PIC24FV16KM202-E/SP - 16KB Flash 32MHz XLP 16-bit MCU | Microchip
Référence : PIC24FV16KM202-E/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.85 | $38,50 |
| 100 | $3.42 | $342,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.71 | $2 710,00 |
PIC24FV16KM202-E/SP Présentation
A 16-bit microcontroller (MCU) is a microprocessor core that fetches and executes 16-bit-wide instructions from non-volatile Flash memory. The PIC24F family uses a modified Harvard RISC architecture that combines predictable instruction timing with rich peripheral integration. Within the power-management IC ecosystem, XLP microcontrollers sit alongside LDO regulators, supervisors, and motor drivers as the lowest-power computing tier for battery-powered products such as wearables, sensor nodes, and portable instrumentation. The V prefix denotes a wide operating-voltage part compatible with 2.5V, 3.3V and 5V rails.
Key features of this device include four 16-bit timers, multiple UART/SPI/I2C interfaces, a 12-bit ADC with up to 500 ksps throughput, hardware multiply and divide for signal-processing efficiency, and an integrated temperature indicator. The 32 MHz MIPS performance delivers up to 16 MIPS throughput while the XLP technology enables sub-uA sleep currents critical for battery-backed designs. The 28-SPDIP package is through-hole-friendly for prototyping and breadboarding while remaining RoHS-compliant.
This device uses Microchip's eXtreme Low Power architecture, which combines a deep-sleep current under 1 uA with fast wake-up time and peripheral operation retention, enabling products that operate for years on a single CR2032 cell. The on-chip op amps, comparators and 8-bit DAC reduce BOM cost in sensor-conditioning circuits, while the Configurable Logic Cell provides hardware glue logic without external CPLDs.
Typical applications include portable medical monitoring, IoT sensor nodes, battery-powered industrial sensors, low-power wireless remote controls, and consumer health wearables. The combination of analog integration, XLP sleep modes, and 5V-tolerant I/O makes the part suitable for retrofits into legacy 5V designs as well as new battery products.
When designing with this part, place the 10 uF and 0.1 uF decoupling capacitor pair as close as possible to the VDD and VSS pins. Configure unused I/O as outputs low to minimize sleep current, and use the deep-sleep mode with RTCC for periodic wake applications.
This page synthesizes distributor pricing, drop-in PIC24F same-package alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24FV16KM202-E/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FV16KM202-E/SP (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Operating Voltage Range, DAC, Maximum CPU Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24F16KM202-I/SP
✅ Remplacement direct✓ En stock
$2.25 / unité
Voir la fiche technique →PIC24FV16KM202-E/SP Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 16-bit RISC modified Harvard |
| Family | PIC XLP 24F |
| Program Memory (Flash) | 16 KB (5.5K x 24 instructions) |
| Data RAM | 2 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage Range | 2.5 V / 3.3 V / 5 V |
| ADC | 12-bit |
| DAC | 8-bit |
| Operational Amplifiers | Integrated (on-chip) |
| Timers | 4 x 16-bit |
| Communication | UART, SPI, I2C |
| PWM / CCP | Flexible Capture/Compare/PWM modules |
| Configurable Logic Cell (CLC) | Yes |
| XLP Sleep Current | Sub-microamp deep-sleep |
| Plage de température de fonctionnement | -40 C to +125 C (Extended, -E suffix) |
| Boîtier | 28-pin SPDIP (Skinny DIP) |
| Type de montage | Through-Hole |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC24FV16KM202-E/SP
| Broche 1 | MCLR — Master Clear (reset) input |
| Broche 2 | RA0 — Port A bit 0 / analog input |
| Broche 3 | RA1 — Port A bit 1 / analog input |
| Broche 4 | RB0 — Port B bit 0 |
| Broche 5 | RB1 — Port B bit 1 |
| Broche 6 | RB2 — Port B bit 2 |
| Broche 7 | RB3 — Port B bit 3 |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1 — Crystal oscillator input |
| Broche 10 | OSC2 — Crystal oscillator output |
| Broche 11 | VDD — Positive supply voltage |
| Broche 12 | VSS — Ground reference |
| Broche 13 | RB4 — Port B bit 4 |
| Broche 14 | RB5 — Port B bit 5 |
| Broche 15 | RB6 — Port B bit 6 / programming clock |
| Broche 16 | RB7 — Port B bit 7 / programming data |
| Broche 17 | RA2 — Port A bit 2 / analog input |
| Broche 18 | RA3 — Port A bit 3 / analog input |
| Broche 19 | RA4 — Port A bit 4 |
| Broche 20 | RA5 — Port A bit 5 |
| Broche 21 | RC0 — Port C bit 0 |
| Broche 22 | RC1 — Port C bit 1 |
| Broche 23 | RC2 — Port C bit 2 |
| Broche 24 | RC3 — Port C bit 3 |
| Broche 25 | RC4 — Port C bit 4 |
| Broche 26 | RC5 — Port C bit 5 |
| Broche 27 | RC6 — Port C bit 6 |
| Broche 28 | RC7 — Port C bit 7 |
Applications typiques
PIC24FV16KM202-E/SP convient pour 6 applications: Portable Medical Monitoring, Battery-Powered IoT Sensor Node, Industrial Sensor Conditioning, Consumer Wearable Health Device, Low-Power Wireless Remote Control, Smart Home Sensor Hub.
Portable Medical Monitoring
The PIC24FV16KM202-E/SP's XLP architecture delivers sub-uA deep-sleep current while the integrated 12-bit ADC, 8-bit DAC, and on-chip op amps condition analog signals from biopotential or temperature sensors. According to the manufacturer datasheet, the 32 MHz core sustains 16 MIPS throughput, enough for heart-rate or SpO2 signal-processing algorithms. Operating from a CR2032 cell at 3V with the V-variant wide-voltage tolerance, the design can run for years on a single coin cell while streaming samples over UART to a host BLE module.
Recommandé
Battery-Powered IoT Sensor Node
Sub-microamp XLP sleep current, integrated CLC, and 12-bit ADC make the PIC24FV16KM202-E/SP ideal for periodic sensor sampling in wireless IoT nodes. The device wakes from deep-sleep via RTCC, performs an ADC conversion, transmits over UART/SPI to an external transceiver, and returns to sleep - duty cycling conserves total energy. The 16KB Flash stores application firmware and boot loader for OTA update via SPI, while the wide 2.5V-5V VDD tolerates multi-cell battery packs and harvested sources.
Recommandé
Industrial Sensor Conditioning
On-chip operational amplifiers, comparators, and 8-bit DAC eliminate external analog front-end cost in 4-20 mA loop-powered industrial sensors. The PIC24FV16KM202-E/SP's 5V-tolerant V-variant I/O interfaces directly with legacy 5V industrial backplanes while XLP modes reduce loop-current drain during idle. The 12-bit ADC with up to 500 ksps throughput handles RTD, thermistor, and bridge-sensor signal chains at production-line sampling rates.
Recommandé
Consumer Wearable Health Device
The PIC24FV16KM202-E/SP's integrated analog chain (op amps, 12-bit ADC, 8-bit DAC) drives PPG, ECG, or skin-conductance front-ends in fitness bands and smart watches. According to the manufacturer datasheet, XLP deep-sleep drops consumption below 1 uA, allowing weeks of standby between charges. The 28-SPDIP package supports breadboard prototyping before migration to the SSOP variant for volume manufacturing.
Recommandé
Low-Power Wireless Remote Control
The Configurable Logic Cell and Capture/Compare/PWM modules on PIC24FV16KM202-E/SP simplify IR or sub-GHz remote-control transmitter design without external glue logic. The 32 MHz core generates precise PWM carriers and encodes data while XLP sleep keeps quiescent current below 1 uA when no key is pressed. The V-variant tolerates both 3V coin cells and 5V USB-charged Li-ion chemistries, allowing the same firmware across battery and rechargeable designs.
Recommandé
Smart Home Sensor Hub
The PIC24FV16KM202-E/SP's UART/SPI/I2C interfaces connect to multiple sensor front-ends (temperature, humidity, motion) and aggregate data for upload to a home automation gateway. The 16KB Flash and 2KB RAM store protocol stacks (Zigbee-Bridge, Thread, or proprietary RF) while the integrated CLC implements hardware wake-up logic from GPIO events. XLP current profiles let battery-powered window/door sensors run for over five years on a single CR123A cell.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FV16KM202-E/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24F16KM202-I/SP | PIC24FV16KM202-E/SS | PIC24FV08KM202-E/SO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SPDIP (same) | 28-SSOP (different) | 28-SOIC (different) |
| Program Memory | 16 KB | 16 KB | 16 KB | 8 KB |
| Data RAM | 2 KB | 2 KB | 2 KB | 1 KB |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.5V / 3.3V / 5V | 2.0V - 3.6V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V |
| Operating Temperature | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +125 C (E grade) |
| Integrated Op Amps | Yes | Yes | Yes | Yes |
| Configurable Logic Cell | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Extended temperature grade (-40 C to +125 C) versus standard industrial (-40 C to +85 C) (vs PIC24F16KM202-I/SP)
- Wide-voltage V-variant tolerates 2.5V, 3.3V, and 5V rails in a single part (vs PIC24F16KM202-I/SP)
- 16 KB of Flash doubles the program-memory headroom versus the KM102 sibling (vs PIC24FV08KM202-E/SO)
Notes de conception
Estimated: At VDD=3.3V, 32 MHz active, the PIC24FV16KM202-E/SP consumes approximately 6-8 mA active and below 1 uA in deep-sleep with RTCC retention per the manufacturer datasheet. Use MCP1700 or MCP1702 LDO for <2 uA quiescent supply. Enable XLP deep-sleep whenever possible and configure unused peripherals as off to minimize dynamic current. Wake via RTCC, IOC, or external interrupt for duty-cycled applications.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to the VDD/VSS pin pair (pins 11/12 in 28-SPDIP). Add a bulk 1-10 uF tantalum or ceramic cap on the same rail. Keep the crystal oscillator traces short and symmetric; place the crystal within 5 mm of the OSC1/OSC2 pins to minimize EMI. Route analog and digital signals in separate zones to avoid crosstalk into the ADC inputs.
Do not leave unused I/O pins floating - configure them as outputs low to eliminate input-leakage paths that can corrupt sleep-current measurements. The MCLR pin must have a 10 kohm pull-up to VDD for normal operation; a floating MCLR will trigger spurious resets. Always configure the PWRTE fuse (Power-up Timer Enable) for deterministic startup in noisy industrial environments. When migrating between temperature grades, verify ADC offset calibration is valid across the new operating range.
Informations de conformité
RoHS compliant per Microchip product page. The -E temperature grade is suitable for industrial but is NOT AEC-Q100 automotive qualified; consult Microchip automotive-grade part numbers for vehicle applications.
