PIC24HJ128GP306A-E/MR - 16-bit 40MIPS 128KB Flash MCU | Microchip
部品番号: PIC24HJ128GP306A-E/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.1 | $11.10 |
| 10 | $9.99 | $99.90 |
| 100 | $8.75 | $875.00 |
| 500 | $7.42 | $3,710.00 |
| 1,000 | $6.5 | $6,500.00 |
PIC24HJ128GP306A-E/MR 概要
A 16-bit microcontroller is a single-chip computer whose data path, registers and ALU are 16 bits wide; PIC24H devices in particular use a modified Harvard architecture with a 24-bit instruction word and a 16-bit data path, sitting in the product hierarchy 8-bit MCU (PIC16/PIC18) -> 16-bit MCU (PIC24) -> 16-bit DSC (dsPIC33) -> 32-bit MCU (PIC32). The PIC24HJ128GP306A is pin-compatible with the dsPIC33F family and offers seamless migration paths to PIC24F, dsPIC30F and dsPIC33F devices, which simplifies both upward (more peripherals / DSP) and downward (lower power) migrations on the same PCB footprint.
Key features include a 40 MIPS execution speed from a 40 MHz oscillator with PLL, hardware multiplier for single-cycle MAC operations, and an enhanced CAN 2.0B module for automotive networking. The 64-pin VQFN (MR) variant offers an exposed thermal pad for improved heat dissipation in space-constrained automotive modules and industrial drives. Code security via program memory write protection and a unique device ID support anti-cloning, while the built-in 16-bit PWM with up to 9 outputs simplifies three-phase motor control and digital power conversion.
Typical applications include automotive body and chassis ECUs, BLDC/PMSM motor drives, industrial control PLCs, sensorless field-oriented motor control, and high-speed digital signal conditioning. The combination of CAN, ample RAM and 12-bit ADC sample-and-hold makes it a strong fit for mechatronic subsystems that must meet AEC-Q100 stress tests.
When designing with this device, follow the datasheet recommended decoupling scheme (100 nF on each VDD/VSS pair plus a bulk 10 µF) and use the exposed pad as the primary ground and thermal path; this part is supplied only in tube packaging per the manufacturer designation (-E = extended temp, /MR = VQFN-64).
ドロップイン代替品: PIC24HJ128GP306A-E/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24HJ128GP306A-E/MR （同一形状・フットプリント） — 相違点: Package, ADC, Maximum CPU Speed, Operating Temperature, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
PIC24HJ128GP306A-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.24 / 個
データシートを見る →PIC24HJ256GP306A-E/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33FJ128GP306A-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.2 / 個
データシートを見る →dsPIC33FJ128MC306A-E/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC24HJ128GP306A-E/MR 最大定格＆電気的特性
| Device Family | PIC24H 16-bit MCU |
| Core Architecture | 16-bit modified Harvard |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 16 KB |
| Maximum CPU Speed | 40 MIPS at 40 MHz |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| 動作温度 | -40 °C to +125 °C (Extended) |
| パッケージ | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Digital I/O Pins | 53 |
| ADC | 16-channel, 10/12-bit |
| Communication | 2x UART, 2x SPI, 1x I2C, 1x ECAN 2.0B |
| PWM Outputs | Up to 9 (16-bit) |
| AEC-Q100 | Qualified |
| RoHS ステータス | Compliant |
| Container Type | Tube |
| 実装タイプ | Surface Mount |
PIC24HJ128GP306A-E/MR 64-pin vqfn (9x9 mm) with exposed thermal pad ピン配置ガイド
PIC24HJ128GP306A-E/MR (64-pin vqfn (9x9 mm) with exposed thermal pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC24HJ128GP306A-E/MR.
詳細は データシート をご参照ください。
主な用途
PIC24HJ128GP306A-E/MR の用途: 6 件s: Automotive Body Control Modules (BCM), BLDC / PMSM Motor Drives, Industrial Sensor Conditioning & PLCs, Automotive Sensor Clusters (CAN Nodes), Switch-Mode Power Supply Digital Control, Medical Patient Monitoring Sub-Systems.
Automotive Body Control Modules (BCM)
The PIC24HJ128GP306A-E/MR fits automotive BCM designs thanks to its AEC-Q100 Grade 1 qualification, -40 to +125 °C extended temperature, and 40 MIPS core that services LIN/CAN bus traffic plus body-domain logic. Its 53 digital I/O pins drive LED arrays, door-lock actuators, and wiper relays; the 16-channel 12-bit ADC reads multiplexed switch and sensor inputs at >200 ksps. Built-in ECAN 2.0B handles chassis-CAN messages at 1 Mbit/s without an external transceiver's MCU traffic. The 64-pin VQFN with exposed pad keeps the PCB compact while maintaining Theta-JA near 24 °C/W under hood-compartment ambient, so the BCM stays within automotive thermal budgets without a heatsink.
おすすめ
BLDC / PMSM Motor Drives
The PIC24HJ128GP306A-E/MR is well suited to BLDC and PMSM motor control up to several hundred watts. The 40 MIPS core runs 8 kHz current loops with margin for sensorless back-EMF estimators or Hall-sensor decoding, while the 16-bit PWM module with up to 9 outputs and programmable dead time directly drives a three-phase inverter through gate drivers. The 16-channel 12-bit ADC samples phase currents within the PWM cycle, enabling tight torque control. The exposed-pad VQFN package dissipates the MCU's ~300 mW easily in a sealed drive housing, and AEC-Q100 qualification supports underhood or chassis mounting. Migration to dsPIC33FJ128MC306A-E/MR adds DSP throughput if sensorless FOC is added later.
おすすめ
Industrial Sensor Conditioning & PLCs
Use the PIC24HJ128GP306A-E/MR in industrial PLCs and analog-front-end conditioning boards where 16-bit control loops and high-resolution sensing matter. The 12-bit ADC (with optional 10-bit mode for faster conversion) supports 4-20 mA loop conditioning and RTD / thermocouple cold-junction compensation via the on-chip voltage reference. Its 53 I/Os interface to optocouplers, relays, and HMI displays; ECAN and SPI provide fast backplane links. Running at 40 MIPS the MCU executes IEC 61131-3 logic and PID loops in <2 ms with margin for safety diagnostics. The 64-pin VQFN footprint fits compact PLC slices, and PIC24H to dsPIC33F migration preserves firmware libraries when DSP is added.
おすすめ
Automotive Sensor Clusters (CAN Nodes)
The PIC24HJ128GP306A-E/MR excels as a low-cost CAN sensor node for radar pre-processors, suspension accelerometers, and tire-pressure monitoring transmitter receivers. The 40 MIPS core handles sensor fusion and CRC-protected CAN frame transmission at 500 kbit/s, while the 16 KB RAM buffers outgoing telemetry. With 128 KB Flash, OEMs can implement CANopen or J1939 stacks alongside signal-processing routines. The exposed-pad VQFN dissipates the device's ~250 mW with the PCB ground copper, suitable for sealed IP6K7 enclosures. AEC-Q100 Grade 1 qualification permits deployment in chassis or wheel-well zones where ambient reaches +125 °C.
おすすめ
Switch-Mode Power Supply Digital Control
The PIC24HJ128GP306A-E/MR is a strong candidate for digitally-controlled AC-DC or DC-DC converters where a 16-bit MCU replaces analog PWM controllers. Its 9 PWM outputs at 16-bit resolution and 8 ns PWM duty-cycle granularity regulate multi-rail telecom or industrial power supplies, while the 12-bit ADC samples output voltage and current for voltage-mode / current-mode control loops. High-speed ADC triggering tied to the PWM timer achieves sub-microsecond loop delay, approaching analog controller bandwidth. The 3.0-3.6 V supply can be derived from an internal housekeeping rail; AEC-Q100 qualification supports EV-charging auxiliary supplies.
おすすめ
Medical Patient Monitoring Sub-Systems
In medical sub-systems - infusion pumps, portable pulse oximeters, and bedside monitor front-ends - the PIC24HJ128GP306A-E/MR offers enough MIPS and RAM to run sensor conditioning and a lightweight display stack. The 12-bit ADC reads pulse-oximetry photodiode currents with software IIR filtering; the PWM outputs drive audible alarms with precision; and the SPI links to a graphics OLED or color TFT driver. AEC-Q100 qualification is incidental here but signals robust silicon screening that benefits medical reliability programs. Note: this part is not FDA-recognized for life-support; pair with appropriate isolation and watchdogs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24HJ128GP306A-E/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24HJ128GP306A-I/MR | PIC24HJ256GP306A-E/MR | dsPIC33FJ128GP306A-E/MR | dsPIC33FJ128MC306A-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9 mm) with exposed pad | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same |
| Program Memory (Flash) | 128 KB | 128 KB - same | 256 KB (+100%) | 128 KB - same | 128 KB - same |
| RAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same |
| Maximum CPU Speed | 40 MIPS | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same |
| Operating Temperature | -40 °C to +125 °C (Extended, AEC-Q100) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same |
| DSP Engine | No (PIC24H MCU core only) | No | No | Yes (DSP engine + single-cycle MAC) | Yes (DSP engine + motor-control PWM) |
| Automotive Grade (AEC-Q100) | Yes (Grade 1) | No (industrial only) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
主な差別化要因
- AEC-Q100 Grade 1 qualified in compact VQFN （vs PIC24HJ128GP306A-I/MR)
- Automotive-grade same-footprint memory upgrade path （vs PIC24HJ256GP306A-E/MR)
- Direct upgrade path to DSP without PCB rework （vs dsPIC33FJ128GP306A-E/MR)
設計ノート
Estimated: total power at 40 MIPS full peripheral load is approximately 70 mW (VDD 3.3 V × I_DD 22 mA typical). Place a 10 µF bulk tantalum or ceramic near the VDD pins and a 0.1 µF X7R ceramic on every VDD/VSS pair, within 3 mm of the lead, per the Microchip PIC24H hardware design checklist. Use a ferrite bead on AVDD if analog and digital supplies share the rail, with a separate 0.1 µF + 10 µF decoupling pair on AVDD and AVSS to preserve ADC SNR.
Estimated: thermal resistance Theta-JA of the 64-pin VQFN (MR) on a JEDEC EIA/JESD51 2s2p test board is approximately 24 °C/W. At 70 mW dissipation the junction rises only ~2 °C above ambient, so no heatsink is needed. Solder the exposed thermal pad to a continuous ground copper pour - this is also the primary electrical ground reference - with 0.3 mm-diameter thermal vias on a 1.2 mm grid under the pad for improved spreading.
Place a low-ESR 4.7 µF to 22 µF bulk capacitor within 5 mm of VDD to absorb inrush during Flash programming. Keep the analog and digital sections of the PCB isolated with separate ground returns that join at a single point near the exposed pad. Route the 40 MHz crystal traces symmetrically within 3 mm of the MCU, with a ground guard ring, and avoid routing high-current switching lines under the crystal.
Configuration bits must be set correctly to enable the PLL and select the primary oscillator before the C runtime initializes; otherwise the MCU may execute at 10 MHz or fail to start at all. The exposed pad is not a no-connect - leaving it floating violates electrical specifications and causes thermal derating. On the ECAN module, ensure the CANI/O pins are reconfigured as digital inputs when CAN is unused to avoid parasitic current draw.
コンプライアンス情報
AEC-Q100 Grade 1 qualified per Microchip product page. RoHS and REACH compliant. Lead-free reflow profile per JEDEC J-STD-020. Halogen-free status not verified from web data - confirm with Microchip environmental declarations.
