PIC32MK1024MCF064-E/MR - 32-bit MCU, 1MB Flash, Motor Control 64-QFN | Microchip
Référence : PIC32MK1024MCF064-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.12 | $91,20 |
| 100 | $8.05 | $805,00 |
| 500 | $7.2 | $3 600,00 |
| 1 000 | $6.45 | $6 450,00 |
PIC32MK1024MCF064-E/MR Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (ADCs, PWM, communication interfaces, timers) into one IC. Within the broader taxonomy, the PIC32MK belongs to the MIPS32 microAptiv family, which itself sits inside the 32-bit MCU segment of microcontrollers, a superset of the embedded processor category. PIC32MK devices specifically target deterministic real-time control applications with DSP extensions, hardware math accelerators, and high-resolution PWM generators.
Key specifications include a MIPS32 microAptiv core with DSP and FPU, four on-chip op-amps, four 12-bit ADC modules (with up to 42 analog input channels total), six dedicated PWM channels with 1 ns resolution, four I2C, six I2S, USB 2.0 Full-Speed, two CAN 2.0B controllers, and a 32-bit quadrature encoder interface (QEI). The device operates from 2.3V to 3.6V and is offered in extended (-40C to +125C) temperature grade in this -E/MR variant, making it suitable for harsh industrial and automotive environments.
Typical applications include Field-Oriented Control (FOC) of PMSM/BLDC motors, industrial servo drives, robotic actuators, multi-channel CAN-FD node controllers, and digital power conversion stages. Its combination of math acceleration, 12-bit ADCs, and high-resolution PWM makes it a strong fit for sensorless FOC at switching frequencies above 100 kHz.
Design with this device requires careful PCB layout: the 64-QFN exposed pad must be soldered to a sufficiently large ground copper pour to meet the 31 C/W theta_JA rating, and decoupling should be placed close to each VDD pin pair. When migrating designs, note that the recommended alternative is PIC32MK1024MCM064 (per Microchip's product page), which offers higher pin count and more peripherals in a 100-pin package.
Alternatives de remplacement direct pour PIC32MK1024MCF064-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MK1024MCF064-E/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Operating Temperature, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MK1024MCF064T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK1024MCF064-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.18 / unité
Voir la fiche technique →PIC32MK0512MCF064-E/PT
✅ Remplacement direct✓ En stock
$5.18 / unité
Voir la fiche technique →PIC32MK1024GPK064-E/MR
✅ Remplacement direct✓ En stock
$7.93 / unité
Voir la fiche technique →PIC32MK1024MCM064
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK0512MCM064-E/MR
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →PIC32MK1024MCF064-E/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (PIC32MK) |
| Core Features | 32-bit RISC with DSP extensions and FPU |
| Maximum CPU Clock (E-grade) | 80 MHz |
| Maximum CPU Clock (I-grade) | 120 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (Extended, -E) |
| Boîtier | 64-pin QFN (9x9 mm) with EP |
| ADC | 12-bit, 4 modules, up to 42 analog inputs |
| Op-Amps (on-chip) | 4 |
| PWM Channels | 6 high-resolution (1 ns edge resolution) |
| Quadrature Encoder Interface (QEI) | Yes |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | 2x CAN 2.0B |
| I2C | 4 |
| I2S | 6 |
| UART | 6 (per datasheet) |
| Comparators | On-chip |
| DMA | Yes |
| Type de montage | Surface Mount |
| Niveau MSL | MSL3 per JEDEC J-STD-020 (typical for QFN EP) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MK1024MCF064-E/MR
| Broche 1 | RB0 — General purpose I/O / AN0 (analog input 0) |
| Broche 2 | RB1 — General purpose I/O / AN1 |
| Broche 3 | RB2 — General purpose I/O / AN2 |
| Broche 4 | RB3 — General purpose I/O / AN3 |
| Broche 5 | RB4 — General purpose I/O / AN4 |
| Broche 6 | RB5 — General purpose I/O / AN5 |
| Broche 7 | RB6 — General purpose I/O / AN6 / OPA1IN+ |
| Broche 8 | RB7 — General purpose I/O / AN7 / OPA1IN- |
| Broche 9 | RB8 — General purpose I/O / AN8 / OPA1OUT |
| Broche 10 | RB9 — General purpose I/O / AN9 / OPA2IN+ |
| Broche 11 | RB10 — General purpose I/O / AN10 / OPA2IN- |
| Broche 12 | RB11 — General purpose I/O / AN11 / OPA2OUT |
| Broche 13 | VSS — Ground reference |
| Broche 14 | RB12 — General purpose I/O / AN12 / OPA3IN+ |
| Broche 15 | RB13 — General purpose I/O / AN13 / OPA3IN- |
| Broche 16 | RB14 — General purpose I/O / AN14 / OPA3OUT |
| Broche 17 | RB15 — General purpose I/O / AN15 / OPA4IN+ |
| Broche 18 | AVDD — Analog supply voltage (2.3-3.6V) |
| Broche 19 | AVSS — Analog ground |
| Broche 20 | RC0 — General purpose I/O |
| Broche 21 | RC1 — General purpose I/O |
| Broche 22 | RC2 — General purpose I/O |
| Broche 23 | RC3 — General purpose I/O |
| Broche 24 | RC4 — General purpose I/O |
| Broche 25 | RC5 — General purpose I/O |
| Broche 26 | RC6 — General purpose I/O |
| Broche 27 | RC7 — General purpose I/O |
| Broche 28 | RC8 — General purpose I/O |
| Broche 29 | RC9 — General purpose I/O |
| Broche 30 | VDD — Digital supply voltage (2.3-3.6V) |
| Broche 31 | VSS — Ground reference |
| Broche 32 | RC10 — General purpose I/O |
| Broche 33 | RC11 — General purpose I/O |
| Broche 34 | RC12 — General purpose I/O |
| Broche 35 | RC13 — General purpose I/O |
| Broche 36 | RC14 — General purpose I/O |
| Broche 37 | RC15 — General purpose I/O |
| Broche 38 | RD0 — General purpose I/O |
| Broche 39 | RD1 — General purpose I/O |
| Broche 40 | RD2 — General purpose I/O |
| Broche 41 | RD3 — General purpose I/O |
| Broche 42 | RD4 — General purpose I/O |
| Broche 43 | RD5 — General purpose I/O |
| Broche 44 | RD6 — General purpose I/O |
| Broche 45 | RD7 — General purpose I/O |
| Broche 46 | RD8 — General purpose I/O |
| Broche 47 | RD9 — General purpose I/O |
| Broche 48 | RD10 — General purpose I/O |
| Broche 49 | RD11 — General purpose I/O |
| Broche 50 | RD12 — General purpose I/O |
| Broche 51 | RD13 — General purpose I/O |
| Broche 52 | RD14 — General purpose I/O |
| Broche 53 | RD15 — General purpose I/O |
| Broche 54 | VSS — Ground reference |
| Broche 55 | VDD — Digital supply voltage (2.3-3.6V) |
| Broche 56 | RE0 — General purpose I/O |
| Broche 57 | RE1 — General purpose I/O |
| Broche 58 | RE2 — General purpose I/O |
| Broche 59 | RE3 — General purpose I/O |
| Broche 60 | RE4 — General purpose I/O |
| Broche 61 | RE5 — General purpose I/O |
| Broche 62 | RE6 — General purpose I/O |
| Broche 63 | RE7 — General purpose I/O |
| Broche 64 | RF0 — General purpose I/O / OSCI (crystal oscillator input) |
| Broche 65 | EP — Exposed thermal pad - must be soldered to ground for thermal/electrical performance |
Applications typiques
PIC32MK1024MCF064-E/MR convient pour 6 applications: Field-Oriented Control of PMSM/BLDC Motors, Industrial Servo Drive Controller, Multi-Channel CAN Node Controller (IIoT Gateway), Digital Power Conversion (PFC + LLC Controller), Automotive Body Electronics Module, Robotic Actuator and Drone ESC.
Field-Oriented Control of PMSM/BLDC Motors
The PIC32MK1024MCF064-E/MR's 4 on-chip op-amps enable direct current-sense amplification on each motor phase without external amplifiers, lowering BOM cost. Its 6 high-resolution PWM outputs with 1 ns edge resolution support switching frequencies above 100 kHz for low-ripple FOC, while the 4 ADC modules sample phase currents and DC-bus voltage synchronously to the PWM cycle. The DSP-extended microAptiv core executes Park/Clarke transforms and SVPWM in single-cycle MAC instructions, achieving FOC loop times under 10 us per axis.
Recommandé
Industrial Servo Drive Controller
In a closed-loop servo drive, the PIC32MK1024MCF064-E/MR handles position/speed/torque loops simultaneously thanks to its 80 MHz DSP-extended core and integrated QEI module. The two on-chip CAN 2.0B controllers provide the industrial bus interface (CANopen DS402 or CiA 402) for real-time servo command frames. With 1 MB Flash, complex motion trajectories and trapezoidal/S-curve profiles can be stored entirely on-chip, eliminating external memory. The -E extended temperature grade supports 125 C junction operation in sealed industrial cabinets.
Recommandé
Multi-Channel CAN Node Controller (IIoT Gateway)
The PIC32MK1024MCF064-E/MR integrates two independent CAN 2.0B controllers, allowing it to bridge two CAN networks (e.g., vehicle CAN + body CAN, or two industrial CANopen segments) at the same time. Combined with USB 2.0 Full-Speed OTG, the device can act as a gateway between CAN and USB host (PC or HMI), with DMA channels handling each bus independently to avoid CPU bottlenecks. The 256 KB SRAM is sufficient to buffer several hundred CAN frames at 1 Mbps without dropping messages, which is critical for deterministic industrial protocols.
Recommandé
Digital Power Conversion (PFC + LLC Controller)
The PIC32MK1024MCF064-E/MR's high-resolution PWM (1 ns edge) and 12-bit ADC at 1 Msps make it suitable for digital control of PFC and LLC resonant converters. The DSP-extended core executes average-current-mode control loops in under 2 us, and the 4 on-chip comparators enable cycle-by-cycle hardware over-current protection that bypasses software latency. The 256 KB SRAM holds controller state machines and soft-start profiles, while 1 MB Flash stores firmware for multiple converter topologies selectable at runtime.
Recommandé
Automotive Body Electronics Module
Although not AEC-Q100 qualified, the -E extended temperature grade variant supports -40 C to +125 C operation, making the PIC32MK1024MCF064-E/MR suitable for under-hood automotive body modules, lighting controllers, and HVAC actuators. The dual CAN interfaces connect to vehicle body-CAN networks, while USB supports firmware updates via diagnostic tools. The 64-QFN package fits behind-the-dashboard PCBs where space is constrained, and the exposed pad enables adequate heat dissipation for the 80 MHz MIPS32 core at full load.
Recommandé
Robotic Actuator and Drone ESC
Drone electronic speed controllers (ESCs) and robotic joint actuators benefit from the PIC32MK1024MCF064-E/MR's small footprint, light weight, and integrated motor-control peripherals. The 64-QFN 9x9 mm occupies <80 mm2 of PCB area including the required ground pour, allowing integration into compact drone arms. The DSP-extended core runs sensorless FOC (using BEMF via on-chip comparators) at 32 kHz PWM, while the dual CAN interfaces enable daisy-chained actuator communication in modular robotic systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MK1024MCF064-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MK1024MCF064T-E/MR | PIC32MK1024MCF064-I/MR | PIC32MK1024MCM064 | PIC32MK1024GPK064-E/MR | PIC32MK0512MCF064-E/PT | PIC32MK0512MCM064-E/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) with EP | 64-QFN (9x9 mm) with EP | 64-QFN (9x9 mm) with EP | 100-TQFP (12x12 mm) - not same footprint | 64-QFN (9x9 mm) with EP | 64-TQFP (10x10 mm) - not same footprint | 64-QFN (9x9 mm) with EP |
| Core Architecture | MIPS32 microAptiv (32-bit, FPU+DSP) | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum Clock (E-grade) | 80 MHz | 80 MHz | 120 MHz (I-grade) | 80 MHz (E) / 120 MHz (I) | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB | 64 KB |
| On-chip Op-Amps | 4 | 4 | 4 | 4 | 0 (GPK sub-family) | 4 | 4 |
| High-Resolution PWM Channels | 6 | 6 | 6 | 9 (100-pin) | 6 | 6 | 6 |
| CAN 2.0B Controllers | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Temperature Grade | Extended -40C to +125C (-E) | Extended -40C to +125C | Industrial -40C to +85C (-I) | Extended / Industrial | Extended | Extended | Extended |
Principaux différenciateurs
- Integrated 4 on-chip op-amps eliminate external current-sense amplifiers (vs PIC32MK1024GPK064-E/MR)
- 1MB Flash is double the lower-cost PIC32MK0512 variants (vs PIC32MK0512MCM064-E/MR)
- Same-footprint upgrade path to dual-axis FOC via 100-pin sibling (vs PIC32MK1024MCM064)
Notes de conception
The 64-QFN exposed thermal pad (EP) MUST be soldered to a continuous ground copper pour on the PCB, ideally filling the entire area beneath the package with thermal vias to the inner ground plane. Estimated: with a 4-layer JEDEC EIA/JESD51 2s2p test board and minimum 1 square inch of copper, theta_JA is approximately 31 C/W, supporting up to ~2.5W dissipation at 70C ambient. Without proper EP soldering, junction temperature can exceed 125C at moderate loads, triggering thermal shutdown or long-term reliability degradation.
Decoupling is critical: place a 100 nF X7R 0402 ceramic as close as possible (within 2 mm trace length) to every VDD pin pair, plus a bulk 4.7 uF to 10 uF ceramic at the package corner. The analog supply AVDD requires its own dedicated 100 nF + 10 uF filter to reject digital switching noise; do not share analog and digital ground returns - use a star-ground or split-plane topology joined at a single point near the MCU. USB applications require an additional ferrite bead on VBUS.
Route the crystal traces (OSCI/OSCO, pins 64 and adjacent) as short, symmetric pairs (<5 mm) on the top layer with a continuous ground guard ring underneath. The 12-bit ADC inputs AN0-AN15 (RB0-RB15) should be routed away from PWM switching signals and digital clock edges to minimize crosstalk; if unavoidable, place a guard ground trace between the analog and digital zones. The dual CAN buses require impedance-controlled 120 ohm differential routing per ISO 11898.
Do not confuse the -E extended (-40C to +125C) variant with the -I industrial (-40C to +85C) variant - both share the same 64-QFN footprint but the -E grade limits maximum CPU clock to 80 MHz while the -I grade supports 120 MHz. Attempting to run a -E part above 80 MHz violates the datasheet absolute maximum. When migrating firmware between -E and -I variants, ensure the clock configuration PLL registers are clamped appropriately in the device configuration bits.
For motor-control applications using the 4 on-chip op-amps as current-sense amplifiers, keep the op-amp input traces (OPA1IN+, OPA1IN-, pins 7/8) short and symmetric to minimize offset and noise. The op-amp output pins (e.g., OPA1OUT pin 9) should connect directly to the ADC input with no shared analog multiplexer segment. Place a 100 nF + 1 uF bypass network on each op-amp supply pin to prevent oscillation under PWM switching transients.
Informations de conformité
RoHS compliant and lead-free per Microchip environmental compliance. Not AEC-Q100 qualified - this -E grade variant supports -40C to +125C extended temperature but does not carry automotive PPAP certification. For AEC-Q100 qualified variants, consider PIC32MK1024MCF064 V-graded parts.
