PIC32MM0064GPM036-I/M2 - 64KB Flash 32-bit MCU w/ USB | Microchip
Référence : PIC32MM0064GPM036-I/M2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.69 | $1,69 |
| 10 | $1.52 | $15,20 |
| 100 | $1.31 | $131,00 |
| 500 | $1.13 | $565,00 |
| 1 000 | $1.03 | $1 030,00 |
PIC32MM0064GPM036-I/M2 Présentation
A 32-bit microcontroller (MCU) is an embedded processing device built around a 32-bit data path, enabling single-instruction execution on values wider than 8/16-bit MCUs. Within the broader taxonomy, the PIC32MM sits under MIPS32 microAptiv -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The 'MM' family is Microchip's most cost-effective and lowest-power 32-bit PIC branch, optimized for battery-powered consumer, IoT, and industrial sensor nodes.
Key differentiating features include 79 CoreMark performance, hardware ECC on Flash for memory integrity, 4-channel DMA, two I2C, three SPI, and five UART peripherals, plus a USB 2.0 Full-Speed interface. A peripheral pin select (PPS) mapping block simplifies board routing by remapping digital functions to most I/O pins, and the device supports microMIPS compressed instructions for higher code density.
The PIC32MM0064GPM036-I/M2 uses a pipelined MIPS32 microAptiv UC core with hardware multiply/divide, a single-cycle 32-bit ALU, and a tightly-coupled memory subsystem. The 64 KB ECC Flash with single-error correction and double-error detection ensures reliable code storage in industrial environments, and sleep currents in the microampere range suit coin-cell and energy-harvesting designs.
Typical applications include low-power IoT sensor nodes, USB human-interface devices (HID), consumer wearables with capacitive touch, industrial sensor hubs, and battery-powered measurement instruments. The integrated USB makes the device especially well-suited to HID peripherals, CDC virtual COM ports, and low-bandwidth device classes.
When designing with the PIC32MM0064GPM036-I/M2, plan for a 10 uF + 0.1 uF decoupling pair on each VDD pin and a solid ground plane beneath the exposed thermal pad to dissipate switching current during USB enumeration. Use MPLAB X IDE with XC32 compiler for development.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison parameters, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MM0064GPM036-I/M2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MM0064GPM036-I/M2 (même facteur de forme et même empreinte) — différant par ADC, Communication Interfaces, Data Bus Width, Operating Temperature Range, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MM0064GPM036T-I/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0064GPM036-E/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0256GPM036-I/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0064GPL036-I/M2
✅ Remplacement direct✓ En stock
$1.65 / unité
Voir la fiche technique →PIC32MM0064GPM028-I/M6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0032GPL036-I/M2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0064GPM036-I/M2 Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv UC |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash w/ ECC |
| RAM Size | 16 KB |
| Tension d'alimentation de fonctionnement | 2.0 V to 3.6 V |
| Supply Voltage (max) | 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Number of I/O Pins | 27 |
| Package Type | 36-pin SQFN (6x6 mm) w/ exposed pad |
| USB Interface | USB 2.0 Full-Speed Device |
| DMA Channels | 4 |
| CoreMark Score | 79 |
| Instruction Set Support | microMIPS compressed + MIPS32 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (per Microchip product page) |
Configuration des broches de PIC32MM0064GPM036-I/M2
| Broche 1 | RB15 — General-purpose I/O / PPS-capable |
| Broche 2 | RB14 — General-purpose I/O / PPS-capable |
| Broche 3 | RB13 — General-purpose I/O / PPS-capable |
| Broche 4 | RB12 — General-purpose I/O / PPS-capable |
| Broche 5 | RB11 — General-purpose I/O / PPS-capable |
| Broche 6 | RB10 — General-purpose I/O / PPS-capable |
| Broche 7 | RB9 — General-purpose I/O / PPS-capable |
| Broche 8 | RB8 — General-purpose I/O / PPS-capable |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VDD — Core supply voltage 2.0-3.6V |
| Broche 11 | RB7 — General-purpose I/O / PPS-capable |
| Broche 12 | RB6 — General-purpose I/O / PPS-capable |
| Broche 13 | RB5 — General-purpose I/O / PPS-capable |
| Broche 14 | RB4 — General-purpose I/O / PPS-capable |
| Broche 15 | RB3 — General-purpose I/O / PPS-capable |
| Broche 16 | RB2 — General-purpose I/O / PPS-capable |
| Broche 17 | RB1 — General-purpose I/O / PPS-capable |
| Broche 18 | RB0 — General-purpose I/O / PPS-capable |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Core supply voltage 2.0-3.6V |
| Broche 21 | RA7 — General-purpose I/O / PPS-capable |
| Broche 22 | RA6 — General-purpose I/O / PPS-capable |
| Broche 23 | RA5 — General-purpose I/O / PPS-capable |
| Broche 24 | RA4 — General-purpose I/O / PPS-capable |
| Broche 25 | RA3 — General-purpose I/O / PPS-capable |
| Broche 26 | RA2 — General-purpose I/O / PPS-capable |
| Broche 27 | RA1 — General-purpose I/O / PPS-capable |
| Broche 28 | RA0 — General-purpose I/O / PPS-capable |
| Broche 29 | VSS — Ground reference |
| Broche 30 | VDD — Core supply voltage 2.0-3.6V |
| Broche 31 | D+ — USB Full-Speed data plus |
| Broche 32 | D- — USB Full-Speed data minus |
| Broche 33 | VBUS — USB VBUS detect input |
| Broche 34 | PGED2 — Programming/debug data line (alternate) |
| Broche 35 | PGEC2 — Programming/debug clock line (alternate) |
| Broche 36 | EP — Exposed thermal pad (must be soldered to PCB ground) |
Applications typiques
PIC32MM0064GPM036-I/M2 convient pour 7 applications: USB Human Interface Devices (HID), Low-Power IoT Sensor Nodes, Industrial Sensor Hubs, Consumer Wearables with Touch Sensing, Battery-Powered Measurement Instruments, Educational and Hobbyist Development, Smart Home Edge Controllers.
USB Human Interface Devices (HID)
The PIC32MM0064GPM036-I/M2 is purpose-built for USB 2.0 Full-Speed device applications including keyboards, mice, game controllers, and custom HID peripherals. Its integrated USB transceiver eliminates external PHY components, while 64 KB ECC Flash hosts the USB stack plus application firmware. At 25 MHz the device comfortably enumerates at Full-Speed (12 Mbps) and handles HID reports with low latency. Designers should route D+/D- as a 90-ohm differential pair, place a 1uF VBUS decoupling cap near the connector, and use the USB internal pull-up on D+ to signal connect. Compared to an external PHY plus 8-bit MCU solution, this single-chip approach reduces BOM cost and PCB footprint by roughly 40%.
Recommandé
Low-Power IoT Sensor Nodes
The PIC32MM0064GPM036-I/M2's microAptiv UC core, microMIPS code compression, and deep-sleep currents in the low-microampere range make it ideal for battery-powered IoT sensor nodes on coin cells or harvested energy. 64 KB ECC Flash stores application + wireless stack segments, 16 KB SRAM supports sensor data buffering, and 27 GPIO pins interface multiple I2C/SPI sensors. The integrated ADC digitises analogue sensor outputs directly. Use MPLAB Harmony for a configurable framework and consider duty-cycling the core at 1% active to extend battery life to multiple years.
Recommandé
Industrial Sensor Hubs
The PIC32MM0064GPM036-I/M2 -40C to +85C industrial temperature range, 64 KB ECC Flash, and 12-bit ADC suit it for industrial sensor aggregation nodes that interface multiple analogue and digital sensors. Its 4-channel DMA offloads data movement so the CPU can focus on protocol processing, while the wide peripheral set (I2C, SPI, UART) supports simultaneous sensor links. The ECC Flash maintains data integrity in electrically noisy industrial cabinets. For harsh-environment deployments use the -E temperature grade variant or add external TVS protection on field wiring.
Recommandé
Consumer Wearables with Touch Sensing
Wearable devices such as fitness bands, watches, and remote controls benefit from the PIC32MM0064GPM036-I/M2's peripheral pin select flexibility, low-power sleep modes, and integrated 12-bit ADC for sensor fusion. The microMIPS compressed instruction set enables complex UI logic in 64 KB Flash, while the USB port supports charging and data sync on the same connector. Peripheral pin select simplifies the routing of capacitive touch and display driver signals. Consider pairing with an external power-management IC for Li-ion charging and a low-power BLE radio for connectivity.
Recommandé
Battery-Powered Measurement Instruments
Handheld multimeters, data loggers, and portable test instruments benefit from the PIC32MM0064GPM036-I/M2's combination of low operating power, 64 KB ECC Flash for calibration tables and UI strings, and 12-bit ADC for sensor input. The USB interface provides PC connectivity for data export and field firmware update. DMA-driven ADC sampling leaves CPU cycles free for display and button debounce. Use the on-chip comparators for threshold detection and the 16-bit timers for accurate event timing.
Recommandé
Educational and Hobbyist Development
The PIC32MM0064GPM036-I/M2's MPLAB X IDE support, free XC32 compiler, and Microchip's vast application-note library make it an excellent learning platform for 32-bit MCU concepts. The 64 KB Flash supports meaningful projects (USB MIDI controller, simple data logger), while the SQFN-36 package is manageable for breakout boards. Curiosity or PIC32MM development boards from Microchip provide solderless prototyping. The USB HID example projects are particularly popular as a first project.
Recommandé
Smart Home Edge Controllers
Smart-home devices (Zigbee/BLE bridges, sensor hubs, USB-C powered controllers) benefit from the PIC32MM0064GPM036-I/M2's USB connectivity for local commissioning and the ECC protection on Flash to maintain OTA-update integrity. Its low-power modes keep standby power below regulatory thresholds, and the 27 I/O pins support multiple switches, indicators, and external radio modules. The DMA engine manages simultaneous sensor polling without CPU intervention.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MM0064GPM036-I/M2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MM0064GPM036T-I/M2 | PIC32MM0064GPM036-E/M2 | PIC32MM0256GPM036-I/M2 | PIC32MM0064GPL036-I/M2 | PIC32MM0064GPM028-I/M6 | PIC32MM0032GPL036-I/M2 |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin SQFN (6x6) - M2 | 36-pin SQFN (6x6) - M2 (T&R) | 36-pin SQFN (6x6) - M2 | 36-pin SQFN (6x6) - M2 | 36-pin SQFN (6x6) - M2 | 28-pin SQFN - M6 | 36-pin SQFN (6x6) - M2 |
| Flash Size | 64 KB ECC | 64 KB ECC | 64 KB ECC | 256 KB ECC (+300%) | 64 KB (no ECC) | 64 KB ECC | 32 KB (no ECC, -50%) |
| RAM Size | 16 KB | 16 KB | 16 KB | 32 KB (+100%) | 8 KB (-50%) | 16 KB | 8 KB (-50%) |
| USB 2.0 FS | Yes | Yes | Yes | Yes | No | Yes | No |
| ECC on Flash | Yes | Yes | Yes | Yes | No | Yes | No |
| Core Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| I/O Count | 27 | 27 | 27 | 27 | 27 | 21 (-22%) | 27 |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed with ECC Flash (vs PIC32MM0064GPL036-I/M2)
- Upward migration to 256 KB Flash on same package (vs PIC32MM0032GPL036-I/M2)
- 27 GPIO via Peripheral Pin Select (vs PIC32MM0064GPM028-I/M6)
Notes de conception
Each VDD pin (10, 20, 30 on this SQFN-36) requires its own 10 uF bulk + 0.1 uF ceramic decoupling pair placed within 2 mm of the pin. The exposed thermal pad (pin 36) must be soldered to a continuous PCB ground plane to provide both thermal dissipation and a low-inductance ground return for high-speed USB signalling. For USB applications, ensure the 3.3 V rail meets the USB 2.0 specification of 3.0-3.6 V under load, since suspend current limits of 500 uA are tight.
Estimated: At 25 MHz active CPU and USB enumeration, the device dissipates approximately 50 mW. The SQFN-36 6x6 mm with the exposed pad soldered to a 1 sq-in 1-oz copper pour has a theta-JA of approximately 40 C/W, giving a junction temperature rise of only 2 C above ambient - well within the 85 C industrial limit. In enclosed USB-powered enclosures with poor airflow, monitor ambient temperature to avoid exceeding the -I suffix operating range.
Route the USB D+ / D- pair as an impedance-controlled 90-ohm differential with no splits and matched lengths within 150 mils. Place the ESD protection (such as USBLC6-2SC6) as close to the USB connector as possible, before the ferrite bead. The PGECx/PGEDx programming pins need a 4.7 kohm pull-up on PGECx if using ICSP; leave test points accessible in production designs.
Do not assume that all PIC32MM parts have USB - the GPL sub-family lacks it. Always confirm the prefix (GPM/GPL) before selecting. The peripheral pin select (PPS) registers must be unlocked and re-locked per the procedure in the family datasheet; missing this step causes peripherals to fail silently. Finally, the EC field must be configured when using Flash ECC - if ECC errors are not handled the controller can trap on multi-bit errors.
Keep the 32.768 kHz external crystal (if used for RTCC) within a few mm of the SOSCO/SOSCI pins with a guarded ground ring to minimise capacitive coupling into the crystal traces. Avoid routing switching signals across the crystal area, and place the crystal loading capacitors adjacent to the crystal pins. For 25 MHz HS system clocks, follow the same rule - short traces, ground guard.
Informations de conformité
RoHS and lead-free confirmed per Microchip product page. AEC-Q100 not qualified - consider PIC32MK family for automotive. Halogen-free status not explicitly stated in verified web data.
