PIC32MK1024MCF064-E/MR - 32-bit MCU, 1MB Flash, Motor Control 64-QFN | Microchip
N.º da peça: PIC32MK1024MCF064-E/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.12 | $91,20 |
| 100 | $8.05 | $805,00 |
| 500 | $7.2 | $3.600,00 |
| 1.000 | $6.45 | $6.450,00 |
PIC32MK1024MCF064-E/MR Visão geral
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (ADCs, PWM, communication interfaces, timers) into one IC. Within the broader taxonomy, the PIC32MK belongs to the MIPS32 microAptiv family, which itself sits inside the 32-bit MCU segment of microcontrollers, a superset of the embedded processor category. PIC32MK devices specifically target deterministic real-time control applications with DSP extensions, hardware math accelerators, and high-resolution PWM generators.
Key specifications include a MIPS32 microAptiv core with DSP and FPU, four on-chip op-amps, four 12-bit ADC modules (with up to 42 analog input channels total), six dedicated PWM channels with 1 ns resolution, four I2C, six I2S, USB 2.0 Full-Speed, two CAN 2.0B controllers, and a 32-bit quadrature encoder interface (QEI). The device operates from 2.3V to 3.6V and is offered in extended (-40C to +125C) temperature grade in this -E/MR variant, making it suitable for harsh industrial and automotive environments.
Typical applications include Field-Oriented Control (FOC) of PMSM/BLDC motors, industrial servo drives, robotic actuators, multi-channel CAN-FD node controllers, and digital power conversion stages. Its combination of math acceleration, 12-bit ADCs, and high-resolution PWM makes it a strong fit for sensorless FOC at switching frequencies above 100 kHz.
Design with this device requires careful PCB layout: the 64-QFN exposed pad must be soldered to a sufficiently large ground copper pour to meet the 31 C/W theta_JA rating, and decoupling should be placed close to each VDD pin pair. When migrating designs, note that the recommended alternative is PIC32MK1024MCM064 (per Microchip's product page), which offers higher pin count and more peripherals in a 100-pin package.
Alternativas drop-in para PIC32MK1024MCF064-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MK1024MCF064-E/MR (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Operating Temperature, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MK1024MCF064T-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MK1024MCF064-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.18 / unidade
Ver ficha técnica →PIC32MK0512MCF064-E/PT
✅ Drop-In✓ Em estoque
$5.18 / unidade
Ver ficha técnica →PIC32MK1024GPK064-E/MR
✅ Drop-In✓ Em estoque
$7.93 / unidade
Ver ficha técnica →PIC32MK1024MCM064
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MK0512MCM064-E/MR
✅ Drop-In✓ Em estoque
$5.95 / unidade
Ver ficha técnica →PIC32MK1024MCF064-E/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (PIC32MK) |
| Core Features | 32-bit RISC with DSP extensions and FPU |
| Maximum CPU Clock (E-grade) | 80 MHz |
| Maximum CPU Clock (I-grade) | 120 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Temperatura de operação | -40 C to +125 C (Extended, -E) |
| Encapsulamento | 64-pin QFN (9x9 mm) with EP |
| ADC | 12-bit, 4 modules, up to 42 analog inputs |
| Op-Amps (on-chip) | 4 |
| PWM Channels | 6 high-resolution (1 ns edge resolution) |
| Quadrature Encoder Interface (QEI) | Yes |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | 2x CAN 2.0B |
| I2C | 4 |
| I2S | 6 |
| UART | 6 (per datasheet) |
| Comparators | On-chip |
| DMA | Yes |
| Tipo de montagem | Surface Mount |
| Nível MSL | MSL3 per JEDEC J-STD-020 (typical for QFN EP) |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MK1024MCF064-E/MR
| Pino 1 | RB0 — General purpose I/O / AN0 (analog input 0) |
| Pino 2 | RB1 — General purpose I/O / AN1 |
| Pino 3 | RB2 — General purpose I/O / AN2 |
| Pino 4 | RB3 — General purpose I/O / AN3 |
| Pino 5 | RB4 — General purpose I/O / AN4 |
| Pino 6 | RB5 — General purpose I/O / AN5 |
| Pino 7 | RB6 — General purpose I/O / AN6 / OPA1IN+ |
| Pino 8 | RB7 — General purpose I/O / AN7 / OPA1IN- |
| Pino 9 | RB8 — General purpose I/O / AN8 / OPA1OUT |
| Pino 10 | RB9 — General purpose I/O / AN9 / OPA2IN+ |
| Pino 11 | RB10 — General purpose I/O / AN10 / OPA2IN- |
| Pino 12 | RB11 — General purpose I/O / AN11 / OPA2OUT |
| Pino 13 | VSS — Ground reference |
| Pino 14 | RB12 — General purpose I/O / AN12 / OPA3IN+ |
| Pino 15 | RB13 — General purpose I/O / AN13 / OPA3IN- |
| Pino 16 | RB14 — General purpose I/O / AN14 / OPA3OUT |
| Pino 17 | RB15 — General purpose I/O / AN15 / OPA4IN+ |
| Pino 18 | AVDD — Analog supply voltage (2.3-3.6V) |
| Pino 19 | AVSS — Analog ground |
| Pino 20 | RC0 — General purpose I/O |
| Pino 21 | RC1 — General purpose I/O |
| Pino 22 | RC2 — General purpose I/O |
| Pino 23 | RC3 — General purpose I/O |
| Pino 24 | RC4 — General purpose I/O |
| Pino 25 | RC5 — General purpose I/O |
| Pino 26 | RC6 — General purpose I/O |
| Pino 27 | RC7 — General purpose I/O |
| Pino 28 | RC8 — General purpose I/O |
| Pino 29 | RC9 — General purpose I/O |
| Pino 30 | VDD — Digital supply voltage (2.3-3.6V) |
| Pino 31 | VSS — Ground reference |
| Pino 32 | RC10 — General purpose I/O |
| Pino 33 | RC11 — General purpose I/O |
| Pino 34 | RC12 — General purpose I/O |
| Pino 35 | RC13 — General purpose I/O |
| Pino 36 | RC14 — General purpose I/O |
| Pino 37 | RC15 — General purpose I/O |
| Pino 38 | RD0 — General purpose I/O |
| Pino 39 | RD1 — General purpose I/O |
| Pino 40 | RD2 — General purpose I/O |
| Pino 41 | RD3 — General purpose I/O |
| Pino 42 | RD4 — General purpose I/O |
| Pino 43 | RD5 — General purpose I/O |
| Pino 44 | RD6 — General purpose I/O |
| Pino 45 | RD7 — General purpose I/O |
| Pino 46 | RD8 — General purpose I/O |
| Pino 47 | RD9 — General purpose I/O |
| Pino 48 | RD10 — General purpose I/O |
| Pino 49 | RD11 — General purpose I/O |
| Pino 50 | RD12 — General purpose I/O |
| Pino 51 | RD13 — General purpose I/O |
| Pino 52 | RD14 — General purpose I/O |
| Pino 53 | RD15 — General purpose I/O |
| Pino 54 | VSS — Ground reference |
| Pino 55 | VDD — Digital supply voltage (2.3-3.6V) |
| Pino 56 | RE0 — General purpose I/O |
| Pino 57 | RE1 — General purpose I/O |
| Pino 58 | RE2 — General purpose I/O |
| Pino 59 | RE3 — General purpose I/O |
| Pino 60 | RE4 — General purpose I/O |
| Pino 61 | RE5 — General purpose I/O |
| Pino 62 | RE6 — General purpose I/O |
| Pino 63 | RE7 — General purpose I/O |
| Pino 64 | RF0 — General purpose I/O / OSCI (crystal oscillator input) |
| Pino 65 | EP — Exposed thermal pad - must be soldered to ground for thermal/electrical performance |
Aplicações típicas
PIC32MK1024MCF064-E/MR é adequado para 6 aplicaçãos: Field-Oriented Control of PMSM/BLDC Motors, Industrial Servo Drive Controller, Multi-Channel CAN Node Controller (IIoT Gateway), Digital Power Conversion (PFC + LLC Controller), Automotive Body Electronics Module, Robotic Actuator and Drone ESC.
Field-Oriented Control of PMSM/BLDC Motors
The PIC32MK1024MCF064-E/MR's 4 on-chip op-amps enable direct current-sense amplification on each motor phase without external amplifiers, lowering BOM cost. Its 6 high-resolution PWM outputs with 1 ns edge resolution support switching frequencies above 100 kHz for low-ripple FOC, while the 4 ADC modules sample phase currents and DC-bus voltage synchronously to the PWM cycle. The DSP-extended microAptiv core executes Park/Clarke transforms and SVPWM in single-cycle MAC instructions, achieving FOC loop times under 10 us per axis.
Recomendado
Industrial Servo Drive Controller
In a closed-loop servo drive, the PIC32MK1024MCF064-E/MR handles position/speed/torque loops simultaneously thanks to its 80 MHz DSP-extended core and integrated QEI module. The two on-chip CAN 2.0B controllers provide the industrial bus interface (CANopen DS402 or CiA 402) for real-time servo command frames. With 1 MB Flash, complex motion trajectories and trapezoidal/S-curve profiles can be stored entirely on-chip, eliminating external memory. The -E extended temperature grade supports 125 C junction operation in sealed industrial cabinets.
Recomendado
Multi-Channel CAN Node Controller (IIoT Gateway)
The PIC32MK1024MCF064-E/MR integrates two independent CAN 2.0B controllers, allowing it to bridge two CAN networks (e.g., vehicle CAN + body CAN, or two industrial CANopen segments) at the same time. Combined with USB 2.0 Full-Speed OTG, the device can act as a gateway between CAN and USB host (PC or HMI), with DMA channels handling each bus independently to avoid CPU bottlenecks. The 256 KB SRAM is sufficient to buffer several hundred CAN frames at 1 Mbps without dropping messages, which is critical for deterministic industrial protocols.
Recomendado
Digital Power Conversion (PFC + LLC Controller)
The PIC32MK1024MCF064-E/MR's high-resolution PWM (1 ns edge) and 12-bit ADC at 1 Msps make it suitable for digital control of PFC and LLC resonant converters. The DSP-extended core executes average-current-mode control loops in under 2 us, and the 4 on-chip comparators enable cycle-by-cycle hardware over-current protection that bypasses software latency. The 256 KB SRAM holds controller state machines and soft-start profiles, while 1 MB Flash stores firmware for multiple converter topologies selectable at runtime.
Recomendado
Automotive Body Electronics Module
Although not AEC-Q100 qualified, the -E extended temperature grade variant supports -40 C to +125 C operation, making the PIC32MK1024MCF064-E/MR suitable for under-hood automotive body modules, lighting controllers, and HVAC actuators. The dual CAN interfaces connect to vehicle body-CAN networks, while USB supports firmware updates via diagnostic tools. The 64-QFN package fits behind-the-dashboard PCBs where space is constrained, and the exposed pad enables adequate heat dissipation for the 80 MHz MIPS32 core at full load.
Recomendado
Robotic Actuator and Drone ESC
Drone electronic speed controllers (ESCs) and robotic joint actuators benefit from the PIC32MK1024MCF064-E/MR's small footprint, light weight, and integrated motor-control peripherals. The 64-QFN 9x9 mm occupies <80 mm2 of PCB area including the required ground pour, allowing integration into compact drone arms. The DSP-extended core runs sensorless FOC (using BEMF via on-chip comparators) at 32 kHz PWM, while the dual CAN interfaces enable daisy-chained actuator communication in modular robotic systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MK1024MCF064-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MK1024MCF064T-E/MR | PIC32MK1024MCF064-I/MR | PIC32MK1024MCM064 | PIC32MK1024GPK064-E/MR | PIC32MK0512MCF064-E/PT | PIC32MK0512MCM064-E/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) with EP | 64-QFN (9x9 mm) with EP | 64-QFN (9x9 mm) with EP | 100-TQFP (12x12 mm) - not same footprint | 64-QFN (9x9 mm) with EP | 64-TQFP (10x10 mm) - not same footprint | 64-QFN (9x9 mm) with EP |
| Core Architecture | MIPS32 microAptiv (32-bit, FPU+DSP) | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum Clock (E-grade) | 80 MHz | 80 MHz | 120 MHz (I-grade) | 80 MHz (E) / 120 MHz (I) | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB | 64 KB |
| On-chip Op-Amps | 4 | 4 | 4 | 4 | 0 (GPK sub-family) | 4 | 4 |
| High-Resolution PWM Channels | 6 | 6 | 6 | 9 (100-pin) | 6 | 6 | 6 |
| CAN 2.0B Controllers | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Temperature Grade | Extended -40C to +125C (-E) | Extended -40C to +125C | Industrial -40C to +85C (-I) | Extended / Industrial | Extended | Extended | Extended |
Principais diferenciais
- Integrated 4 on-chip op-amps eliminate external current-sense amplifiers (vs PIC32MK1024GPK064-E/MR)
- 1MB Flash is double the lower-cost PIC32MK0512 variants (vs PIC32MK0512MCM064-E/MR)
- Same-footprint upgrade path to dual-axis FOC via 100-pin sibling (vs PIC32MK1024MCM064)
Notas de projeto
The 64-QFN exposed thermal pad (EP) MUST be soldered to a continuous ground copper pour on the PCB, ideally filling the entire area beneath the package with thermal vias to the inner ground plane. Estimated: with a 4-layer JEDEC EIA/JESD51 2s2p test board and minimum 1 square inch of copper, theta_JA is approximately 31 C/W, supporting up to ~2.5W dissipation at 70C ambient. Without proper EP soldering, junction temperature can exceed 125C at moderate loads, triggering thermal shutdown or long-term reliability degradation.
Decoupling is critical: place a 100 nF X7R 0402 ceramic as close as possible (within 2 mm trace length) to every VDD pin pair, plus a bulk 4.7 uF to 10 uF ceramic at the package corner. The analog supply AVDD requires its own dedicated 100 nF + 10 uF filter to reject digital switching noise; do not share analog and digital ground returns - use a star-ground or split-plane topology joined at a single point near the MCU. USB applications require an additional ferrite bead on VBUS.
Route the crystal traces (OSCI/OSCO, pins 64 and adjacent) as short, symmetric pairs (<5 mm) on the top layer with a continuous ground guard ring underneath. The 12-bit ADC inputs AN0-AN15 (RB0-RB15) should be routed away from PWM switching signals and digital clock edges to minimize crosstalk; if unavoidable, place a guard ground trace between the analog and digital zones. The dual CAN buses require impedance-controlled 120 ohm differential routing per ISO 11898.
Do not confuse the -E extended (-40C to +125C) variant with the -I industrial (-40C to +85C) variant - both share the same 64-QFN footprint but the -E grade limits maximum CPU clock to 80 MHz while the -I grade supports 120 MHz. Attempting to run a -E part above 80 MHz violates the datasheet absolute maximum. When migrating firmware between -E and -I variants, ensure the clock configuration PLL registers are clamped appropriately in the device configuration bits.
For motor-control applications using the 4 on-chip op-amps as current-sense amplifiers, keep the op-amp input traces (OPA1IN+, OPA1IN-, pins 7/8) short and symmetric to minimize offset and noise. The op-amp output pins (e.g., OPA1OUT pin 9) should connect directly to the ADC input with no shared analog multiplexer segment. Place a 100 nF + 1 uF bypass network on each op-amp supply pin to prevent oscillation under PWM switching transients.
Informações de conformidade
RoHS compliant and lead-free per Microchip environmental compliance. Not AEC-Q100 qualified - this -E grade variant supports -40C to +125C extended temperature but does not carry automotive PPAP certification. For AEC-Q100 qualified variants, consider PIC32MK1024MCF064 V-graded parts.
