KB ECC Flash organized as 85.5K x 24 words, 16 KB SRAM, hardware DMA for peripheral-to-memory transfers without CPU intervention, eXtreme Low Power modes achieving sub-microamp sleep currents, and integrated peripherals including I2C, SPI, UART, and a 12-bit 200 ksps ADC. The device operates from 2.0V to 3.6V and supports -40C to +85C industrial temperature range (denoted by the 'I' suffix).
Architecturally, the PIC24FJ256GA702 uses Microchip's modified Harvard architecture with separate program and data paths, a 16-bit data path, and a 24-bit instruction word. The ECC Flash implementation detects and corrects single-bit errors, which is critical for medical, industrial, and automotive applications where flash bit-flip reliability matters. Hardware DMA channels offload repetitive data movement between peripherals and RAM, freeing the CPU for application logic.
Typical applications include low-power IoT sensor nodes, capacitive touch user interfaces, industrial control panels, USB device peripherals, home appliances, portable medical monitors, and battery-powered instrumentation. The combination of large memory, XLP technology, and rich analog peripherals makes it particularly suitable for human-machine interface (HMI) designs requiring touch buttons or sliders.
When designing with this part, ensure the exposed pad (EP) of the QFN package is soldered to a sufficient ground copper pour for both thermal dissipation and low-impedance ground return. Programming is performed via ICSP (In-Circuit Serial Programming) using PGEDx/PGECx pins shared with general I/O - assign them carefully in the pin allocator to avoid bus conflicts during field updates.
This page synthesizes distributor pricing, drop-in alternative inventory, and practical design notes that go beyond the manufacturer datasheet, with all data verified as of 2026-09-30.
Drop-in alternatives for PIC24FJ256GA702-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ256GA702-I/ML (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, ADC, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ128GA702-I/ML
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →PIC24FJ256GA702-I/MV
✅ Drop-In✓ In Stock
$2.83 / Unit
View Datasheet →PIC24FJ256GA702T-I/ML
✅ Drop-In✓ In Stock
$2.93 / Unit
View Datasheet →PIC24FJ128GA702T-I/ML
✅ Drop-In✓ In Stock
$2.62 / Unit
View Datasheet →PIC24FJ128GA702-E/MV
✅ Drop-In✓ In Stock
$3.02 / Unit
View Datasheet →PIC24FJ256GA702-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit modified Harvard |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash Memory | 256 KB (85.5K x 24) with ECC |
| SRAM | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Operating Temperature Range | -40C to +85C (Industrial, 'I' suffix) |
| ADC | 12-bit, 200 ksps, up to 14 analog inputs |
| Analog Comparators | 3 |
| CTMU (Capacitive Touch) | Yes |
| DMA Channels | Yes (hardware DMA) |
| eXtreme Low Power (XLP) | Yes (multiple sleep modes) |
| Package | 28-pin QFN (ML) with exposed pad, 6x6 mm |
| Mounting Type | Surface Mount |
| Communication Peripherals | I2C, SPI, UART |
| RoHS Status | Compliant |
PIC24FJ256GA702-I/ML Pin Configuration
| Pin 1 | RA0 — Port A bit 0 / analog input AN0 / VREF+ |
| Pin 2 | RA1 — Port A bit 1 / analog input AN1 |
| Pin 3 | RA2 — Port A bit 2 / analog input AN2 |
| Pin 4 | RA3 — Port A bit 3 / analog input AN3 |
| Pin 5 | VDD — Positive supply voltage (2.0-3.6V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RA4 — Port A bit 4 / analog input AN4 / CTMU |
| Pin 8 | RA5 — Port A bit 5 / analog input AN5 |
| Pin 9 | RA6 — Port A bit 6 / oscillator input |
| Pin 10 | RA7 — Port A bit 7 / oscillator output |
| Pin 11 | RB0 — Port B bit 0 / programming clock PGEC1 |
| Pin 12 | RB1 — Port B bit 1 / programming data PGED1 |
| Pin 13 | RB2 — Port B bit 2 / analog input AN8 |
| Pin 14 | RB3 — Port B bit 3 / analog input AN9 |
| Pin 15 | RB4 — Port B bit 4 / analog input AN10 / CTMU |
| Pin 16 | RB5 — Port B bit 5 / analog input AN11 / CTMU |
| Pin 17 | RB6 — Port B bit 6 / programming clock PGEC2 |
| Pin 18 | RB7 — Port B bit 7 / programming data PGED2 |
| Pin 19 | VUSB3V3 — USB internal 3.3V regulator output (bypass required) |
| Pin 20 | VSS — Ground reference |
| Pin 21 | D+ — USB D+ data line |
| Pin 22 | D- — USB D- data line |
| Pin 23 | RC0 — Port C bit 0 / analog input AN12 |
| Pin 24 | RC1 — Port C bit 1 / analog input AN13 |
| Pin 25 | RC2 — Port C bit 2 / analog input AN14 |
| Pin 26 | RC3 — Port C bit 3 / analog input AN15 |
| Pin 27 | RC4 — Port C bit 4 |
| Pin 28 | RC5 — Port C bit 5 |
| Pin 29 | EP — Exposed pad - must be soldered to ground for thermal/electrical performance |
Typical Applications
PIC24FJ256GA702-I/ML is suitable for 6 applications: Low-Power IoT Sensor Node, Capacitive Touch User Interface, Industrial Control Panel, USB Device Peripheral, Portable Medical Monitor, Battery-Powered Home Appliance.
Low-Power IoT Sensor Node
The PIC24FJ256GA702-I/ML is engineered for battery-powered IoT sensor nodes that must operate for years on a single cell. The eXtreme Low Power (XLP) sleep modes draw under 1 uA typical with full RAM retention, while the 12-bit 200 ksps ADC digitizes sensor outputs (temperature, humidity, light, accelerometer) directly without external analog front-ends. The 256 KB ECC Flash comfortably hosts an OTA-capable bootloader plus application firmware, and hardware DMA offloads peripheral-to-memory transfers so the core can remain asleep longer between wakes. Operating from 2.0-3.6 V also allows direct connection to a single CR2032 (3.0V) or two-AA-cell stack with a buck converter, eliminating expensive power management overhead at the system level.
Recommended
Capacitive Touch User Interface
The integrated CTMU (Charge Time Measurement Unit) combined with the 12-bit ADC makes the PIC24FJ256GA702-I/ML a strong fit for capacitive touch buttons, sliders, and proximity-sensing HMIs. The CTMU supplies a constant current to a touch electrode, and the ADC measures the charge time, which varies with capacitance change caused by a finger touch. This eliminates external touch ICs and supports up to 14 analog inputs that can be reconfigured as touch channels. The 32 MHz / 16 MIPS core executes mTouch reference firmware with sub-10 ms scan times even on dense 16-button panels, while XLP sleep between scans preserves battery life in portable products such as induction cooktops, smart locks, and white goods front panels.
Recommended
Industrial Control Panel
Industrial control panels demand reliable operation across -40C to +85C with immunity to electrical noise, both of which the PIC24FJ256GA702-I/ML's industrial-grade silicon and 28-QFN exposed-pad thermal dissipation support. The 16 MIPS PIC24F core runs Modbus RTU or CANopen stacks over UART/SPI without timing bottlenecks, while the 12-bit ADC monitors 4-20 mA analog sensor inputs (after current-sense conversion) at 200 ksps with hardware averaging. ECC Flash protects against bit-flip-induced crashes in factory-floor environments with elevated EMI, and hardware DMA continuously streams ADC samples to RAM for FFT-based vibration analysis on motors and pumps - common predictive-maintenance use cases the MCU's memory and throughput comfortably handle.
Recommended
USB Device Peripheral
The PIC24FJ256GA702 family integrates a USB 2.0 Full-Speed device controller with on-chip transceiver, eliminating external PHY chips and reducing BOM for USB peripherals such as HID input devices, CDC serial converters, and custom vendor-class gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application code, while 16 KB RAM handles USB endpoint buffers and protocol overhead without thrashing. The 28-QFN package fits small dongle-style enclosures, and DMA streams USB endpoint data directly to/from RAM, freeing the CPU for application logic. Operating from 3.3V with the on-chip 3.3V USB transceiver simplifies the power tree compared to 5V-only USB MCUs that need level shifters.
Recommended
Portable Medical Monitor
The PIC24FJ256GA702-I/ML supports portable medical monitors such as pulse oximeters, glucometers, and wearable health patches by combining low power, large Flash for application algorithms, and analog front-end integration. The 12-bit ADC at 200 ksps digitizes photodiode or electrochemical sensor outputs, while the 3 analog comparators handle threshold detection for safety alarms without software polling delays. XLP sleep modes draw sub-microamp currents between measurements, extending battery life to weeks on a single coin cell. ECC Flash prevents silent firmware corruption that could compromise patient safety, and the industrial temperature range supports operation in cold or warm clinical environments. Note: medical certifications require system-level IEC 60601-1 compliance beyond the MCU itself.
Recommended
Battery-Powered Home Appliance
Battery and mains-battery hybrid appliances such as cordless vacuums, robotic vacuum cleaners, smart thermostats, and wireless doorbells benefit from the PIC24FJ256GA702-I/ML's blend of low power, peripherals, and Flash capacity. The CTMU enables touch-button interfaces on appliances, the ADC monitors battery voltage and motor current via shunt resistors, and DMA offloads repetitive peripheral servicing to reduce active CPU time and save milliamp-hours per day. The 16 MIPS core drives small TFT displays via SPI for thermostat UIs, and the 256 KB Flash stores multi-language firmware variants plus graphical assets. The 28-QFN exposed-pad package handles brief motor-driver feedback surges through its low thermal resistance while keeping the BOM compact.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ256GA702-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ128GA702-I/ML | PIC24FJ256GA702-I/MV | PIC24FJ256GA702T-I/ML | PIC24FJ128GA702T-I/ML | PIC24FJ128GA702-E/MV |
|---|---|---|---|---|---|---|
| Package | 28-pin QFN (ML) | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB ECC | 128 KB ECC (-50%) | 256 KB ECC (same) | 256 KB ECC (same) | 128 KB ECC (-50%) | 128 KB ECC (-50%) |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Temperature Grade | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (E grade) |
| ADC | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch |
| USB 2.0 FS | Yes (device) | Yes (device) | Yes (device) | Yes (device) | Yes (device) | Yes (device) |
Key Differentiators
- 256 KB Flash with hardware ECC for safety-critical firmware reliability (vs PIC24FJ128GA702-I/ML)
- eXtreme Low Power (XLP) sleep currents under 1 uA with full RAM retention (vs PIC24FJ256DA206-I/PT (64-pin cousin))
- Integrated CTMU for capacitive touch without external ICs (vs PIC24FJ16MC102T-I/ML (Motor Control variant))
- 28-pin QFN with compact 6x6 mm footprint for space-constrained designs (vs PIC24FJ256GA702-I/SS (28-pin SSOP))
Design Notes
The 28-QFN /ML package has an exposed thermal pad on pin 29 that MUST be soldered to a ground copper pour with multiple thermal vias to the inner ground plane. The exposed pad provides the primary thermal dissipation path (theta-JA on a 4-layer JEDEC test board is approximately 31 C/W) and also serves as the lowest-impedance ground return for EMC performance. Estimated: skipping the exposed-pad solder connection will raise junction temperature by 20-30 C at moderate loads and degrade ESD immunity on USB and analog pins.
Place a 10 uF bulk capacitor and a 100 nF decoupling capacitor within 5 mm of the VDD pin (pin 5), plus a second 100 nF near VUSB3V3 (pin 19). The internal USB 3.3V regulator requires its own 0.1 uF + 4.7 uF bypass network on pin 19 even if USB is unused, otherwise the regulator may oscillate. Use low-ESR ceramic capacitors (X5R/X7R) - tantalum or aluminum electrolytic on VDD will cause poor load-step response during DMA bursts to RAM.
ICSP programming uses PGEC1/PGED1 (RB0/RB1) and PGEC2/PGED2 (RB6/RB7) pins. If your application assigns RB0 or RB1 as outputs driving LEDs or relays, the in-circuit programmer cannot establish communication during field updates. Either dedicate these pins to programming-only use, add a programming header that overrides the loading, or use the bootloader via USB. Also note: the CTMU current source shares analog pins AN4/AN10/AN11 - do not route these to high-impedance external circuitry without buffering or the touch scan will be perturbed by leakage.
USB D+/D- traces (pins 21/22) must be routed as a 90-ohm differential pair with matched length (delta < 2 mm) and a continuous ground reference beneath them. Avoid routing the USB pair near switching nodes like DC-DC converters or PWM outputs; USB Full-Speed signaling has tight edge rates (12 Mbps, ~10 ns rise time) that couple aggressively to nearby aggressors. Place the 15 kohm pull-up resistor on D- (for full-speed device) or D+ (for low-speed) within 4 mm of the MCU pin.
The PIC24FJ256GA702-I/ML at 32 MHz active draws ~10 mA typical (about 30 mW at 3.3V); in XLP sleep with peripherals off, current drops to sub-1 uA. In a duty-cycled sensor application (1% active, 99% sleep), estimated average consumption is ~100 uA at 3.3V (~330 uW). Estimated: this allows roughly 2.5 years of continuous operation on a 2000 mAh CR2032-style cell, though actual lifetime is limited by battery self-discharge (1-2%/year for Li primaries). Verify with real-system measurements rather than datasheet minimums.
Compliance Information
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - this is a general-purpose MCU; AEC-Q100 variants exist in the PIC24F family but the GA702-I/ML is industrial grade. Lead-free (Pb-free) packaging confirmed via Microchip packaging materials datasheet.
